Novel Bumping Material for Solder-on-Pad Technology
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Choi, Kwang-Seong
(Convergence Components & Materials Research Laboratory, ETRI)
Chu, Sun-Woo (Convergence Components & Materials Research Laboratory, ETRI) Lee, Jong-Jin (Convergence Components & Materials Research Laboratory, ETRI) Sung, Ki-Jun (Convergence Components & Materials Research Laboratory, ETRI) Bae, Hyun-Cheol (Convergence Components & Materials Research Laboratory, ETRI) Lim, Byeong-Ok (Convergence Components & Materials Research Laboratory, ETRI) Moon, Jong-Tae (Convergence Components & Materials Research Laboratory, ETRI) Eom, Yong-Sung (Convergence Components & Materials Research Laboratory, ETRI) |
1 | R. Lathrop, "Semiconductor Packaging Solutions Utilizing Fine Powder Solder Paste," Proc. Int. Wafer-Level Packaging Conf., 2008, pp. 129-136. |
2 | K.-S. Choi et al., "Novel Maskless Bumping for 3D Integration," ETRI J., vol. 32, no. 2, Apr. 2010, pp. 342-344. DOI |
3 | Y.-S. Eom et al., "Characterization of Polymer Matrix and Low Melting Point Solder for Anisotropic Conductive Film," Microelectron. Eng., vol. 85, 2008, pp. 327-331. DOI ScienceOn |
4 | Y.S. Eom et al., "Electrical Interconnection with a Smart ACA Composed of Fluxing Polymer and Solder Powder," ETRI J., vol. 32, no. 3, June 2009, pp. 414-421. DOI |
5 | IPC Std. J-STD-005, "Requirements for Soldering Pastes." |
6 | K.S. Jang et al., "Catalytic Behavior of Sn/Bi Metal Powder in Anhydride-Based Epoxy Curing," J. Nanosci. Nanotechnol., vol. 9, no. 12, 2009, pp. 7461-7466. |
7 | S.C. Johnson, "Flip-Chip Packaging Becomes Competitive," Semiconductor Int., May 2009. |
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