• 전자공학회논문지A
• /
• 제32A권5호
• /
• pp.737-748
• /
• 1995

In this paper, we studyed the variables in the design of multichip memory modules with 4M$\times$1bit DRAM chips to construct high capacity and high speed memory modules. The configuration of the module was 8 bit, 16 bit, and 32 bit DRAM modules with employing 0.6 W, 70 nsec 4M$\times$1 bit DRAM chips. We optimized routing area and wiring density by performing the routing experiment with the variables of the chip allocation, module I/O terminal, the number of wiring, and the number of mounting side of the chips. The multichip module was designed to be able to accept MCM-L techiques and low cost PCB materials. The module routing experiment showed that it was an efficient way to align chip I/O terminals and module I/O terminals in parallel when mounting bare chips, and in perpendicular when mounting packaged chips, to set module I/O terminals in two sides, to use double sided substrates, and to allocate chips in a row. The efficient number of wiring layer was 4 layers when designing single sided bare chip mounting modules and 6 layers when constructing double sided bare chip mounting modules whereas the number of wiring layer was 3 layers when using single sided packaged chip mounting substrates and 5 layers when constructing double sided packaged chip mounting substrates. The most efficient configuration was to mount bare chips on doubled substrates and also to increase the number of mounting chips. The fabrication of memory multichip module showed that the modules with bare chips can be reduced to a half in volume and one third in weight comparing to the module with packaged chips. The signal propagation delay time on module substrate was reduced to 0.5-1 nsec.

• 한국마이크로전자및패키징학회:학술대회논문집
• /
• 한국마이크로전자및패키징학회 2004년도 추계 기술심포지움 초록집
• /
• pp.38-38
• /
• 2004

• 마이크로전자및패키징학회지
• /
• 제9권1호
• /
• pp.15-20
• /
• 2002

본 연구에서는 Dual Band휴대폰 전화기의 핵심부품인 Dual Band PLL Module의 무선회로 설계 기술, 초소형 설계기술, 표면실장기술, 소형화 SMD기술, Test기술 및 설계기반 마련 및 대외 경쟁력 있는 Dual PLL Module의 초소형화 기술을 확보하였다.

• 한국태양에너지학회 논문집
• /
• 제27권3호
• /
• pp.1-6
• /
• 2007

In this study, we analyze the maximum power generation of photovoltaic(PV) module depending on constituent materials and incidence angle dependence of light. To verify characteristics of constituent materials, we made photovoltaic modules with 4 kinds of solar cells and textured glass according to fabrication method. To find the degree of the maximum power generation dependence on intensity of light, Solar Simulator is applied by changing angle of module and light intensity. Through this experiment, to obtain maximum power generation from limited PV modules, it is needed to fully understand constituent materials, fabrication method and dependence of incident light characteristics.

• 한국전기전자재료학회:학술대회논문집
• /
• 한국전기전자재료학회 2008년도 하계학술대회 논문집 Vol.9
• /
• pp.35-36
• /
• 2008

In this paper, we studied the long term durability estimation for crystalline photovoltaic module while exposing to mechanical stress. Solar cell and PV module have many different kinds of stresses from cell to module fabrication. For this reason, some solar cell shows micro crack that decrease crystallization. In here, we expose artificial mechanical load on surface of PV module. Through this, the periodic external force on PV module might give an negative effect. The further analysis is described in the following paper.

• 대한전자공학회:학술대회논문집
• /
• 대한전자공학회 1999년도 추계종합학술대회 논문집
• /
• pp.817-820
• /
• 1999

In this paper, we describes RF receiver module for IMT-2000 handset with 5MHz channel bandwidth. The fabricated RF receiver module consists of Low Noise Amplifier-, RF SAW filter, Down-converter, IF SAW filter, AGC and PLL Synthesizer. The NF and IIP3 of LNA is 0.8㏈, 3㏈m at 2.14㎓, conversion gain of downconverter is l0㏈, dynamic range of AGC is 80㏈, and phase noise of PLL is -100 ㏈m, at 100KHz. The receiver sensitivity is -110㏈m, adjacent channel selectivity is -48㏈m.

• 한국인터넷방송통신학회논문지
• /
• 제16권4호
• /
• pp.59-64
• /
• 2016

본 논문에서는 10W급 GaN MMIC를 이용하여 Ku-band SSPA 모듈을 설계 및 제작하였다. 설계 및 제작한 SSPA 모듈의 분배/합성을 위해 Rogers(RO4003C)기판을 이용하여 Branch-line 구조를 이용하였다. SSPA 모듈 버짓상 Divider/Combiner는 삽입손실이 최대 -0.7dB 이하로 설계 및 제작하였다. 또한 GaN MMIC 구조 특성상 Gate Bias-Drain Bias로 인가되어야 하기 때문에 Gate-Drain 순차회로를 적용한 Bias 회로를 구현하였으며, RF Power Detect, Temperature Detect, HPA On/Off 기능등을 구현하였다. 설계 제작된 Ku-band SSPA는 최대 출력 15.6W, Gain 45.7dB, 효율 19.0%로 만족하는 측정 결과를 얻었다.

• 한국진공학회:학술대회논문집
• /
• 한국진공학회 1993년도 제4회 학술발표회 논문개요집
• /
• pp.70-71
• /
• 1993

• 플랜트 저널
• /
• 제13권3호
• /
• pp.30-35
• /
• 2017

Module은 세부적으로 PAS(Pre-Assembled Steel structure), PAR(Pre-Assembled pipe Rack), PAU(Pre-Assembled Unit), VAU(Vendor Assembled Unit) 그리고 VPU(Vendor Package Unit)로 분류될 수 있다. 이러한 Module의 설계 및 제작 시에는 Stick built type 구조물과는 달리 육상 또는 해상 운송 조건이 고려되어야 하며, 운송 조건에 따른 Module division design이 수반되어야 한다. 육상 운송 및 설치를 위해서는 무게중심(Center of gravity) 관리가 중요하며, 해상 운송을 위해서는 구조물이 Sea acceleration force에 대해 안전성을 확보할 수 있도록 설계되어야 한다. 운송 조건 및 설치 방법은 구조물의 규모와 무게를 제한하게 되며, 이는 Module 대상 구조물 선정 시, 그리고 선정된 Module의 분할 계획 시 요구조건으로 작용하게 된다.

• 한국전기전자재료학회:학술대회논문집
• /
• 한국전기전자재료학회 2003년도 춘계학술대회 논문집 디스플레이 광소자분야
• /
• pp.198-202
• /
• 2003

Tunable laser diode module with 50GHz-spacing internal wavelength locker was developed. Angle tilting dependency on FSR and peak wavelength shift and the proper initial tilting angle was calculated. By tilting the etalon, the response of the internal wavelength locker module was tuned. As a result, the fabricated internal wavelength locker module showed good performance over 62 channels.