Evaluation Method for Snap Cure Behavior of Non-conductive Paste for Flip Chip Bonding |
Min, Kyung-Eun
(Mechanical and Materials Engineering Department, Portland State University)
Lee, Jun-Sik (Welding & Joining R&D Group/Micro-joining Center, KITECH) Lee, So-Jeong (Welding & Joining R&D Group/Micro-joining Center, KITECH) Yi, Sung (Mechanical and Materials Engineering Department, Portland State University) Kim, Jun-Ki (Welding & Joining R&D Group/Micro-joining Center, KITECH) |
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