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Effect of PCB Surface Finishs on Intermetallic Compound Growth Kinetics of Sn-3.0Ag-0.5Cu Solder Bump  

Jeong, Myeong-Hyeok (School of Materials Science and Engineering, Andong National University)
Kim, Jae-Myeong (School of Materials Science and Engineering, Andong National University)
Yoo, Se-Hoon (Korea Institute of Industrial Technology, Micro-Joining Center)
Lee, Chang-Woo (Korea Institute of Industrial Technology, Micro-Joining Center)
Park, Young-Bae (School of Materials Science and Engineering, Andong National University)
Publication Information
Journal of the Microelectronics and Packaging Society / v.17, no.1, 2010 , pp. 81-88 More about this Journal
Abstract
Thermal annealing and electromigration test were performed at $150^{\circ}C$ and $4{\times}10^3\;A/cm^2$ conditions in order to investigate the effect of PCB surface finishs on the growth kinetics of intermetallic compound (IMC) in Sn-3.0Ag-0.5Cu solder bump. The surface finishes of the electrodes of printed circuit board (PCB) were organic solderability preservation (OSP), immersion Sn, and electroless Ni/immersion gold (ENIG). During thermal annealing, the OSP and immersion Sn show similar IMC growth velocity, while ENIG surface finish had much slower IMC growth velocity. Applying electric current accelerated IMC growth velocity and showed polarity effect due to directional electron flow.
Keywords
SAC305; OSP; Immersion Sn; ENIG; Intermetallic compound;
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Times Cited By KSCI : 4  (Citation Analysis)
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