• 산업기술연구
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• 제24권A호
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• pp.9-15
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• 2004

The flexural strength from 3-point bend test and fatigue properties were measured to evaluate mechanical properties of metal/ceramic interface of the multilayer ceramic package produced through tape casting. From the results, the specimens with three electrode layers showed the highest strength. The temperature distribution with time during thermal cycle and thermal stresses with the change of electrode's shape have been estimated by mathematical modelling. Specimen affected by thermal shock, produced microcracks by the difference of thermal expansion coefficient. The results of tensile test and fatigue test showed the rupture at pin. The fact that the pin brazed specimens were always fractured at the pin proved the good bonding condition between pin and electrode.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2001년도 추계 기술심포지움
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• pp.111-114
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• 2001

Optical transmitter and receiver are the essential components for optical communication. For these components, butterfly type packages are used which are comprised of metal housing, multilayer ceramic inserts, lead and window. In this study, 2.5 Gbps DFB(Distributed -Feedback) LD(Laser Diode) package was fabricated and characterized. Metal housing showed good thermal conductivity (200W/mK) and well matched TCE(6.7ppm/K) with GaAs chip. Ceramic inserts also showed good VSWR(Voltage Standing Wave Ratio) characteristics(<2.0). By brazing technology, all the elements were combined and sealed. RF characteristics of the package mounted on the PWB was also tested.

• 한국세라믹학회지
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• 제34권6호
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• pp.601-610
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• 1997

In cofiring of multilayered alumina with tungsten, the change of camber with lamination condition was experimented and the effect of sintering shrinkage of alumina and tungsten was investigated. From the exact measurement of sintering shrinkage of tungsten thick film, as lamination pressure increased, the sintering shrinkage of alumina decreased but that of tungsten thick film was not changed. So it was though that the main factor which induced the sintering shrinkage difference between ceramics and metal with lamination condition was the change of sintering shrinkage of ceramics. In case of high lamination pressure, high green sheet density, the cofired specimen showed low camber due to low shrinkage difference between alumina and tungsten and there was a linear relation between camber and shrinkage difference. It was found that this shrinkage difference could change the thickness of tungsten film and the microstructure within via hole during cofiring.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2006년도 하계학술대회 논문집 Vol.7
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• pp.390-391
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• 2006

This paper describes the design, fabrication and characteristics of a micromachined piezoelectric valve utilizing a multilayer ceramic actuator (MCA). The micromachined MCA valve, which uses a buckling effect, consists of three separate structures: the MCA, the valve actuator die and the seat die. The valve seat die with 6 trenches was made, and the actuator die, which is driven by the MCA under optimized conditions, was also fabricated. After Si wafer direct bonding between the seat die and the actuator die, the MCA was also anodically bonded to the seat/actuator die structure. A polydimethylsiloxane (PDMS) sealing pad was fabricated to minimize the leak rate. Finally, the PDMS sealing pad was also bonded to the seat die and the stainless steel package. The MCA valve shows a flow rate of 9.13 sccm at an applied DC voltage of 100 V with a 50% duty cycle and a maximum non-linearity of 2.24% FS. Therefore, the fabricated MCA valve is suitable for a variety of flow control equipment, as a medical bio-system and in the automobile industry.

• 한국전기전자재료학회논문지
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• 제17권5호
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• pp.515-520
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• 2004

We report on the development of a Piezoelectric valvc that is designed to have a high reliability for fluid control systems, such as mass flow control, transportation and chemical analysis. The valve was fabricated using a MCA(multilayer ceramic actuator), which has a low consumption power, high resolution and accurate control. The fabricated valve is composed of MCA, a valve actuator die and an seat die. The design of the actuator dic was done by FEM(finite element method) modeling, respectively. And, the valve seat die with 6 trenches was made. and the actuator die, which possible to optimize control to MCA, was fabricated. After Si-wafer direct bonding between the seat die and the actuator die, MCA was also anodic bonded to the scat/actuator die structure. PDMS(poly dimethylsiloxane) sealing pad was fabricated to minimize a leak-rate. It was also bonded to scat die and stainless steel package. The flow rate was 9.13 sccm at a supplied voltage of 100 V with a 50 % duty ratio and non-linearity was 2.24 % FS. From these results, the fabricated MCA valve is suitable for a variety of flow control equipments, a medical bio-system, semiconductor fabrication process, automobile and air transportation industry with low cost, batch recess and mass production.

• 전자공학회논문지SC
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• 제42권1호
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• pp.23-31
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• 2005

통신시스템의 경박단소화와 고부가가치 기술 추세에 따라 전압제어 수정발진기(VCXO)도 소형화와 경향화를 향하고 있다. 기존의 VCXO는 9×14mm의 크기가 주류를 이루었으나 양의 에미터결합논리(PECL)와 적층 세라믹 SMD 패키지기술을 통하여 5×7 mm의 크기로 소형화한 VCXO를 개발한다. 이는 역메사형 HFF 수정설계 기술과 세라믹 SMD 공정선을 접목시키고 생산프로세스를 단축하는 효과도 얻는다.

• 한국통신학회논문지
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• 제30권2A호
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• pp.107-113
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• 2005

본 논문에서는 통신소자의 경박 단소화 추세에 따라 적층 세라믹 SMD(surface mounted device) 패키지기술을 통하여 소형화한 $5{\times}7mm$의 크기의 VCXO를 개발한다. 이때 안정된 입력신호를 공급하기 위하여 양의 이미터결합논리(PECL)를 이용하고, 역메사형 HFF(high frequency fundamental) 기법을 이용하여 제작한 수정소자로 IC에 설계함으로써 동작전압은 3.3 V, 저전력하에서 120MHz-180MHz 범위의 주파수에서 발진하며, Q인자는 5 K이상, 3.5 ps rms의 낮은 지터(Jitter)와 위상잡음 특성 및 일정기간의 경화실험에서도 안정된 출력특성을 보인다.

• 대한전자공학회:학술대회논문집
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• 대한전자공학회 2005년도 추계종합학술대회
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• pp.913-916
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• 2005

This paper describes the design, fabrication and characteristics of a piezoelectric valve using MCA(Multilayer ceramic actuator). The MCA valve, which has the buckling effect, consists of three separate structures; MCA, a valve actuator die and an a seat die. The design of the actuator die was done by FEM modeling and displacement measurement, respectively. The valve seat die with 6 trenches was made, and the actuator die, which is driven to MCA under optimized conditions, was also fabricated. After Si-wafer direct bonding between the seat die and the actuator die, MCA was also anodic bonded to the seat/actuator die structure. PDMS sealing pad was fabricated to minimize a leak-rate. It was also bonded to seat die and SUS package. The MCA valve shows a flow rate of 9.13 sccm at a supplied voltage of 100 V with a 50 % duty cycle, maximum non-linearity was 2.24 % FS and leak rate was $3.03{\times}10^{-8}pa$. $m^3/cm^2$.

• 대한전자공학회논문지SD
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• 제45권11호
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• pp.95-101
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• 2008

최근 발진수정자에 칩패키지를 결선한 SMD형의 적층세라믹 발진기를 많이 사용한다. 이러한 발진기들은 그 길이 및 패키지 내부의 패턴 등에 의하여 부유인덕턴스 및 기생 커패시턴스가 발생하고, 전원의 반사 및 잡음 발생으로 출력신호의 진폭감소 및 신호 손실이 발생하여 발진기 성능을 정상적으로 평가할 수 없다. 본 논문에서는 발진기와 계측기의 부정합임피던스로 부터 발생한 신호 손실 및 진폭감소를 방지하기 위해 지그 회로를 개발한다. 이를 통하여 발진기의 정확한 스펙트럼 분석 및 성능을 평가함으로써 발진기의 성능향상을 기한다.

• 전자공학회논문지SC
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• 제43권4호
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• pp.45-52
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• 2006

본 연구에서는 위상잡음과 지터(jitter) 특성을 개선한 $5mm{\times}7mm$ 크기의 적층 세라믹 SMD(surface mounted device)형 VCXO를 개발한다. PECL(positive emitter coupled logic) 칩패키지를 발진수정자에 결선한 VCXO는 그 길이 및 패키지 내부의 패턴 등에 의하여 부유인덕턴스 및 기생 커패시턴스가 발생하고, 전원의 반사 및 잡음 발생으로 출력신호의 진폭 감소 및 신호 손실이 발생하여 발진기 성능을 정상적으로 평가할 수 없다. 이러한 신호 손실 및 진폭감소를 방지하기 위해 지그(Jig) 시스템을 개발하고, 이를 통하여 발진기의 정확한 스펙트럼 분석 및 성능을 평가한다. 동작전원은 3.3 V, 주파수 범위 120-180 MHz 및 Q인수는 5K이다.