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http://dx.doi.org/10.4218/etrij.13.0212.0302

Novel Bumping Process for Solder on Pad Technology  

Choi, Kwang-Seong (IT Materials and Components Lab., ETRI)
Bae, Ho-Eun (IT Materials and Components Lab., ETRI)
Bae, Hyun-Cheol (IT Materials and Components Lab., ETRI)
Eom, Yong-Sung (IT Materials and Components Lab., ETRI)
Publication Information
ETRI Journal / v.35, no.2, 2013 , pp. 340-343 More about this Journal
Abstract
A novel bumping process using solder bump maker is developed for the maskless low-volume solder on pad (SoP) technology of fine-pitch flip chip bonding. The process includes two main steps: one is the aggregation of powdered solder on the metal pads on a substrate via an increase in temperature, and the other is the reflow of the deposited powder to form a low-volume SoP. Since the surface tension that exists when the solder is below its melting point is the major driving force of the solder deposit, only a small quantity of powdered solder adjacent to the pads can join the aggregation process to obtain a uniform, low-volume SoP array on the substrate, regardless of the pad configurations. Through this process, an SoP array on an organic substrate with a pitch of $130{\mu}m$ is successfully formed.
Keywords
Maskless bumping; low-volume solder on pad (SoP) technology; resin; powdered solder; Sn3.0Ag0.5Cu;
Citations & Related Records
Times Cited By KSCI : 4  (Citation Analysis)
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