• Title/Summary/Keyword: multilayer ceramic package

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Metal/ceramic Interface Mechanical Property Analysis (금속/세라믹 계면 물성 분석)

  • Kim, Song-Hee;Kang, Hyung-Suk
    • Journal of Industrial Technology
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    • v.24 no.A
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    • pp.9-15
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    • 2004
  • The flexural strength from 3-point bend test and fatigue properties were measured to evaluate mechanical properties of metal/ceramic interface of the multilayer ceramic package produced through tape casting. From the results, the specimens with three electrode layers showed the highest strength. The temperature distribution with time during thermal cycle and thermal stresses with the change of electrode's shape have been estimated by mathematical modelling. Specimen affected by thermal shock, produced microcracks by the difference of thermal expansion coefficient. The results of tensile test and fatigue test showed the rupture at pin. The fact that the pin brazed specimens were always fractured at the pin proved the good bonding condition between pin and electrode.

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Butterfly type 광패키지의 제작 및 특성 평가

  • 조현민;유찬세;강남기;이승익;한기우;유명기
    • Proceedings of the International Microelectronics And Packaging Society Conference
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    • 2001.11a
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    • pp.111-114
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    • 2001
  • Optical transmitter and receiver are the essential components for optical communication. For these components, butterfly type packages are used which are comprised of metal housing, multilayer ceramic inserts, lead and window. In this study, 2.5 Gbps DFB(Distributed -Feedback) LD(Laser Diode) package was fabricated and characterized. Metal housing showed good thermal conductivity (200W/mK) and well matched TCE(6.7ppm/K) with GaAs chip. Ceramic inserts also showed good VSWR(Voltage Standing Wave Ratio) characteristics(<2.0). By brazing technology, all the elements were combined and sealed. RF characteristics of the package mounted on the PWB was also tested.

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Changes of Camber on Lamination Conditions in alumina/Tungsten Cofiring Multilayer Package (알루미나/텅스텐 동시소성에 의한 다층 팩키지 제조시 적층조건에 따른 camber의 변화)

  • 성재석;구기덕;윤종광;이상진;박정현
    • Journal of the Korean Ceramic Society
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    • v.34 no.6
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    • pp.601-610
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    • 1997
  • In cofiring of multilayered alumina with tungsten, the change of camber with lamination condition was experimented and the effect of sintering shrinkage of alumina and tungsten was investigated. From the exact measurement of sintering shrinkage of tungsten thick film, as lamination pressure increased, the sintering shrinkage of alumina decreased but that of tungsten thick film was not changed. So it was though that the main factor which induced the sintering shrinkage difference between ceramics and metal with lamination condition was the change of sintering shrinkage of ceramics. In case of high lamination pressure, high green sheet density, the cofired specimen showed low camber due to low shrinkage difference between alumina and tungsten and there was a linear relation between camber and shrinkage difference. It was found that this shrinkage difference could change the thickness of tungsten film and the microstructure within via hole during cofiring.

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Fabrication of a high performance microvalve using a multilayer piezoelectric actuator and its characteristics (적층형 압전 엑츄에이터를 이용한 고성능 마이크로 밸브의 제작과 그 특성)

  • Seo, Jung-Ho;Chung, Gwiy-Sang
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2006.06a
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    • pp.390-391
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    • 2006
  • This paper describes the design, fabrication and characteristics of a micromachined piezoelectric valve utilizing a multilayer ceramic actuator (MCA). The micromachined MCA valve, which uses a buckling effect, consists of three separate structures: the MCA, the valve actuator die and the seat die. The valve seat die with 6 trenches was made, and the actuator die, which is driven by the MCA under optimized conditions, was also fabricated. After Si wafer direct bonding between the seat die and the actuator die, the MCA was also anodically bonded to the seat/actuator die structure. A polydimethylsiloxane (PDMS) sealing pad was fabricated to minimize the leak rate. Finally, the PDMS sealing pad was also bonded to the seat die and the stainless steel package. The MCA valve shows a flow rate of 9.13 sccm at an applied DC voltage of 100 V with a 50% duty cycle and a maximum non-linearity of 2.24% FS. Therefore, the fabricated MCA valve is suitable for a variety of flow control equipment, as a medical bio-system and in the automobile industry.

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Fabrication and Characteristics of a Piezoelectric Valve for MEMS using a Multilayer Ceramic Actuator (적층형 세라믹 엑추에이터를 이용한 MEMS용 압전밸브의 제작 및 특성)

  • 정귀상;김재민;윤석진
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.17 no.5
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    • pp.515-520
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    • 2004
  • We report on the development of a Piezoelectric valvc that is designed to have a high reliability for fluid control systems, such as mass flow control, transportation and chemical analysis. The valve was fabricated using a MCA(multilayer ceramic actuator), which has a low consumption power, high resolution and accurate control. The fabricated valve is composed of MCA, a valve actuator die and an seat die. The design of the actuator dic was done by FEM(finite element method) modeling, respectively. And, the valve seat die with 6 trenches was made. and the actuator die, which possible to optimize control to MCA, was fabricated. After Si-wafer direct bonding between the seat die and the actuator die, MCA was also anodic bonded to the scat/actuator die structure. PDMS(poly dimethylsiloxane) sealing pad was fabricated to minimize a leak-rate. It was also bonded to scat die and stainless steel package. The flow rate was 9.13 sccm at a supplied voltage of 100 V with a 50 % duty ratio and non-linearity was 2.24 % FS. From these results, the fabricated MCA valve is suitable for a variety of flow control equipments, a medical bio-system, semiconductor fabrication process, automobile and air transportation industry with low cost, batch recess and mass production.

Development of a Small Size Ceramic VCXO using the PECL and Inverted Mesa Type HFF (PECL과 역메사형 HFF를 이용한 소형세라믹 VCXO 개발)

  • Yoon Dal-Han;Lee Jae-Kyung
    • Journal of the Institute of Electronics Engineers of Korea SC
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    • v.42 no.1
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    • pp.23-31
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    • 2005
  • Recently, the multimedia and high speed telecommunication systems needs a high frequency and high stability oscillator. The VCXO(voltage controlled -crystal oscillator) have continually downsized to gratify a thin and small size of the telecommunication systems. In his paper, we have developed the small ceramic PECL(positive emitter-coupled logic) VCXO of the 5×7 mm size for gratifying the requested specifications from user, and then use the multilayer ceramic SMD(surface mounted device) package technology. The ceramic SMD PECL VCXO is operating at the 3.3 Voltage and have the frequency range of 120MHz~180MHz. The Q factor is over 5K and it has the low jitter characteristics of 3.5 ps and low phase noise.

Development of Small-sized Ceramic VCXO using the PECL (PECL을 이용한 소형 세라믹 VCXO 개발)

  • Lee, Jae-Kyung;Yoon, Dal-Hwan
    • The Journal of Korean Institute of Communications and Information Sciences
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    • v.30 no.2A
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    • pp.107-113
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    • 2005
  • In this paper, we have developed the miniature ceramic PECL(positive emitter-coupled logic) VCXO of the $5{\times}7mm$ size for gratifying the requested specifications and the multilayer ceramic SMD(surface mounted device) package technology. The ceramic SMD PECL VCXO designed by the inverted Mesa type HFF is operating at the 3.3 Voltage and have the frequency range of 120MHz-180MHz. The Q factor is over 5K and it has the low jitter characteristics of 3.5 ps and low phase noise.

Fabrication of a Micro Multilayer Piezo Actuator Valve and Its Characteristics (마이크로 적층형 압전밸브의 제작과 그 특성)

  • Chung, Gwiy-Sang;Kimm, Jae-Min;Cho, Sang-Bock
    • Proceedings of the IEEK Conference
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    • 2005.11a
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    • pp.913-916
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    • 2005
  • This paper describes the design, fabrication and characteristics of a piezoelectric valve using MCA(Multilayer ceramic actuator). The MCA valve, which has the buckling effect, consists of three separate structures; MCA, a valve actuator die and an a seat die. The design of the actuator die was done by FEM modeling and displacement measurement, respectively. The valve seat die with 6 trenches was made, and the actuator die, which is driven to MCA under optimized conditions, was also fabricated. After Si-wafer direct bonding between the seat die and the actuator die, MCA was also anodic bonded to the seat/actuator die structure. PDMS sealing pad was fabricated to minimize a leak-rate. It was also bonded to seat die and SUS package. The MCA valve shows a flow rate of 9.13 sccm at a supplied voltage of 100 V with a 50 % duty cycle, maximum non-linearity was 2.24 % FS and leak rate was $3.03{\times}10^{-8}pa$. $m^3/cm^2$.

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A Development of Jig Circuit for Performance Evaluation of an Oscillator (발진기의 성능평가를 위한 지그 회로의 개발)

  • Lin, Chi-Ho;Yoon, Dal-Hwan
    • Journal of the Institute of Electronics Engineers of Korea SD
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    • v.45 no.11
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    • pp.95-101
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    • 2008
  • We have used diversely the multilayer ceramic oscillator of the SMD(Surface Mounted Device) package technology that connects the crystal with the chip package. Such an oscillator occurs a stray inductance and a parasitic capacitance by the length and inner pattern. And it has been happened an amplitude attenuation and signal loss due to the reflection of power source and noise component. So we don't evaluate the precise performance of the oscillator for these factors. In this paper we have developed the Jig system to evaluate the performance of the oscillator. Through this system, we will expect an advanced performance of the oscillator and redesign an oscillator of the low jitter characteristics and low phase noise.

Spectral Analysis and Performance Evaluation of VCXO using the Jig System (지그시스템을 이용한 VCXO의 스펙트럼 분석 및 성능평가)

  • Yoon Dal-Hwan
    • Journal of the Institute of Electronics Engineers of Korea SC
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    • v.43 no.4 s.310
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    • pp.45-52
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    • 2006
  • In his paper, we have developed the SMD(surface mounted device) type PECL(positive emitter-coupled logic) VCXO of the $5{\times}7mm$ size for gratifying the requested specifications and the multilayer ceramic SMD(surface mounted device) package technology. The VCXO wired with the PECL(positive emitter coupled logic) package take place a stray inductance and a parasitic capacitance by the length and the inner pattern of the VCXO and the amplitude attenuation and signal loss due to the reflection of power source and the noise component. We have developed the Zig system to analyze the precise spectrum and evaluate the performance. The basic operating voltage is the 3.3 V and have the frequency range of 120MHz-180MHz. The Q factor is over 5K and it has the low jitter characteristics of 3.5 ps and low phase noise.