• Title/Summary/Keyword: maskless

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Manufacturing process of micro-nano structure for super hydrophobic surface (초발수 표면을 만들기 위한 마이크로-나노 몰드 제작 공정)

  • Lim, Dong-Wook;Park, Kyu-Bag;Park, Jung-Rae;Ko, Kang-Ho;Lee, Jeong-woo;Kim, Ji-Hun
    • Design & Manufacturing
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    • v.15 no.4
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    • pp.57-64
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    • 2021
  • In recent materials industry, researches on the technology to manufacture super hydrophobic surface by effectively controlling the wettability of solid surface are expanding. Research on the fabrication of super hydrophobic surface has been studied not only for basic research but also for self-cleaning, anti-icing, anti-friction, flow resistance reduction in construction, textile, communication, military and aviation fields. A super hydrophobic surface is defined as a surface having a water droplet contact angle of 150 ° or more. The contact angle is determined by the surface energy and is influenced not only by the chemical properties of the surface but also by the rough structure. In this paper, maskless lithography using DMD, electro etching, anodizing and hot embossing are used to make the polymer resin PMMA surface super hydrophobic. In the fabrication of microstructure, DMDs are limited by the spacing of microstructure due to the structural limitations of the mirrors. In order to overcome this, maskless lithography using a transfer mechanism was used in this paper. In this paper, a super hydrophobic surface with micro and nano composite structure was fabricated. And the wettability characteristics of the micro pattern surface were analyzed.

Development of Microlens Array for Maskless Lithography Application (Maskless lithography 응용을 위한 마이크로렌즈 어레이 개발)

  • Nam, Min-Woo;Oh, Hae-Kwan;Kim, Geun-Young;Seo, Hyun-Woo;Wei, Chang-Hyun;Song, Yo-Tak;Yang, Sang-Sik;Lee, Kee-Keun
    • Journal of the Microelectronics and Packaging Society
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    • v.16 no.4
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    • pp.33-39
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    • 2009
  • A microlens array (MLA) was developed based on the wet-etched quartz substrate and coating of UV adhesive on the substrate for maskless lithography application. The developed MLA has the focal length of ${\sim}45\;{\mu}m$ and the spot size of ${\sim}1\;{\mu}m$. The spot size of the focused beam passing through the MLA was detected by CCD camera, and its intensity was monitored by beam profiler. Uniform spots with nearly identical intensities were observed on the focal plane when a beam passes through the fabricated MLA. The focal length was varied depending on thickness of the coated UV adhesive. The thicker the thickness of the UV adhesive was, the shorter the focal length of the MLA was. With a general mask aligner, UV beam focusing was tested onto photoresist (PR). The beams were well focused onto PR when UV passes through the MLA. Depending on the variable distances from the MLA, beam sizes onto PR were controlled. Even at high temperature for a long time, the performances of the MLA were not changed.

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A Study on the Fabrication of Sub-Micro Mold for PDMS Replica Molding Process by Using Hyperfine Mechanochemical Machining Technique (기계화학적 극미세 가공기술을 이용한 PDMS 복제몰딩 공정용 서브마이크로 몰드 제작에 관한 연구)

  • 윤성원;강충길
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 2004.10a
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    • pp.351-354
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    • 2004
  • This work presents a simple and cost-effective approach for maskless fabrication of positive-tone silicon master for the replica molding of hyperfine elastomeric channel. Positive-tone silicon masters were fabricated by a maskless fabrication technique using the combination of nanoscratch by Nanoindenter ⓡ XP and XOH wet etching. Grooves were machined on a silicon surface coated with native oxide by ductile-regime nanoscratch, and they were etched in a 20 wt% KOH solution. After the KOH etching process, positive-tone structures resulted because of the etch-mask effect of the amorphous oxide layer generated by nanoscratch. The size and shape of the positive-tone structures were controlled by varying the etching time (5, 15, 18, 20, 25, 30 min) and the normal loads (1, 5 mN) during nanoscratch. Moreover, the effects of the Berkovich tip alignment (0, 45$^{\circ}$) on the deformation behavior and etching characteristic of silicon material were investigated.

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Laser Microfabrications for Next-Generation Flat Panel Display (레이저를 이용한 차세대 평판 디스플레이 공정)

  • Kim, Kwang-Ryul
    • Korean Journal of Materials Research
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    • v.17 no.7
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    • pp.352-357
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    • 2007
  • Since a pattern defects "repair" system using a diode pumped solid state laser for Flat Panel Display (FPD) was suggested, a lot of laser systems have been explored and developed for mass-production microfabrication process. A maskless lithography system using 405 nm violet laser and Digital Micromirror Device (DMD) has been developed for PDP and Liquid Crystal Display (LCD) Thin Film Transistor (TFT) photolithography process. In addition, a "Laser Direct Patterning" system for Indium Tin Oxide (ITO) for Plasma Display Panel(PDP) has been evaluated one of the best successful examples for laser application system which is applied for mass-production lines. The "heat" and "solvent" free laser microfabrications process will be widely used because the next-generation flat panel displays, Flexible Display and Organic Light Emitting Diode (OLED) should use plastic substrates and organic materials which are very difficult to process using traditional fabrication methods.

Forming a Fresnel Zone Lens: Effects of Photoresist on Digital-micromirror-device Maskless Lithography with Grayscale Exposure

  • Huang, Yi-Hsiang;Jeng, Jeng-Ywan
    • Journal of the Optical Society of Korea
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    • v.16 no.2
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    • pp.127-132
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    • 2012
  • This study discusses photoresist forming using a composite grayscale to fabricate a Fresnel lens. Grayscale lithography is a common production method used to facilitate the forming of lenses with different curvatures and depths. However, this approach is time consuming and expensive. This study proposes a method for overcoming these obstacles by integrating a digital micromirror device and microscope to supplant the traditional physical grayscale mask. This approach provides a simple and practical maskless optical lithography system. According to the results, the two adjacent grayscales displayed substantial differences between the high grayscale and influence the low grayscale that ultimately affected photoresist formation. Furthermore, we show that change of up to 150% in the slope can be achieved by changing the grayscale gradient in the central zone and the ring profile. The results of the optical experiment show a focus change with different gray gradients.

Novel Bumping Process for Solder on Pad Technology

  • Choi, Kwang-Seong;Bae, Ho-Eun;Bae, Hyun-Cheol;Eom, Yong-Sung
    • ETRI Journal
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    • v.35 no.2
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    • pp.340-343
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    • 2013
  • A novel bumping process using solder bump maker is developed for the maskless low-volume solder on pad (SoP) technology of fine-pitch flip chip bonding. The process includes two main steps: one is the aggregation of powdered solder on the metal pads on a substrate via an increase in temperature, and the other is the reflow of the deposited powder to form a low-volume SoP. Since the surface tension that exists when the solder is below its melting point is the major driving force of the solder deposit, only a small quantity of powdered solder adjacent to the pads can join the aggregation process to obtain a uniform, low-volume SoP array on the substrate, regardless of the pad configurations. Through this process, an SoP array on an organic substrate with a pitch of $130{\mu}m$ is successfully formed.

Novel Bumping Material for Solder-on-Pad Technology

  • Choi, Kwang-Seong;Chu, Sun-Woo;Lee, Jong-Jin;Sung, Ki-Jun;Bae, Hyun-Cheol;Lim, Byeong-Ok;Moon, Jong-Tae;Eom, Yong-Sung
    • ETRI Journal
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    • v.33 no.4
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    • pp.637-640
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    • 2011
  • A novel bumping material, which is composed of a resin and Sn3Ag0.5Cu (SAC305) solder power, has been developed for the maskless solder-on-pad technology of the fine-pitch flip-chip bonding. The functions of the resin are carrying solder powder and deoxidizing the oxide layer on the solder power for the bumping on the pad on the substrate. At the same time, it was designed to have minimal chemical reactions within the resin so that the cleaning process after the bumping on the pad can be achieved. With this material, the solder bump array was successfully formed with pitch of 150 ${\mu}m$ in one direction.

Study on the Masking Effect of the Nanoscratched Si (100) Surface and Its Application to the Maskless Nano Pattern fabrication (마스크리스 나노 패턴제작을 위한 나노스크래치 된 Si(100) 표면의 식각 마스크 효과에 관한 연구)

  • 윤성원;강충길
    • Journal of the Korean Society for Precision Engineering
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    • v.21 no.5
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    • pp.24-31
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    • 2004
  • Masking effect of the nanoscratched silicon (100) surface was studied and applied to a maskless nanofabrication technique. First, the surface of the silicon (100) was machined by ductile-regime nanomachining process using the scratch option of the Nanoindenter${ \circledR}$ XP. To clarify the possibility of the nanoscratched silicon surfaces for the application to wet etching mask, the etching characteristic with a KOH solution was evaluated at room temperature. After the etching process, the convex nanostructures were made due to the masking effect of the mechanically affected layer. Moreover, the height and the width of convex structures were controlled with varying normal loads during nanoscratch.

Development of CCTV for Identification of Maskless Wearers based on Deep Learning (딥러닝 기반 마스크 미착용자 식별 CCTV 개발)

  • Lee, Se-Hoon;Kwon, Hyeon-guen;Kim, Young-Jin;Jeong, Ji-Seok;Seo, Hee-Ju
    • Proceedings of the Korean Society of Computer Information Conference
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    • 2020.07a
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    • pp.317-318
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    • 2020
  • 본 논문에서는 얼굴검출 후 MobilnetV2의 방법을 이용하여 적은 연산량으로 CCTV가 실시간으로 마스크 착용 유무를 판단할 수 있는 방법을 제시하였다. 이를 통해 현재 이슈가 되고있는 코로나19 등 전염병의 전염 위험이 있는 주요 장소에서 인공지능 CCTV가 마스크 미착용자를 식별해 알려줌으로써 마스크 미착용자를 관리할 수 있는 방법을 제공하였다.

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