• Journal of applied mathematics & informatics
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• v.18 no.1_2
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• pp.393-403
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• 2005

We study the isothermal flow of a dusty viscous incompressible conducting fluid between two types of boundary motions- oscillatory and non-oscillatory, under the influence of gravitational force. Within the frame work of some physically realistic approximations and suitable boundary conditions, closed form solutions were obtained for the velocity profiles and the skin friction of the particulate flow. These results show that for a constant pressure gradient, only the velocity profile of the fluid and the skin friction are unaffected by gravity, while magnetic field is seen to affect both the fluid, particle velocities and the skin friction. Thus, our results are extension of previous results in literature, and graphical demonstration of some these solutions have been presented.

• Journal of the Korean Society of Clothing and Textiles
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• v.21 no.8
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• pp.1387-1395
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• 1997

Effects of the ambient air temperature and the opening position on the pattern of the clothing ventilation of a thermal manikin wearing an impermeable blouse were investigated by the trace gas method. Under an isothermal condition, the ventilation was governed by diffusion, and the ventilation rate through the wrist-openings was greatly affected by the distance from the openings. Under non-isothermal conditions, however, the ventilation was accelerated by the convection driven by the temperature gradient between the clothing microclimate and the surrounding air; the greater the temperature gradient, the greater the ventilation. Even though it was certainly affected by the ambient air temperature, the ventilation rate was more significantly influenced by the position of openings. The ventilation patterns at the arm and the body were distinctive.

• Transactions of Materials Processing
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• v.5 no.1
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• pp.55-60
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• 1996

In the finite element analysis of metal forming processes the updated Lagrangian approach has been widely and effectively used to simulate the non-steady state problems. however some difficulties have arisen from abrupt flow change as in extrusion through square dies. In the present work an ALE(arbitrary Lagrangian-Euleria) finite element formulation for deforma-tion analysis are presented fro rigid-viscoplastic materials. The developed finite element program is applied to the isothermal analysis of square die extrusion of a square section. The computational results are compared with those by the updated Lagrangian finite element analysis.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2007.10a
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• pp.60-63
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• 2007

The effect of process parameters on springback of AZ31B magnesium alloy sheet was investigated by performing 2D draw bending test at the elevated temperatures. And also the springback characteristics were studied different blank holding forces between 30 to 250 kgf. Springback was considerably reduced at higher temperatures than $200^{\circ}C$. The blank holding force in the range used, however, had little influence on springback in isothermal tests. For a given temperature, springback decreased with increasing blank holding force in non-isothermal tests.

• Metals and materials international
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• v.24 no.6
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• pp.1293-1302
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• 2018

Nanocrystalline (NC) Ni electrodeposits (EDs) with a mean grain size of $34{\pm}12nm$ has been investigated, from room temperature to $800^{\circ}C$ under a purge gas of argon, by both non-isothermal and isothermal differential scanning calorimetry measurements, in combination with characterization of temperature-dependent microstructural evolution. A significant exothermic peak resulting from superimposition of recrystallization and surface oxidation occurs between 340 and $745^{\circ}C$ at a heating rate of $10^{\circ}C/min$ for the NC Ni EDs. The temperatures for recrystallization and oxidation increase with increasing the heating rate. In addition, recrystallization leads to a profound brittle-ductile transition of the Ni EDs in a narrow range around the peak temperature for the recrystallization.

• Journal of the Korean Society for Heat Treatment
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• v.35 no.5
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• pp.239-245
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• 2022

The purpose of this study is to evaluate the degree of microstructural change of materials using ultrasonic nonlinear parameters. For microstructure change, isothermal heat-treated ferritic 2.25Cr steel and low-cycle fatigue-damage copper alloy were prepared. The variation in ultrasonic nonlinearity was analyzed and evaluated through changes in hardness, ductile-brittle transition temperature, electron microscopy, and X-ray diffraction tests. Ultrasonic nonlinearity of 2.25Cr steel increased rapidly during the first 1,000 hours of deterioration and then gradually increased thereafter. The variation in non-linear parameters was shown to be coarsening of carbides and an increase in the volume fraction of stable M6C carbides during heat treatment. Due to the low-cycle fatigue deformation of oxygen-free copper, the dislocation that causes lattice deformation developed in the material, distorting the propagating ultrasonic waves, and causing an increase in the ultrasonic nonlinear parameters.

• Journal of Nuclear Fuel Cycle and Waste Technology(JNFCWT)
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• v.8 no.1
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• pp.65-70
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• 2010

The distillation rate on LiCl-KCl eutectic salt under different vacuums from 0.5-50 mmHg was first investigated by using both a non-isothermal and a isothermal thermogravimetric (TG) analysis. Based on the non-isothermal TG data, distillation rate equations as a function of the temperature could be derived. Calculated flux by these model flux equations was in agreement with the distillation rate obtained from isothermal TG analysis. A distillation rate of $10^{-4}-10^{-5}$ mole $cm^{-2}sec^{-1}$ is obtainable at temperatures less than 1300K and vacuums of 0.5-50 mmHg. About a 99% salt distillation efficiency was obtained after an hour at a temperature above 1150 K under 50 mmHg in a small scale distillation test system. An increase in the vaporizing surface area is relatively effective for removing residual salt in the remaining particles, when compared to that for the vaporizing time. Over 99.95% of total distillation efficiency was obtained for a 1-h distillation operation by increasing the inner surface area from $4.52cm^2$ to $12.56cm^2$.

• Journal of the Korean Society of Industry Convergence
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• v.4 no.3
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• pp.329-337
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• 2001

This simulator is developed for the analysis of a MOSFET based on Thermally Coupled Energy Transport Model(TCETM). The simulator has the ability to calculate not only stationary characteristics but also non - stationary characteristics of a MOSFET. It solves basic semiconductor devices equations including Possion equation, current continuity equations for electrons and holes, energy balance equation for electrons and heat flow equation, using finite difference method. The conventional semiconductor device simulation technique, based on the Drift-Diffusion Model (DDM), neglects the thermal and other energy-related properties of a miniaturized device. I, therefore, developed a simulator based on the Thermally Coupled Energy Transport Model (TCETM) which treats not only steady-state but also transient phenomena of such a small-size MOSFET. In particular, the present paper investigates the breakdown characteristics in transient conditions. As a result, we found that the breakdown voltage has been largely underestimated by the DDM in transient conditions.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.24 no.11
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• pp.1437-1446
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• 2000

A numerical analysis on the freeze coating process of a non-isothermal finite dimensional plate with a binary alloy is performed to investigate the growth and decay behavior of the solid and the mushy layer of the freeze coat and a complete procedure to calculate the process is obtained in this study. The continuously varying solid and mushy layers are immobilized by a coordinate transform and the resulting governing differential equations are solved by a finite difference technique. To account for the latent heat release and property change during solidification, proper phase change models are adopted. And the convection in the liquid melt is modeled as an appropriate heat transfer boundary condition at the liquid/mushy interface. The present results are compared with analytic solutions derived for the freeze coating of infinite dimensional plates and the discrepancy is found to be less than 0.5 percent in relative magnitude for all simulation cases. In addition the conservation of thermal energy is checked. The results show that the freeze coat grows proportional to the 1.2 square of axial position as predicted by analytic solutions ar first. But after the short period of initial growth, the growth rate of the freeze coat gradually decreases and finally the freeze coat starts to decay. The effects of various non-dimensional processing parameters on the behavior of freeze coat are also investigated.

• Journal of Welding and Joining
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• v.33 no.5
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• pp.41-46
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• 2015

The snap cure NCP(non-conducive paste) adhesive material is essentially required for the high productivity flip chip bonding process. In this study, the accessibility of DEA(dielectric analysis) method for the evaluation of snap cure behavior was investigated with comparison to the isothermal DSC(differential scanning calorimetry) method. NCP adhesive was mainly formulated with epoxy resin and imidazole curing agent. Even though there were some noise in the dielectric loss factor curve measured by DEA, the cure start and completion points could be specified clearly through the data processing of cumulation and deviation method. Degree of cure by DEA method which was measured from the variation of the dielectric loss factor of adhesive material was corresponded to about 80% of the degree of cure by DSC method which was measured from the heat of curing reaction. Because the adhesive joint cured to the degree of 80% in the view point of chemical reaction reveals the sufficient mechanical strength, DEA method is expected to be used effectively in the estimation of the high speed curing behavior of snap cure type NCP adhesive material for flip chip bonding.