• Journal of the Optical Society of Korea
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• v.1 no.1
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• pp.44-47
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• 1997

The integration of a GaAs/AlGaAs multi-quantum well electroabsorption modulator and a tapered waveguide vertical direction optical interconnect has been performed without the complicated regrowth process. Zn impurity-induced layer disordering of MQW layer is used to achieve the energy transfer between SQW and MQW regions. Light coupled into a SQW region was transferred to an MQW region and an intensity modulation of 10 dB extinction ratio was demonstrated.

• JSTS:Journal of Semiconductor Technology and Science
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• v.12 no.3
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• pp.370-376
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• 2012

In this work, design considerations for high-performance silicon photodetector are thoroughly investi- gated. Besides the critical dimensions of device, guidelines for process architecture are suggested. Abiding by those criteria for improving both direct-current (DC) and alternating-current (AC) perfor- mances, a high-speed low-operation power silicon photodetector based on p-i-n structure for optical interconnect has been designed by device simulation. An $f_{-3dB}$ of 80 GHz at an operating voltage of 1 V was obtained.

• Proceedings of the Optical Society of Korea Conference
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• 2005.07a
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• pp.188-189
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• 2005

• Journal of the Institute of Electronics and Information Engineers
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• v.51 no.11
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• pp.83-93
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• 2014

It is a widespread concern that electrical interconnection based network-on-chip (NoC) will ultimately face the limitation in communication bandwidth, transmission latency and power consumption in the near future. With the development of silicon photonics technology, a hybrid optical network-on-chip (HONoC) which embraces both electrical- and optical interconnect, is emerging as a promising solution to overcome these problems. Today's leading edge systems-on-chips (SoCs) comprise heterogeneous many-cores for higher energy efficiency, therefore, extended study beyond regular topology based NoC is required. This paper proposes an energy and latency optimization topology design technique for HONoC taking into account the traffic characteristics of target applications. The proposed technique is implemented with genetic algorithm and simulation results show the reduction by 13.84% in power loss and 28.14% in average latency, respectively.

• Journal of the Optical Society of Korea
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• v.12 no.4
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• pp.217-220
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• 2008

An optical receiver using a CMOS-compatible avalanche photodetector (CMOS-APD) is demonstrated. The CMOS-APD is fabricated with $0.18{\mu}m$ standard CMOS technology and the optical receiver is implemented by using the CMOS-APD and a transimpedance amplifier on a board. The optical receiver can detect 6.25-Gb/s data with the help of the series inductive peaking effect.

• Proceedings of the Polymer Society of Korea Conference
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• 2006.10a
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• pp.13-14
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• 2006

The use of soft-lithography instead of standard photolithography and dry etching technologies is attractive because inexpensive optical device can be realized. Polymerization using multi-photon absorption of materials is also a good method for optical waveguide fabrication. Laser induced self-writing technology of optical waveguide is also very simple and attractive. Using these processes, we can fabricate and interconnect optical circuits at once. In this presentation, several simple fabrication methods will be introduced. New optical loss evaluation method for polymer optical waveguides will also be presented

• Proceedings of the Optical Society of Korea Conference
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• 2001.02a
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• pp.32-33
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• 2001

근거리 통신망에서 데이터 전송량이 매우 증가함에 따라 근거리 통신에도 광통신을 적용하려는 연구가 활발히 진행 중이다. 광통신을 근거리 통신에 적용하려는 분야로는 랜, 댁내 망 (home network), 광 연결 (optical interconnect), 광 클럭 분배 (optical clock distribution) 등이 있다 그 중에 댁내 망의 경우 플라스틱 광섬유 (plastic optical fiber)를 이용하여 가정 내에 광통신을 적용하려는 연구가 진행 중이다. (중략)

• Journal of the Optical Society of Korea
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• v.7 no.1
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• pp.1-6
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• 2003

Integration and miniaturization at the systems level are key requirements for photonics applications. Here, we describe the concept of planar integration of free-space optical systems and its use as an optical interconnection technology. Two specific applications will be considered, a parallel chip-to-chip interconnect and an optical clock distribution network.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.14 no.8
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• pp.863-870
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• 2003

The digital transmission system entered in a RF region as digital system use IC chips of the speeder edge rate and clock speed nowadays. Optical path really was used in order to obtain the more capacity. In this paper, we described importance of electrical interconnect to get the signal integrity in optical module by simulation and experiment. 12 channel${\times}$2.5 G/ps optical parallel transmitter modules were manufactured by two different method ; access lines with microstrip and stripline type. We have clearly shown that the optical module adopting microstrip type with S$\sub$11/ $\geq$ -10 dB presents distortion but the optical module adopting stripline type with S$\sub$11/ $\leq$ : 15 dB obtains eye opening in 2.5 Gbis optical eye pattern response.

• ETRI Journal
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• v.34 no.1
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• pp.122-125
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• 2012

A video signal through a high-density optical link has been demonstrated to show the reliability of optical link for high-data-rate transmission. To reduce optical point-to-point links, an electrical link has been utilized for control and clock signaling. The latency and flicker with background noise occurred during the transferring of data across the optical link due to electrical-to-optical with optical-to-electrical conversions. The proposed synchronization technology combined with a flicker and denoising algorithm has given good results and can be applied in high-definition serial data interface (HD-SDI), ultra-HD-SDI, and HD multimedia interface transmission system applications.