• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.19 no.6
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• pp.834-840
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• 2010

Photo lithography process is very important technology to fabricate highly integrated micro patterns with high precision for semiconductor and display industries. Up to now, mask type lithography process has been generally used for this purpose; however, it is not efficient for small quantity and/or frequently changing products. Therefore, in order to obtain higher productivity and lower manufacturing cost, the mask type lithography process should be replaced. In this study, a maskless lithography system using the DMD(Digital Micromirror Device) is developed, and the exposure condition and optical properties are analyzed and simulated for a single beam case. From the proposed experimental conditions, required exposure experiments were preformed, and the results were investigated. As a results, 10${\mu}m$ spots can be generated at optimal focal length.

• ETRI Journal
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• v.32 no.2
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• pp.342-344
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• 2010

A novel, maskless, low-volume bumping material, called solder bump maker, which is composed of a resin and low-melting-point solder powder, has been developed. The resin features no distinct chemical reactions preventing the rheological coalescence of the solder, a deoxidation of the oxide layer on the solder powder for wetting on the pad at the solder melting point, and no major weight loss caused by out-gassing. With these characteristics, the solder was successfully wetted onto a metal pad and formed a uniform solder bump array with pitches of 120 ${\mu}m$ and 150 ${\mu}m$.

• Journal of the Korean Graphic Arts Communication Society
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• v.28 no.1
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• pp.65-75
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• 2010

Environmentally friendly, stencil and screen printing for cost-effective for maskless. In this study, UV -LED light source for the dispersion characteristics and high competence photoresist coating was prepared. Wavelength of 365nm UV-LED exposure device using the maskless lithography, 1.7kgf/$cm^2$ $2600mmH_2O$ the injection pressure and the suction pressure by using a dry photoconductor symptoms were dry emulsion on the market as a result, curing properties and adhesion, hardness, solvent resistance and excellent reproduction of fine patterns and ecological stencil technology was available and could be confirmed as a possibility.

• Journal of Biomedical Engineering Research
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• v.30 no.6
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• pp.453-460
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• 2009

In this review paper, concepts in optofluidics are applied to an advanced manufacturing technology based on self-assembled microparts. The "optical" aspect of optofluidics will be described in the context of photolithography, and the "fluidic" aspect will be discussed in the context of self-assembly. First, optofluidic maskless lithography will be introduced as a dynamic fabrication method to generate microparticles in microfluidic channels. Next, the history and application of optofluidic lithography will be presented.

• Journal of the Optical Society of Korea
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• v.16 no.3
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• pp.221-227
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• 2012

We propose optical proximity corrections (OPCs) for digital micromirror device (DMD)-based maskless lithography. A pattern writing scheme is analyzed and a theoretical model for obtaining the dose distribution profile and resulting structure is derived. By using simulation based on this model we were able to reduce the edge placement error (EPE) between the design width and the critical dimension (CD) of a fabricated photoresist, which enables improvement of the CD. Moreover, by experiments carried out with the parameter derived from the writing scheme, we minimized the corner-rounding effect by controlling light transmission to the corners of a feature by modulating a DMD.

• ETRI Journal
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• v.37 no.2
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• pp.387-394
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• 2015

A novel interconnection technology based on a 52InSn solder was developed for flexible display applications. The display industry is currently trying to develop a flexible display, and one of the crucial technologies for the implementation of a flexible display is to reduce the bonding process temperature to less than $150^{\circ}C$. InSn solder interconnection technology is proposed herein to reduce the electrical contact resistance and concurrently achieve a process temperature of less than $150^{\circ}C$. A solder bump maker (SBM) and fluxing underfill were developed for these purposes. SBM is a novel bumping material, and it is a mixture of a resin system and InSn solder powder. A maskless screen printing process was also developed using an SBM to reduce the cost of the bumping process. Fluxing underfill plays the role of a flux and an underfill concurrently to simplify the bonding process compared to a conventional flip-chip bonding using a capillary underfill material. Using an SBM and fluxing underfill, a $20{\mu}m$ pitch InSn solder SoP array on a glass substrate was successfully formed using a maskless screen printing process, and two glass substrates were bonded at $130^{\circ}C$.

• JSTS:Journal of Semiconductor Technology and Science
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• v.1 no.2
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• pp.132-139
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• 2001

We considered the uniformity of fabricated micromirror arrays by characterizing the fabrication process and calculating the appropriate driving voltages of micromirrors used as virtual photomask in maskless photolithography. The uniformity of the micromirror array in terms of driving voltage and optical characteristics is adversely affected by factors, such as the air gap between the bottom electrode and the mirror plate, the spring shape and the deformation of the mirror plate or torsion spring. The thickness deviation of the photoresist sacrificial layer, the misalignment between mirror plate and bottom electrode, the aluminum deposition condition used to produce the spring and the mirror plate, and initial mirror deflection were identified as key factors. Their importance lies in the fact that they are related to air gap deviations under the mirror plate, asymmetric driving voltages in left and right mirror directions, and the deformation of the Al sring or mirror plate after removal of the sacrificial layer. The plasma ashing conditions used for removing the sacrificial layer also contributed to the deformation of the mirror plate and spring. Driving voltages were calculated for the pixel operation of the micromirror array, and the non-uniform characteristics of fabricated micromirrors were taken into consideration to improve driving performance reliability.

• ETRI Journal
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• v.37 no.3
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• pp.523-532
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• 2015

Recently, we have witnessed the gradual miniaturization of electronic devices. In miniaturized devices, flip-chip bonding has become a necessity over other bonding methods. For the electrical connections in miniaturized devices, fine-pitch solder bumping has been widely studied. In this study, high-volume solder-on-pad (HV-SoP) technology was developed using a novel maskless printing method. For the new SoP process, we used a special material called a solder bump maker (SBM). Using an SBM, which consists of resin and solder powder, uniform bumps can easily be made without a mask. To optimize the height of solder bumps, various conditions such as the mask design, oxygen concentration, and processing method are controlled. In this study, a double printing method, which is a modification of a general single printing method, is suggested. The average, maximum, and minimum obtained heights of solder bumps are $28.3{\mu}m$, $31.7{\mu}m$, and $26.3{\mu}m$, respectively. It is expected that the HV-SoP process will reduce the costs for solder bumping and will be used for electrical interconnections in fine-pitch flip-chip bonding.

• ETRI Journal
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• v.35 no.4
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• pp.625-631
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• 2013

For the formation of solder bumps with a fine pitch of 130 ${\mu}m$ on a printed circuit board substrate, low-volume solder on pad (LVSoP) technology using a maskless method is developed for SAC305 solder with a high melting temperature of $220^{\circ}C$. The solder bump maker (SBM) paste and its process are quantitatively optimized to obtain a uniform solder bump height, which is almost equal to the height of the solder resist. For an understanding of chemorheological phenomena of SBM paste, differential scanning calorimetry, viscosity measurement, and physical flowing of SBM paste are precisely characterized and observed during LVSoP processing. The average height of the solder bumps and their maximum and minimum values are 14.7 ${\mu}m$, 18.3 ${\mu}m$, and 12.0 ${\mu}m$, respectively. It is expected that maskless LVSoP technology can be effectively used for a fine-pitch interconnection of a Cu pillar in the semiconductor packaging field.

• Journal of the Optical Society of Korea
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• v.17 no.6
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• pp.513-517
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• 2013

Recently, maskless lithography (ML) systems have become popular in digital manufacturing technologies. To achieve high-throughput manufacturing processes, digital micromirror devices (DMD) in ML systems must be driven to their operational limits, often in harsh conditions. We propose an instrument and algorithm to detect DMD malfunctions to ensure perfect mask image transfer to the photoresist in ML systems. DMD malfunctions are caused by either bad DMD pixels or data transfer errors. We detect bad DMD pixels with $20{\times}20$ pixel by white and black image tests. To analyze data transfer errors at high frame rates, we monitor changes in the frame rate of a target DMD pixel driven by the input data with a set frame rate of up to 28000 frames per second (fps). For our data transfer error detection method, we verified that there are no data transfer errors in the test by confirming the agreement between the input frame rate and the output frame rate within the measurement accuracy of 1 fps.