• Journal of the Microelectronics and Packaging Society
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• v.19 no.2
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• pp.29-33
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• 2012

The demand for 3D wafer level integration has been increasing significantly. Although many technical challenges of wafer stacking are still remaining, wafer stacking is a key technology for 3D integration due to a high volume manufacturing, smaller package size, low cost, and no need for known good die. Among several new process techniques Cu-to-Cu wafer bonding is the key process to be optimized for the high density and high performance IC manufacturing. In this study two main challenges for Cu-to-Cu wafer bonding were evaluated: misalignment and bond quality of bonded wafers. It is demonstrated that the misalignment in a bonded wafer was mainly due to a physical movement of spacer removal step and the bond quality was significantly dependent on Cu bump dishing and oxide erosion by Cu CMP.

• Journal of Korean Society of Rural Planning
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• v.20 no.4
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• pp.25-33
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• 2014

This study has intended to build a rural landscape evaluation model based on an integrated landscape assessment paradigm of rural region using an additive integration index method and applied the model to the Seondong Region of Gochang-gun, Jeollabuk-do, Korea. To reach this goal, this study developed a model to calculate Integrated Landscape Assessment Index. The model has employed the Objective Landscape Index, the Subjective Landscape Index, and the weighted values, and was applied to the Seondong region. This study has found the following results: 1) forests and water spaces were assessed with relatively better visual preferences and better landscape ecosystem; 2) the historic cultural area and scenic agriculture as well as general farm land were assessed with moderate ratings; and, 3) the villages included in development plan, their adjacent arable farming land, and the village watercourses were forming relatively poorer landscape.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.37 no.3
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• pp.241-252
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• 2024

With the recent development of emerging technologies, information acquisition and delivery between users has been actively conducted, and inorganic thin film transfer technology that effectively transfers various materials and devices is being studied to develop flexible electronic devices accordingly. This is aimed at innovative structural changes and functional improvement of electronic devices in the era of the Internet of Things (IoT). In particular, advanced technologies such as microLEDs are used to realize high-resolution flexible displays, and the possibility of heterogeneous integrated technologies can be presented by precisely transferring materials to substrates through various transfer process. This paper introduced physical, chemical, and self-assembly transfer methods based on inorganic thin film materials to implement heterogeneous integrated flexible semiconductor systems and introduces the results of application studies of semiconductor devices obtained through different transfer technologies. These studies are expected to bring about innovative changes in the field of smart devices, medical technology, and user interfaces in the future.

• Journal of the Korean Society of Industry Convergence
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• v.7 no.4
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• pp.425-432
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• 2004

This study for Customer Satisfaction(Customer Focus) by Profit security' in the field Process improvement activity and man-power upgrade in the learning of organization activity or upgrading ability of each peoples. This thesis study on the focus of KAPEC which introduce Toyota system can apply to VM, 3jeong, Right Box and Right Position), 5S, JIT(Just In Time), KAlZEN, KANBAN System, CIM, ERP, DAS an output of Factory. For strategic changes to take place in industry 3 key important factors need to be included ; integration of tasks functions and process, decentralization of information and responsibility and finally simplification of products and product structures. These describes how CIM can be implemented using these factors. This study for (1)System Integration, (2) Help Logistic Problems, (3) Partly facilitated growth. (4) Improved production planning (5) Real-time management. (6) Fast reporting (7) Productivity. Quality. Delivery Up, Cost reduction and Autonomy management, FMS in the Plant etc.

• Journal of applied mathematics & informatics
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• v.32 no.1_2
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• pp.39-53
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• 2014

In this paper, a non-asymptotic method is presented for solving singularly perturbed delay differential equations whose solution exhibits a boundary layer behavior. The second order singularly perturbed delay differential equation is replaced by an asymptotically equivalent first order neutral type delay differential equation. Then, Simpson's integration formula and linear interpolation are employed to get three term recurrence relation which is solved easily by Discrete Invariant Imbedding Algorithm. Some numerical examples are given to validate the computational efficiency of the proposed numerical scheme for various values of the delay and perturbation parameters.

• 한국IT서비스학회:학술대회논문집
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• 2007.11a
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• pp.473-478
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• 2007

본 연구는 데이터 품질개선을 위해 사용자들에게 베타데이터 관리 시스템 사용의도에 영향을 줄 수 있는 주요 요인들이 무엇이 있는지 식별해보고 요인간의 관련성을 분석 하였다. 최근 이슈화고 있는 Data Architecture, Data Integration, Data Quality 프로젝트를 계획 또는 경험이 있는 조직 IT담당자들을 대상으로 메타데이터 관리 시스템 사용의도 설문을 하였고, SPSS를 이용하여 통계적 희귀분석을 수행하였다. 분석에서 이를 설명하는 연구모형으로 정보기술수용모델(Technology Acceptance Model:TAM)을 적용하였으며, 사용 용이성(Perceived easy of use), 유용성(perceived usefulness)에 영향을 주는 외생변수로는 개인의 데이터 품질개선의도, 동기부여, 조직의 지원 등으로 나타났다. 분석결과 데이터품질 개선의도가 시스템 사용의도에 영향이 있음을 실증하였고, 사회적 요인(동기부여, 조직의 기원) 모두 유용성에는 영향을 미쳤으나 사용 용이성에는 유의하지 많은 결과를 보였다. 이 연주에서는 조직이 데이터 품질 개선을 위해 메타데이터 관리시스템을 사용하고자 할 경우 고려사항과 향후 사용자 관점의 기술수용들을 확장된 연구를 수행하여 데이터품질 개선에 방안들을 탐색할 것을 제안하였다.

• Journal of Korea Technology Innovation Society
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• v.1 no.3
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• pp.313-325
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• 1998

Government-Supported Research Institutes(GSRI) have done complex product(CP) development with national needs. The products to be developed have very limited demand. The most important things at CP development are technology innovation through knowledge creation and acquisition. Then, this paper suggests the technology innovation system for CP development. In CP development like satellite, government must do strategic management at national level and technology management at program level. Two managements are tools to achieve the strategic goals. The key points in CP are integration and interface among subsystems and person. From these factors and innovation system, R&D planning and practice are based on sharing and creation of knowledge. CP development projects ought to overlap and parallel for sustainable acquisition and creation of knowledge.

• The Journal of the Acoustical Society of Korea
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• v.21 no.3E
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• pp.105-111
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• 2002

The parabolic equation technique provides an excellent model to describe the wave phenomena when there exists a predominant direction of propagation. The model handles the square root wave number operator in paraxial direction. Realization of the pseudo-differential square root operator is the essential part of the parabolic equation method for its numerical accuracy. The wide-angled approximation of the operator is made based on the Pade series expansion, where the branch line rotation scheme can be combined with the original Pade approximation to stabilize its computational performance for complex modes. The Galerkin integration has been employed to discretize the depth-dependent operator. The benchmark tests involving the half-infinite space, the range independent and dependent environment will validate the implemented numerical model.

• JSTS:Journal of Semiconductor Technology and Science
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• v.14 no.2
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• pp.169-174
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• 2014

As a versatile processing method for nanoscale memory integration, laser-induced epitaxial growth is proposed for the fabrication of vertical Si channel (VSC) transistor. The fabricated VSC transistor with 80 nm gate length and 130 nm pillar diameter exhibited field effect mobility of $300cm^2/Vs$, which guarantees "device quality". In addition, we have shown that this VSC transistor provides memory operations with a memory window of 700 mV, and moreover, the memory window further increases by employing charge trap dielectrics in our VSC transistor. Our proposed processing method and device structure would provide a promising route for the further scaling of state-of-the-art memory technology.

• YAKHAK HOEJI
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• v.28 no.5
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• pp.287-291
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• 1984

A rapid and accurate NMR procedure for the analysis of a mixture of sulfametrol, sulfalene and sulfameter in $CDCl_3$ and $dimethylsulfoxide-d_6$ was developed. Thioacetamide was used as an internal standard. The signals chosen for the analysis were a singlet of 4.03ppm due to the methoxyl group of sulfametrol, a singlet of 3.98ppm due to the methoxyl group of sulfalene and a singlet of 3.83ppm due to the methoxyl group of sulfameter. The quantification of the characteristic peak was done by the integration method and the peak height method. The variation coefficient of sulfametrol, sulfalene and sulfameter were 1.7(n=6), 1.7(n=6) and 1.4%(n=6), respectively in the peak height method and 8.9(n=6), 9.4(n=6) and 7.0(n=6), respectively in the integration method.