Studies on the Interfacial Reaction of Screen-Printed Sn-37Pb, Sn-3.5Ag and Sn-3.8Ag-0.7Cu Solder Bumps on Ni/Au and OSP finished PCB |
Nah, Hae-Woong
(Department of Materials Sci. & Eng., Korea Advanced Institute of Science and Technology)
Son, Ho-Young (Department of Materials Sci. & Eng., Korea Advanced Institute of Science and Technology) Paik, Kyung-Wook (Department of Materials Sci. & Eng., Korea Advanced Institute of Science and Technology) Kim, Won-Hoe (Circuit R&D Center, Samsung Elecrto-Mechaics Co. LTD) Hur, Ki-Rok (Package Team, MicroScale Co.LTD) |
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