• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2001.10a
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• pp.186-189
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• 2001

The main method in micro-etching process, used in manufacturing semiconductors, electronic components, circuits, is Photo Masking method that exposes and develops on the photo-sensitivity solutions or films. This method enables one to process highly precisely, $\pm$0.03 mm in end line location area. But this has limits in a high speed / wide width process, difficulties in endless masking, and the problem of high price. We have developed the direct masking method to make use of Gravure printing, widely used in grocery packing sheet printing. We made cylinder tools to influence the masking quality by laser stream process. We have confirmed that the end line location accuracy in the line width of the product is improved from 0.12 mm to $\pm$0.07 mm level, after etching process.

• Journal of Biomedical Engineering Research
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• v.30 no.2
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• pp.103-112
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• 2009

Neuron-on-a-Chip technology is based on advanced neuronal culture technique, surface micropatterning, microelectrode array technology, and multi-dimensional data analysis techniques. The combination of these techniques allowed us to design and analyze live biological neural networks in vitro using real neurons. In this review article, two underlying technologies are reviewed: Microelectrode array technology and Neuronal patterning technology. There are new opportunities in the fusion of these technologies to apply them in neurobiology, neuroscience, neural prostheses, and cell-based biosensor areas.

• Journal of the Korean Society for Precision Engineering
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• v.26 no.6
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• pp.36-40
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• 2009

Development of maskless lithography techniques can provide a potential solution for the photomask cost issue. Furthermore, it could open a market for small scale manufacturing applications. Since femtosecond lasers have been found suitable for processing of a wide range of materials with sub-micrometer resolution, it is attractive to use this technique for maskless lithography. As a femtosecond laser has recently been developed, both of high power and high photon density are easily obtained. The high photon density results in photopolymerization of photoresist whose absorption spectrum is shorter than that of the femtosecond laser. The maskless lithography using the two-photon absorption (TPA) makes micro structures. In this paper, we present a femtosecond laser direct write lithography for submicron PR patterning, which show great potential for future application.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2007.06a
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• pp.303-303
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• 2007

Photo-imageable thick-film lithography technology was developed for the fabrication of embedded passives such as inductors and capacitors. In this study, photo-imageable dielectric and conductor pastes have apoted a negative type. Sodalime glass wafer, alumina substrate and zero-shrinkage LTCC green tapes were used as substrates. In result, The lithographic patterns were designed as lines and spaces for conductor material, or via-holes for ceramic, LTCC, materials. The scattering and reflection of UV-beam on the substrate had negative effects on fine patterning. The patterning performance was varied with the exposing and developing process conditions, and also varied with the substrate materials. Fine resolution of less then $50/50{\mu}m$ in line and space was obtained, which is difficult in screen printing method.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.32 no.3
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• pp.209-216
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• 2008

The application of focused ion beam (FIB) depends on the optimal interaction of the operation parameters between operating parameters which control beam and samples on the stage during the FIB deposition process. This deposition process was investigated systematically in C precursor gas. Under the fine beam conditions (30kV, 40nm beam size, etc), the effect of considered process parameters - dwell time, beam overlap, incident beam angle to tilted surface, minimum frame time and pattern size were investigated from deposition results by the design of experiment. For the process analysis, influence of the parameters on FIB-CVD process was examined with respect to dimensions and constructed shapes of single and multi- patterns. Throughout the single patterning process, optimal conditions were selected. Multi-patterning deposition were presented to show the effect of on-stage parameters. The analysis have provided the sequent beam scan method and the aspect-ratio had the most significant influence for the multi-patterning deposition in the FIB processing. The bitmapped scan method was more efficient than the one-by-one scan type method for obtaining high aspect-ratio (Width/Height > 1) patterns.

• Journal of Institute of Convergence Technology
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• v.5 no.2
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• pp.21-25
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• 2015

This paper proposes a fabrication process of deposited layer with micro patterns that uses a combination of a pulsed laser beam machining and an electrodeposition. This process consists of the electrodeposition and the laser beam machining. The deposited layer on metal can be selectively eliminated by laser ablation. As a result, the deposited layer with micro patterns can be fabricated without a mask. The characteristics of the deposited layer on stainless steel were investigated according to the average power and marking speed in the pulsed laser beam machining. The optimal laser beam conditions for precise micro patterning of the deposited layer were determined. Finally, the deposited copper layer with micro text was successfully fabricated by the pulsed laser beam machining.

• Journal of the Korean Society for Precision Engineering
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• v.16 no.2 s.95
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• pp.60-67
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• 1999

Micro-fabrication techniques such as lithography and LIGA processes usually require large investment and are suitable for mass production. Therefore, there is a need for a new micro-fabrication technique that is flexible and more cost effective. In this paper a novel, economical and flexible method of producing micro-pattern on silicon wafer is presented. This method relies on selective removal of mask by mechanical cutting. Then micro-pattern is produced by chemical etching. V-shaped grooved of about 3 ${\mu}m$ wide and 2 ${\mu}m$ deep has been made on ${SiO_2}m$ coated silicon wafer with this method. This method may be utilized for making microstructures in MEMS application at low cost.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.22 no.8
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• pp.682-688
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• 2009

A periodic away of zinc oxide(ZnO) micro-rods as fabricated by using chemical bath deposition and photo-lithography. Vertically aligned ZnO micro-rods array was successfully grown by chemical bath deposition method on ZnO seed layer. The ZnO seed layer was deposited on glass and the patterning was made by standard photo-lithography technique. The selective growth of ZnO micro-rods as achieved with the masked ZnO seed layer. The fabricated ZnO micro rods were found to be single crystalline and have grown along hexagonal c-axis direction of (0002) which is same as the preferred growth orientation of ZnO seed layer.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2012.10a
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• pp.273-274
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• 2012

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2003.06a
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• pp.656-659
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• 2003

Although Hereafter a mass production will claim for patterning nano sized thickness or line in micro-nano industry. existent lithography fabrication has many usable fields, it has complex fabrication steps, expensive values and row work rates. Development of Dip-pen type nano plotter using polymer actuator can construct row cost mass production system because it will change existent lithography fabrication more simple and easy.