• Journal of the Korean institute of surface engineering
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• v.32 no.6
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• pp.709-716
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• 1999

Ceramic is select for an alternative substrate material for high-speed circuits due to its low-thermal expansion. As, in this study, ceramic was prepared by ISG (interlayer sol-gel) process using metal salts and a metal alkoxide as the starting materials. Generally ceramic substrate is used electroless copper plating for the metallization. But it has been indicate weakely the adhesion strength between the substrate and copper layer. Therefore, this research, using the ISG process on the preparation of homogeneous and possible preparation at law temperature fabricated sol solution. Using of the dip coating method was coated for the purpose of giving the anchoring effect on the coating layer and enhancing the adhesion strength between the $Al_2$O$_3$ substrate and copper layer. This study examined primary the characteristic of the sol making condition and differential thermal analysis (DTA) X-ray diffraction (XRD) were mearsured to identify the crystal phase of heat treatment specimens. The morphology of the coated films were studied by scanning electron microscopy(SEM). As a resurt, XRD analysis was obtained patterns of $\alpha$-cordierite after heat-treatment about 2 hours at $1000^{\circ}C$. SEM analysis could have seen a large number of voids on coated film. The more contants of$ Al_2$$O_3$ Wt% was increased the more voids was advanced. Peel adhesion strength has a maximum in the contants of the TEOS:ANE of 1:0.7 mole%. In this case, adhesion strength has been measured 1150gf, peel adhesion strength were about 10 times more than uncoated of the ceramics film.

• The Transactions of the Korean Institute of Electrical Engineers C
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• v.52 no.7
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• pp.298-304
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• 2003

IPMC(Ionic Polymer-Metal Composite) is a highly sensitive actuator that shows a large deformation in presence of low applied voltage. Generally, IPMC can be fabricated by electroless plating of platinum on both sides of a Nafion (perfluorosulfonic acid) film. When a commercial Nafion film is used as a base structure of the IPMC membrane, the micro-pump structure and the IPMC membrane are fabricated separately and then later assembled, which makes the fabrication inefficient. Therefore, fabrication of an IPMC membrane and the micro-pump structure on a single wafer without the need of assembly have been developed. The silicon wafer was partially etched to hold liquid Nafion to be casted and a 60-${\mu}{\textrm}{m}$ thick IPMC membrane was realized. IPMC membranes with various size were fabricated by casting and they showed 4-2${\mu}{\textrm}{m}$ displacements from $4mm{\times}4mm$ , $6mm{\times}6mm$, $8mm{\times}8mm$ membranes at the applied voltage ranging from 2Vp-p to 5Vp-p at 0.5Hz. The displacement of the fabricated IPMC membranes is fairly proportional to the membrane area and the applied voltage.

• Membrane Journal
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• v.28 no.4
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• pp.252-259
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• 2018

An acidic, real metal-plating wastewater was treated by a fluidized bed membrane reactor introduced with granular activated carbon (GAC) as fluidized media. With GAC fluidization, there was no increase in suction pressure with time at each flux set-point applied. At neutral solution pH, much less fouling rate was observed than acidic pH under GAC fluidization. Higher solution pH resulted in the increase in particle size in metal-finishing wastewater, thus producing a less dense cake structure on membrane. More than 95% of chemical oxygen demand was observed from the fluidized bed membrane reactor under GAC fluidization. Total suspended solid concentration in membrane permeate was near zero. At the raw wastewater pH, no removal of copper and chromium by the fluidized bed membrane reactor was observed. As the pH was increased to 7.0, removal efficiency of copper and chromium was increased considerably to 99 and 94%, respectively. Regardless of solution pH tested, more than 95% of cyanide was removed possibly due to the strong adsorption of organic-cyanide complex on GAC in fluidized bed membrane reactor.

• Journal of Advanced Navigation Technology
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• v.6 no.3
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• pp.195-202
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• 2002

Recently, as the range of mobile communication services is extended, the interference between adjacent base-stations is increased. Nowdays, one of the important factors causing interference is IMD (Inter-Modulation Distortion) problems. Not only active IMD but also passive IMD effects must be considered to design a CDMA system. In this study, we design and implement 7/16" DIN connectors which have a various intensity of surface illumination, thickness and quality of plating material to analyze the effects of PIMD. And propose the methods for improving the PIMD characteristics: First, it is more profitable to use the metal which has good intensity of surface illumination where most of all electric currents passes through it. Secondly, we should plate metals more than $5{\mu}m$ for RF energy enough to propagate in a medium. Thirdly, it is necessary to select a metal having high conductivity and specific heat to protect the aging phenomenon of plate material. And it is required to develop a new plating material to replace the current materials, such as the alloy of three components for cost reduction. We have to know that the plate which has intensity of surface illumination 6 S and the thickness of plating material $5{\mu}m$ satisfy the domestic PIMD specification (KTF) -150 dBc, regardless of the plate material in case of 7/16" DIN connector.

• Journal of Environmental Science International
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• v.29 no.11
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• pp.1055-1064
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• 2020

In this research, heavy metals and T-P removal characteristics of plated wastewater are derived using BPC(Break Point Chlorination) process. AA sedimentation pond outflow(Influence) was evaluated for the removal efficiency of heavy metal(Ni) and T-P at a reaction time of 25 minutes by NaOCl input volume(9, 11, 13 and 15 mL). In the case, the higher the NaOCl input volumes, the higher the ORP values were maintained and the higher the removal efficiency tended to be. On the other hand, T-P was judged to have a low relationship between the ORP value and the removal efficiency. In addition, the efficiency of removal heavy metals and T-P in the plated wastewater by injecting 10 mL, 15 mL, 20 mL and 25 mL NaOCl, increased as the amount of NaOCl injected increased, the amount of NaOH input for pH increased. It was found that suspended solid in effluence also increased. It was also observed that the color of the plating wastewater changed from yellowish green to green to charcoal gray to black as the amount of NaOCl injected increased. Treatment characteristics of the reaction time, the longer the reaction time with the substance to be treated after the input of NaOCl, the more the heavy metal removal efficiency tended to increase. Through XRF analysis of the sludge, the constituents in the sludge such as NaCNO, CNCl, Na₃PO₄, CrO₄, 2Na₂CrO₄ and 2NaNO₃ will be analyzed in detail, and the mechanisms of the reaction between the plated wastewater and the complex compound will be elucidated.

• Applied Chemistry for Engineering
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• v.23 no.6
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• pp.554-560
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• 2012

Recently, it has been increasing trend to use conductive materials as electronics and communication technology in electronics industry are developing. The noble metal such as Ag, Pt, Pd etc. are mostly used as conductive materials, To reduce production cost, alternative materials with similar characteristics of noble metals are needed. Copper has advantages, i.e its electronic properties are similar to noble metals and low cost than noble metal, but its use has been restricted because of oxidation in air. In this study, the tin film was coated on copper by electroless plating to protect copper from oxidation and to confirm the effects of temperature, pH, amount of $SnCl_2$, and feeding speed in plating conditions. Additionally, we apply $Cu_{core}Sn_{shell}$ powder as conductive filler with low-temperature densification and analysis by SEM, XRD, FIB and 4-Point Probe techniques. As result of the study, tin film was coated well on copper and was protected from oxidation. After low-temperature densification treatment, the meted tin made chemical interconnections with copper. Accordingly, conductivity was increased than before condition. We hope $Cu_{core}Sn_{shell}$ powder to replace noble metals and use in the electronic field.

• 한국태양에너지학회:학술대회논문집
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• 2009.04a
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• pp.225-229
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• 2009

The front metal contact is one of the most important element influences in efficiency in the silicon solar cell. First of all selective of the material and formation method is important in metal contacts. Commercial solar cells with screen-printed contacts formed by using Ag paste process is simple relatively and mass production is easy. But it suffer from a low fill factor and a high shading loss because of high contact resistance. Besides Ag paste too expensive. because of depends income. This paper applied for Ni/Cu metallization replace for paste of screen printing front metal contact. Low cost Ni and Cu metal contacts have been formed by using electroless plating and electroplating techniques to replace the screen-printed Ag contacts. Ni has been proposed as a suitable silicide for the salicidation process and is expected to replace conventional silicides. Copper is a promising material for the electrical contacts in solar cells in terms of conductivity and cost. In experiments Ni/Cu metal contact applied same grid formation of screen-printed solar cell. And it has variation of different grid spacing. It was verified that the wide spacing of grid finger could increase the series resistance also the narrow spacing of grid finger also implies a grid with a higher density of grid fingers. Through different grid spacing found alteration of efficiency.

• Resources Recycling
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• v.13 no.2
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• pp.3-8
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• 2004

A basic study on the recovery of heavy metals such as Zn, Ni, Cu and Fe ions from wastewater was carried out with the spent iron oxide catalyst, which was used in the Styrene Monomer(SM) production company. The heavy metals could be recovered more than 98％ with the spent iron oxide catalyst. The alkaline components of the spent catalyst could be precipitated the metal ions of the wastewater as metal hydroxides at the higher pH 10.6 in Ni, pH 8.0 in Cu, pH 6.5 in Fe, pH 8.5 in Zn. But the metal ions are adsorbed physically on the surface of the spent catalyst in the range of the pH of the metal hydroxides and pH 3.0, which is the isoelectric point of the iron oxide catalyst.

• Smart Structures and Systems
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• v.26 no.4
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• pp.507-520
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• 2020

In order to achieve effective corrosion monitoring of buried metal pipelines, a Novel nondestructive Testing (NDT) methodology using ultra-long (250 mm) Polymer Optical Fiber (POF) sensors coated with the Fe-C alloy film is proposed in this study. The theoretical principle is investigated to clarify the monitoring mechanism of this method, and the detailed fabrication process of this novel POF sensor is presented. To validate the feasibility of this novel POF sensor, exploratory research of the proposed method was performed using simulated corrosion tests. For simplicity, the geometric shape of the buried pipeline was simulated as a round hot-rolled plain steel bar. A thin nickel layer was applied as the inner plated layer, and the Fe-C alloy film was coated using an electroless plating technique to precisely control the thickness of the alloy film. In the end, systematic sensitivity analysis on corrosion severity was further performed with experimental studies on three sensors fabricated with different metal layer thicknesses of 25 ㎛, 30 ㎛ and 35 ㎛. The experimental observation demonstrated that the sensor coated with 25 ㎛ Fe-C alloy film presented the highest effectiveness with the corrosion sensitivity of 0.3364 mV/g at Δm = 9.32 × 10^-4 g in Stage I and 0.0121 mV/g in Stage III. The research findings indicate that the detection accuracy of the novel POF sensor proposed in this study is satisfying. Moreover, the simple fabrication of the high-sensitivity sensor makes it cost-effective and suitable for the on-site corrosion monitoring of buried metal pipelines.

• Journal of Sensor Science and Technology
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• v.22 no.2
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• pp.130-135
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• 2013

This study proposed a noble process to fabricate TSV (Through Silicon Via) structure which has lower cost, shorter production time, and more simple fabrication process than plating method. In order to produce the via holes, the Si wafer was etched by a DRIE (Deep Reactive Ion Etching) process. The via hole was $100{\mu}m$ in diameter and $400{\mu}m$ in depth. A dielectric layer of $SiO_2$ was formed by thermal oxidation on the front side wafer and via hole side wall. An adhesion layer of Ti and a seed layer of Au were deposited. Soldering process was applied to fill the via holes with solder paste and metal powder. When the solder paste was used as via hole metal line, sintering state and electrical properties were excellent. However, electrical connection was poor due to occurrence of many voids. In the case of metal powder, voids were reduced but sintering state and electrical properties were bad. We tried the via hole filling process by using mixing solder paste and metal powder. As a consequence, it was confirmed that mixing rate of solder paste (4) : metal powder (3) was excellent electrical characteristics.