• 마이크로전자및패키징학회지
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• 제22권2호
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• pp.41-45
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• 2015

리드프레임의 우수한 열적/전기적 특성을 유지하면서 많은 I/O수를 수용할 수 있는 구조, 그리고 라미네이트의 디자인 팬인(Fan-in) 및 팬아웃(Fan-out) 설계 유연성을 유지하면서 가격경쟁력을 향상 시킬 수 있는 몰딩기판(Molded substrate)을 기반으로 한 RtMLF(Routable Molded Lead Frame) 패키지를 개발하였다. 개발된 패키지의 구조적 특징을 이용하여, 열적 전기적 성능의 우수성을 시뮬레이션을 통해서 확인하였으며, 제조 및 신뢰성 분석을 수행하여 생산 적용 가능성을 확인하였다.

• 소성∙가공
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• 제13권3호
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• pp.230-235
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• 2004

A new design based on the appropriate geometry of molded part and type of runner system under the optimal processing conditions was proposed to minimize the micro weld lines on the sub deco surface molded by two shot molding. Theoretical and experimental studies were conducted to examine the cause of the weld lines during the overmolding process in two shot molding. Various dimensions and geometries of substrate$(1^{st}shot)$ and the wall thickness of overmold$(2^{nd}shot)$ have been proposed to avoid the weld lines which are the most inevitable appearance defects occurred on the sub deco. The each design proposal was analyzed by mold flow analysis after part modeling. The analysis results were compared with molded part from mass production tool. It could be seen that from the analysis that the proper geometry of plastic part and type of runner system considering pressure drop under the optimal processing conditions were the most influential factors to avoid weld lines occured on the sub deco.

• 마이크로전자및패키징학회지
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• 제31권2호
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• pp.16-22
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• 2024

Artificial Intelligence(AI) 기술이 발전함에 따라 데이터 센터 분야 등에서 고사양 반도체에 대한 수요가 증가하고 있다. 이러한 추세에 맞춰 반도체 성능을 향상하기 위해 회로의 미세화 및 I/O의 고밀도화가 요구되고 있으며 이를 충족할 수 있는 기술로 차세대 packaging인 2.5dimension(D) packaging이 주목받고 있다. 2.5D packaging에 활용되는 요소 기술로는 microbump, interposer 및bridge die가 있다. 이러한 기술을 적용하면 기존 방식 대비 더 많은 수의 I/O 구현이 가능하여 동시에 다량의 정보를 송수신할 수 있으며, 전기 신호를 전달하는 배선 길이를 단축하여 전력 소모량을 감소시킬 수 있다. 본 논문에서는 molding 공정 및 R DL공정을 융합하여 제작한 Molded Bridge die on Substrate(MBoS) 공정 기술을 제안한다. 제안된 MBoS 기술은 적용이 쉽고 활용 분야가 넓어 차세대 패키징 기술의 대중화에 기여할 것으로 예상된다.

• 소성∙가공
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• 제16권1호
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• pp.20-24
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• 2007

Polypropylene substrate with hair-like nano features(aspect $ratio{\sim}10$) on the surface is fabricated by injection molding process. Pure aluminum plate is anodized to have nano pore array on the surface and used as a stamper for molding nano features, The size and the thickness of the stamper is $30mm{\times}30mm$ and 1mm. The fabricated pore is about 120nm in diameter and 1.5 um deep. For molding of a substrate with nano-hair type of surface features, the stamper is heated up over $150^{\circ}C$ before the filling stage and cooled down below $70^{\circ}C$ after filling to release the molded part. For heating the stamper, stamper itself is used as a heating element by applying electrical power directly to each end of the stamper. The stamper becomes cooled down without circulation of coolant such as water or oil. With this new stamper heating method, nano hairs with aspect ratio of about 10 was successfully injection molded. We also found the heating & cooling process of the stamper is good for releasing of molded nano-hairs.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2006년도 춘계학술대회 논문집
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• pp.471-472
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• 2006

High aspect ratio of nano hairs on a plastic substrate is molded using thermoplstic materials including COC, PP, PC and PMMA. As a template for molding nano hairs, AAO membrane is adopted, which is 60um thick and 13mm in diameter. This membrane has about 109 of through-holes of which diameter is around 200nm. This AAO membrane and the pellet of materials are stacked in the mold and pressed to mold after heating up to be melted. The AAO membrane is removed using KOH to obtain the molded nano hairs. As a result, the diameter of the molded hairs is around 200nm and the length is $2um{\sim}60um$ depending on the molding conditions and materials.

• 한국소성가공학회:학술대회논문집
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• 한국소성가공학회 2006년도 춘계학술대회 논문집
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• pp.113-116
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• 2006

Some nano hair systems in the nature are found to show excellent adhesive characteristic, which is called dry adhesive, and synthetic nano hairs to mimic these adhesiveness are believed to have many applications. To develop a practical synthetic dry adhesive system, we mold nano hairs on plastic substrates using thermoplstic materials including COC, PP, PC and PMMA. and estimate the moldability and the adhesive characteristic. As a template for molding nano hairs, AAO membrane is first adopted, which is 60um thick and 13mm in diameter. This membrane has about a billion of through-holes of which diameter is around 200nm. This AAO membrane and the pellet of materials are stacked in the mold and pressed to mold after heating up to be melted. The AAO membrane is removed using KOH to obtain the molded nano hairs. As a result, the diameter of the molded hairs is around 200nm and the length is $2um{\sim}60um$ depending on the molding conditions and materials. The molded nano hair substrates is estimated to show much better adhesive characteristic than a substrate without nano hairs.

• 소성∙가공
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• 제12권8호
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• pp.730-737
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• 2003

Extensive studies have been conducted for reducing the residual stresses and birefringence in injection-molded optical disk substrate Flow-induced and thermally-induced stresses and birefringence have been found as two main sources during injection molding process. However, high speed rotation also induces extra stresses and birefringence in real operation of disk drives. In the present paper rotation-induced in-plane birefringence has been measured and presented for CD and DVD substrates at different radial position. About 10 - 15 nm of extra retardation in one pass has been measured up to 4,800 rpm. The distribution of extra rotation-induced birefringence will be valuable data for designing an optimal optical disk substrate. Finally, experimental results were compared with the extra stresses calculated from simple formulation.

• 한국소성가공학회:학술대회논문집
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• 한국소성가공학회 2003년도 춘계학술대회논문집
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• pp.470-473
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• 2003

Extensive studies have been conducted for reducing the residual stresses and birefringence in injection-molded optical disk substrate. Flow-induced and thermally-induced stresses and birefringence have been found as two main sources during injection molding process. However, high speed rotation also induces extra stresses and birefringence in real operation of disk drives. In the present paper rotation-induced in-plane birefringence has been measured and presented for CD and DVD substrates at different radial position. About 10 - 15 nm of extra retardation has been measured up to 4,800 rpm.

• Composites Research
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• 제25권4호
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• pp.117-125
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• 2012

필름 삽입 사출 시편의 휨은 비대칭적인 잔류응력 분포에 기인한다. 비대칭적 잔류응력과 온도 분포는 삽입된 필름 표면의 수직방향으로 지연되는 열 전달에 의해 발생한다. 사출 공정조건 최적화를 통해 필름 삽입 사출 시편의 휨을 억제할 수 없었기 때문에, 필름 삽입 사출 시편의 휨을 최소화하기 위해서 유리 섬유가 강화된 복합재료를 기판으로 사용하였다. 유리 단섬유의 분포를 마이크로 CT 장비를 이용하여 평가하였다. 복합재료로 구성된 기판을 이용한 필름 삽입 사출 시편의 배향 텐서와 휨을 계산하기 위해서는 적절한 마이크로 역학, 이방적 열팽창계수 및 닫힌 어림법 모델이 선택되어야만 한다. 여섯 종류의 마이크로 역학모델, 세 종류의 열 팽창 계수 모델 및 다섯 종류의 닫힌 어림법 모델을 고려한 후, Mori-Tanaka 모델, Rosen and Hashin 모델 및 third orthotropic 닫힌 어림법 모델을 선택하였다. 수치적으로 계산된 섬유 배향 텐서와 휨에 관한 결과들은 실험결과와 잘 일치하였고, 유리 섬유의 보강효과가 필름 삽입 사출 복합 재료 시편의 휨에 미치는 영향을 파악하였다.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2007년도 춘계학술대회A
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• pp.1532-1536
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• 2007

A plastic substrate with tiny rectangular pillars less than 100nm is injection molded to study pattern replication in injection molding. The size of the substrate is 50mm ${\times}$ 50mm and 1mm thick. The substrate has 9 patterned areas of which size is 2mm ${\times}$ 2mm respectively. The lengths of the pillars are 50nm, 100nm, 150nm and 200nm and the width and height are 50nm and about 100nm respectively. A pattern master is fabricated by e-beam writing using positive PR(photo resist) and then a nickel stamper replicated from the PR master by nickel electro-plating. Cr is deposited on the PR pattern master before nickel electro-plating as a conducting layer. Using this nickel stamper, several injection molding experiments are done to investigate effects of the injection molding parameters such as mold temperature, injection rate, packing pressure or pattern location on the replication of the patterns under 100nm.