• 제목/요약/키워드: nitrogen passivation

검색결과 30건 처리시간 0.024초

원자층 증착법으로 형성된 Al2O3 박막의 질소 도핑에 따른 실리콘 표면의 부동화 특성 연구 (Study on the Passivation of Si Surface by Incorporation of Nitrogen in Al2O3 Thin Films Grown by Atomic Layer Deposition)

  • 홍희경;허재영
    • 마이크로전자및패키징학회지
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    • 제22권4호
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    • pp.111-115
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    • 2015
  • 실리콘 태양전지의 효율을 향상하기 위해서는 소수 캐리어의 높은 수명이 필수조건이다. 따라서, 이를 달성하기 위한 실리콘 표면결함을 없애줄 수 있는 부동화(passivation) 기술이 매우 중요하다. 일반적으로 PECVD 법이나 열산화 공정을 통해 얻어진 $SiO_2$ 박막이 부동화 층으로 많이 사용되나 1000도에 이르는 고온 공정과 낮은 열적 안정성이 문제로 여겨진다. 본 연구에서는 원자층 증착법을 이용하여 400도 미만의 저온 공정을 통해 $Al_2O_3$ 부동화 박막을 형성하였다. $Al_2O_3$ 박막은 고유의 음의 고정 전하밀도로 인해 낮은 표면 재결합속도를 보이는 것으로 알려져 있다. 본 연구에서는 질소 도핑을 통해 높은 음의 고정 전하 밀도를 얻고 이를 통해 좀 더 향상된 실리콘 표면 부동화 특성을 얻고자 하였다.

수소 Passivation에 따른 실리콘 나노결정 박막의 광학적 특성 변화 연구 (Effect of Hydrogen Passivation on the Photoluminescence of Si Nanocrystallites Thin Flms)

  • 전경아;김종훈;이상렬
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2001년도 하계학술대회 논문집
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    • pp.29-32
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    • 2001
  • Hydrogen passivation of Si nanocrystals identifies luminescence mechanism indirectly. Si nanocrystallites thin films on p-type (100) Si substrate have been fabricated by pulsed laser deposition technique using a Nd:YAG laser After deposition, Si nanocrystallites thin films have been annealed at 600$^{\circ}C$ and 760$^{\circ}C$ in nitrogen ambient, respectively. Hydrogen passivation was subsequently performed at 500$^{\circ}C$ in forming gas (95 % N$_2$ + 5 % H$_2$) for an 1 hour. We report the photoluminescnece(PL) property of Si thin films by the hydrogen passivation. The luminescence mechanism of Si nanocrystallites has also been investigated.

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Synergistic Effect of Nitrogen and Molybdenum on Localized Corrosion of Stainless Steels

  • Kim, Y.S.
    • Corrosion Science and Technology
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    • 제9권1호
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    • pp.20-28
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    • 2010
  • According to the bipolar model, ion selectivity of some species in the passive film is important factor to control the passivation. An increase of cation selectivity of outer layer of the passive film can stabilize the film and improves the corrosion resistance. Therefore, the formation and roles of ionic species in the passive film should be elucidated. In this work, two types of solution (hydrochloric or sulfuric acid) were used to test high N and Mo-bearing stainless steels. The objective of this work was to investigate the formation of oxyanions in the passive film and the roles of oxyanions in passivation of stainless steel. Nitrogen exists as atomic nitrogen, nitric oxide, nitro-oxyanions (${NO_x}^-$), and N-H species, not nitride in the passive film. Because of its high mobility, the enriched atomic nitrogen can act as a reservoir. The formation of N-H species buffers the film pH and facilitates the formation of oxyanions in the film. ${NO_x}^-$ species improve the cation selectivity of the film, increasing the oxide content and film density. ${NO_x}^-$ acts similar to a strong inhibitor both in the passive film and at active sites. This facilitates the formation of chromium oxide. Also, ${NO_x}^-$ can make more molybdate and nitric oxide by reacting with Mo. The role of Mo addition on the passivation characteristics of stainless steel may differ with the test environment. Mo exists as metallic molybdenum, molybdenum oxide, and molybdate and the latter facilitates the oxide formation. When nitrogen and molybdenum coexist in stainless steel, corrosion resistance in chloride solutions is drastically increased. This synergistic effect of N and Mo in a chloride solution is mainly due to the formation of nitro-oxyanions and molybdate ion. Oxyanions can be formed by a 'solid state reaction' in the passive film, resulting in the formation of more molybdate and nitric oxide. These oxyanions improve the cation selectivity of the outer layer and form more oxide and increase the amount of chromium oxide and the ratio of $Cr_2O_3/Cr(OH)_3$ and make the film stable and dense.

Rear Surface Passivation of Silicon Solar Cell with AlON Layer by Reactive Magnetron Sputtering

  • Moon, Sun-Woo;Kim, Eun-Kyeom;Park, Won-Woong;Kim, Kyung-Hoon;Kim, Sung-Min;Kim, Dong-Hwan;Han, Seung-Hee
    • 한국진공학회:학술대회논문집
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    • 한국진공학회 2012년도 제43회 하계 정기 학술대회 초록집
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    • pp.430-430
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    • 2012
  • The surface recombination velocity of the silicon solar cell could be reduced by passivation with insulating layers such as $SiO_2$, SiNx, $Al_2O_3$, a-Si. Especially, the aluminium oxide has advantages over other materials at rear surface, because negative fixed charge via Al vacancy has an additional back surface field effect (BSF). It can increase the lifetime of the hole carrier in p-type silicon. The aluminium oxide thin film layer is usually deposited by atomic layer deposition (ALD) technique, which is expensive and has low deposition rate. In this study, ICP-assisted reactive magnetron sputtering technique was adopted to overcome drawbacks of ALD technique. In addition, it has been known that by annealing aluminium oxide layer in nitrogen atmosphere, the negative fixed charge effect could be further improved. By using ICP-assisted reactive magnetron sputtering technique, oxygen to nitrogen ratio could be precisely controlled. Fabricated aluminium oxy-nitride (AlON) layer on silicon wafers were analyzed by x-ray photoelectron spectroscopy (XPS) to investigate the atomic concentration ratio and chemical states. The electrical properties of Al/($Al_2O_3$ or $SiO_2/Al_2O_3$)/Si (MIS) devices were characterized by the C-V measurement technique using HP 4284A. The detailed characteristics of the AlON passivation layer will be shown and discussed.

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Ar-N2 플라즈마가 Cu 표면에 미치는 구조적 특성 분석 (Structural Characteristics of Ar-N2 Plasma Treatment on Cu Surface)

  • 박해성;김사라은경
    • 마이크로전자및패키징학회지
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    • 제25권4호
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    • pp.75-81
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    • 2018
  • Cu-Cu 웨이퍼 본딩 강도를 향상시키기 위한 Cu 박막의 표면처리 기술로 $Ar-N_2$ 플라즈마 처리 공정에 대해 연구하였다. $Ar-N_2$ 플라즈마 처리가 Cu 표면의 구조적 특성에 미치는 영향을 X선 회절분석법, X선 광전자 분광법, 원자간력현미경을 이용하여 분석하였다. Ar 가스는 플라즈마 점화 및 이온 충격에 의한 Cu 표면의 활성화에 사용되고, $N_2$ 가스는 패시베이션(passivation) 층을 형성하여 -O 또는 -OH와 같은 오염으로부터 Cu 표면을 보호하기 위한 목적으로 사용되었다. Ar 분압이 높은 플라즈마로 처리한 시험편은 표면이 활성화되어 공정 이후 더 많은 산화가 진행되었고, $N_2$ 분압이 높은 플라즈마 시험편에서는 Cu-N 및 Cu-O-N과 같은 패시베이션 층과 함께 상대적으로 낮은 수치의 산화도가 관찰되었다. 본 연구에서는 $Ar-N_2$ 플라즈마 처리가 Cu 표면에서 Cu-O 형성 억제 반응에 기여하는 것을 확인할 수 있었으나 추가 연구를 통하여 질소 패시베이션 층이 Cu 웨이퍼 전면에 형성되기 위한 플라즈마 가스 분압 최적화를 진행하고자 한다.

후열처리에 따른 실리콘 나노결정 박막의 광학적 특성 변화 연구 (Annealing Effect on the Photoluminescence of Si Nanocrystallites Thin Films)

  • 전경아;김종훈;최진백;이상렬
    • 대한전기학회논문지:전기물성ㆍ응용부문C
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    • 제51권6호
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    • pp.236-239
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    • 2002
  • Si nanocrystallites thin films on P-type (100) Si substrate have been fabricated by pulsed laser deposition using a Nd:YAG laser. After deposition, samples were annealed in several environmental gases ;It the temperature range of 400 to $800^{\circ}C$ Hydrogen passivation was then performed in the forming gas (95 % $N_2$ + 5 % $H_2$) for 1 hr. Strong violet-indigo photoluminescence has been observed at room temperature on nitrogen ambient-annealed Si nanocrystallites. We report the variation of photoluminescence (PL) properties of Si thin films by changing annealing temperatures and by using hydrogen passivation. The results could suggest that the origin of violet-indigo PL should be related to the Quantum size effect of Si nanocrystallite.

플라즈마 산화방법을 이용한 질소가 첨가된 실리콘 산화막의 제조와 산화막 내의 질소가 박막트랜지스터의 특성에 미치는 영향 (Low-Temperature Growth of N-doped SiO2 Layer Using Inductively-Coupled Plasma Oxidation and Its Effect on the Characteristics of Thin Film Transistors)

  • 김보현;이승렬;안경민;강승모;양용호;안병태
    • 한국재료학회지
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    • 제19권1호
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    • pp.37-43
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    • 2009
  • Silicon dioxide as gate dielectrics was grown at $400^{\circ}C$ on a polycrystalline Si substrate by inductively coupled plasma oxidation using a mixture of $O_2$ and $N_2O$ to improve the performance of polycrystalline Si thin film transistors. In conventional high-temperature $N_2O$ annealing, nitrogen can be supplied to the $Si/SiO_2$ interface because a NO molecule can diffuse through the oxide. However, it was found that nitrogen cannot be supplied to the Si/$SiO_2$ interface by plasma oxidation as the $N_2O$ molecule is broken in the plasma and because a dense Si-N bond is formed at the $SiO_2$ surface, preventing further diffusion of nitrogen into the oxide. Nitrogen was added to the $Si/SiO_2$ interface by the plasma oxidation of mixtures of $O_2/N_2O$ gas, leading to an enhancement of the field effect mobility of polycrystalline Si TFTs due to the reduction in the number of trap densities at the interface and at the Si grain boundaries due to nitrogen passivation.

페로브스카이트 실내 광전변환 효율 향상을 위한 ethylenediamine 기반의 표면 결함 부동화 연구 (Ethylenediamine Based Surface Defect Passivation for Enhancing Indoor Photovoltaic Efficiency of Perovskite)

  • 강석범;윤주웅;김창용;이상헌;이혜민;김동회
    • Current Photovoltaic Research
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    • 제11권3호
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    • pp.87-95
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    • 2023
  • As the demand for the Internet of Things grows, research into indoor photovoltaics for wireless power is becoming important. In particular, perovskite has attracted considerable attention due to its superior performance compared to other candidates. However, various surface defects present in perovskite are a limiting factor for high performance. In particular, deep-level surface defects caused by uncoordinated Pb2+ ions directly limit charge transport. In low light environments, this appears to be a more significant hurdle. In this study, ethylenediamine, which can provide covalent bonding to uncoordinated Pb2+ ions through nitrogen, was used as a surface treatment material for indoor photovoltaics. X-ray photoelectron spectroscopy confirmed that the uncoordinated Pb2+ ions were effectively passivated by the terminal nitrogen of ethylenediamine. As a consequence, a VOC of 0.998 V, a JSC of 0.139 mA cm-2 and a fill factor of 83.03% were achieved, resulting in an indoor photoelectric conversion efficiency of 38.02%.

유도결합 N2O 플라즈마를 이용한 실리콘 산화막의 저온성장과 다결정 실리콘 박막 트랜지스터에의 영향 (Silicon Oxidation in Inductively-Coupled N2O Plasma and its Effect on Polycrystalline-Silicon Thin Film Transistors)

  • 원만호;김성철;안진형;김보현;안병태
    • 한국재료학회지
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    • 제12권9호
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    • pp.724-728
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    • 2002
  • Inductively-coupled $N_2$O plasma was utilized to grow silicon dioxide at low temperature and applied to fabricate polycrystalline-silicon thin film transistors. At $400^{\circ}C$, the thickness of oxide was limited to 5nm and the oxide contained Si≡N and ≡Si-N-Si≡ bonds. The nitrogen incorporation improved breakdown field to 10MV/cm and reduced the interface charge density to $1.52$\times$10^{11}$ $cm^2$ with negative charge. The $N_2$O plasma gate oxide enhanced the field effect mobility of polycrystalline thin film transistor, compared to $O_2$ plasma gate oxide, due to the reduced interface charge at the $Si/SiO_2$ interface and also due to the reduced trap density at Si grain boundaries by nitrogen passivation.

저온공정 실리콘 산화막의 질소 패시베이션 효과 (Passivation of Silicon Oxide Film Deposited at Low Temperature by Annealing in Nitrogen Ambient)

  • 김준식;정호균;최병덕;이기용;이준신
    • 한국전기전자재료학회논문지
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    • 제19권4호
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    • pp.334-338
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    • 2006
  • Poly silicon TFT requires high quality dielectric film; conventional method of growing silicon dioxide needs highly hazardous chemicals such as silane. We have grown high quality dielectric film of silicon dioxide using non-hazardous chemical such as TFOS and ozone as reaction gases by APCVD. The films grown were characterized through C-V curves of MOS structures. Conventional APCVD requires high temperature processing where as in the process of current study, we developed a low temperature process. Interface trap density was substantially decreased in the silicon surface coated with the silicon dioxide film after annealing in nitrogen ambient. The interface with such low trap density could be used for poly silicon TFT fabrication with cheaper cost and potentially less hazards.