• Journal of the Semiconductor & Display Technology
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• v.21 no.3
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• pp.119-124
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• 2022

Top emission organic light-emitting diode (TEOLED) is commonly used because of high efficiency and good color purity than bottom - emission organic light-emitting device (BEOLED). Unlike BEOLED, TEOLED contain semitransparent metal cathode and capping layer. Because there are many characteristics to consider just simple thickness change, optimizing organic thickness of TEOLED for microcavity is difficult. So, in this study, we optimized Device capping layer at unoptimized micro-cavity structure TEOLED device. And we compare only capping layer with unoptimized microcavity structure can overcome optimized micro-cavity structure device. We used previous our optimized micro-cavity structure to compare each other. As a result, it has been found that the efficiency can be obtained almost the same or higher only capping layer, which is stacked on top of the device and controls only the thickness and refractive index, without complicated structural calculations. This means that higher efficiencies can be obtained more easily in laboratories with limited organic materials or when optimizing new structures etc.

• Journal of Sensor Science and Technology
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• v.9 no.5
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• pp.334-340
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• 2000

This paper presents the fabrication of a micro electromagnetic flow sensor for the liquid flow rate measurement. The micro electromagnetic flow sensor has some advantages such as a simple structure, no heat generation, a rapid response and no pressure loss. The principle of the micro electromagnetic flow sensor is based on Faraday's law. If conductive fluid passes through a magnetic field, the electromotive force is generated and detected by two electrodes on the wall of the flow channel. The flow sensor consists of two permanent magnets and a silicon flow channel with two electrodes. The dimension of the flow sensor is $9\;mm\;{\times}\;9\;mm\;{\times}\;1\;mm$. The micro flow channel is mainly fabricated by anisotropic etching of two silicon wafers, and the detection electrodes are fabricated by metal evaporation process. The characteristic of the fabricated flow sensor is obtained experimentally. When the flow rates of water with the conductance of $100-200\;{\mu}S/cm$ are 9.1 ml/min and 62 ml/min, the generated electromotive forces are $261\;{\mu}V$ and 7.3 mV, respectively.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.24 no.3
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• pp.364-370
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• 2020

This paper is related to detection and classification for micro-sized aircraft that flies at low-altitude. The deep-learning based method using sounds coming from the micro-sized aircraft is proposed to detect and identify them efficiently. We use MFCC as sound features and CNN as a detector and classifier. We've proved that each micro-drones have their own distinguishable MFCC feature and confirmed that we can apply CNN as a detector and classifier even though drone sound has time-related sequence. Typically many papers deal with RNN for time-related features, but we prove that if the number of frame in the MFCC features are enough to contain the time-related information, we can classify those features with CNN. With this approach, we've achieved high detection and classification ratio with low-computation power at the same time using the data set which consists of four different drone sounds. So, this paper presents the simple and effecive method of detection and classification method for micro-sized aircraft.

• Journal of the Optical Society of Korea
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• v.17 no.3
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• pp.231-236
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• 2013

We present both theoretically and experimentally the thermo-optic characteristics of micro-structured optical fiber (MOF) filled with mixed liquid. The performance of MOF depends on the efficient interaction between the fundamental mode of the transmitted light wave and the tunable thermo-optic materials in the cladding. The numerical simulation indicates that the confinement loss of MOF presents higher temperature dependence with higher air-filling ratios $d/{\Lambda}$, longer incident wavelength and fewer air holes in the cladding. For the 4cm liquid-filled grapefruit MOF, we demonstrate from experiments that different proportions of solutions lead to tunable temperature sensitive ranges. The insertion loss and the extinction ratio are 3~4 dB and approximate 20 dB, respectively. The proposed liquid-filling MOF will be developed as thermo-optic sensor, attenuator or optical switch with the advantages of simple structure, compact configuration and easy fabrication.

• Proceedings of the IEEK Conference
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• 2003.07d
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• pp.1395-1398
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• 2003

This paper presents a 32-bit RISC Micro-Controller which is useful in the dedicated DSP and communication areas. The designed processor has 5 stages pipeline architecture, and 28 instructions. This RISC Micro-Controller consist of 22,100 gates and has 5.95 ns data arrival time, and 437 ㎽ total dynamic power. The RISC Micro-Controller is a IP (Intellectual property) Core module which can implement a number of protocols by and is applicable to DSP and data communication.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.44 no.8
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• pp.22-29
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• 2007

A 2.5Gb/s 2:1 multiplexer(MUX) IC using $0.18{\mu}m$ CMOS was designed and fabricated. Inductive peaking technology was used to improve the performance. On-chip micro spiral inductor was designed to maximize the inductive peaking effect without increasing the chip area much. The designed 4.7 nH micro-spiral inductor was $20\times20{\mu}m2$ in size. 2:1 MUX with and without micro spiral inductors were compared. The rise and fall time was improved more than 23% and 3% respectively using the micro spiral inductors for 1.25Gb/s signal. For 2.5 Gb/s signal, fall and rise time was improved 5.3% and 3.5% respectively. It consumed 61mW and voltage output swing was 1$180mV_{p-p}$ at 2.5Gb/s.

• JSTS:Journal of Semiconductor Technology and Science
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• v.2 no.3
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• pp.233-236
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• 2002

Some measures are provided for the optimum design of specific on-resistance $R_{on}$ and breakdown-voltage $V_B$ of interdigitated CB (Composite Buffer) MOSFET, including introducing opposite type impurity into the P region near the $N_＋$contact, separating P region from N region with an oxide film, and a groove in the N region near the $P_＋$ contact. The new relationship between the $R_{on}$ and $V_B$, which proved by numerical device simulation, are more exact and minute than the qualitative results before.

• Journal of Electrical Engineering and Technology
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• v.1 no.3
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• pp.387-395
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• 2006

A review on advanced flow visualization techniques is presented particularly for applications to micro scale heat and mass transport measurements. Challenges, development and applications of micro scale visualization techniques are discussed for the study of heating/evaporating thin films, a heated micro channel, and a thermopneumatic micro pump. The developed methods are (1) Molecular Tagging Fluorescence Velocimetry (MTFV) using 10-nm caged seeding molecules (2) Micro Particle Velocimetry (MPIV) and (3) Ratiometric Laser Induced Fluorescence (LIF) for micro-resolution thermometry. These three methods are totally non-intrusive techniques and would be useful to investigate the temperature and flow characteristics in MEMS. Each of these techniques is discussed in three-fold: (1) its operating principle and operation, (2) its application and measurement results, and (3) its future challenges.

• Analytical Science and Technology
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• v.5 no.4
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• pp.359-366
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• 1992

Using micro-Raman spectrometer, we investigated the evaluation of microstress on silicon surface after the local thermal oxidation. The induced stress of silicon surface after local thermal oxidation shows maximum value at the interface of silicon oxide and active area. The smaller the size of active area, the larger stress. From the evaluation of three other device isolation processes, A, B and moB, whose active size has $0.45{\mu}m$ in length, moB process is turned out to have the lowest stress value and the smallest bird's beak effect.

• Journal of Welding and Joining
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• v.31 no.3
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• pp.84-88
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• 2013

These days embedded technology may be the most significant development in the electronics industry. The study focused on the development of active device embedding using flexible printed circuit in view of process and materials. The authors fabricated 30um thickness Si chip without any crack, chipping defects with a dicing before grinding process. In order to embed chips into flexible PCB, the chip pads on a chip are connected to bonding pad on flexible PCB using an ACF film. After packaging, all sample were tested by the O/S test and carried out the reliability test. All samples passed environmental reliability test. In the future, this technology will be applied to the wearable electronics and flexible display in the variety of electronics product.