• 한국표면공학회지
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• 제41권3호
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• pp.102-108
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• 2008

In this paper, the LiF and polymer thin film as passivation layer have been evaporated on green OLED devices. HDPE, polyacenaphthylene, polytetrafluoroethylene, poly(2,6-dimethyl-1,4-pheneylene oxide), poly sulfone and poly(dimer-acid-co-alkyl poly-amine) have been used as polymer materials. The optical transmittance of evaporated polymer thin film was very good as an above 90% in visible range. The morphology of polymer thin film was measured by AFM. As a result of the measurement average roughness($R_a$) value of the polysulfone was very low as 2.2 nm. The green OLED devices with a structure of ITO/HIL/HTL/EML/Buffer/Al in series of various passivation films were fabricated and analyzed. It was observed that an OLED device with LiF as first passivation film has shown the good electrical and optical property, and all kind of polymer films did not influence on the I-V-L characteristics and the life time of OLED devices. Therefore, we found that polymer layer played a key role as a buffer layer between the inorganic passivation layers to relieve the stress of the inorganic layers.

• 대한전기학회논문지:전기물성ㆍ응용부문C
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• 제48권9호
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• pp.623-627
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• 1999

We report a new in-situ fluorine passivation method without in implantation by employing excimer laser annealing of $SiO_{x}F_{y}$/a-Si structure and its effects on p-channel poly-Si TFTs. The proposed method doesn't require any additional annealing step and is a low temperature process because fluorine passivation is simultaneous with excimer-laser-induced crystallization. A in-situ fluorine passivation by the proposed method was verified form XPS analysis and conductivity measurement. From experimental results, it has been shown that the proposed method is effective to improve the electrical characteristics, specially field-effect mobility, and the electrical stability of p-channel poly-Si TFTs. The improvement id due to fluorine passivation, which reduces the trap state density and forms the strong Si-F bonds in poly-Si channel and $SiO_2/poly-Si$ interface. From these results, the high performance poly-Si TFTs canbe obtained by employing the excimer-laser-induced fluorine passivation method.

• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2008년도 International Meeting on Information Display
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• pp.420-423
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• 2008

The characteristics of $Al_2O_3/Ag/Al_2O_3$ multilayer passivaton prepared by twin target sputtering (TTS) system for organic light emitting diodes. The $Al_2O_3/Ag/Al_2O_3$ multilayer thin film passivation on a PET substrate had a high transmittance of 86.44 % and low water vapor transmission rate (WVTR) of $0.011\;g/m^2$-day due to the surface plasmon resonance (SPR) effect of Ag interlayer and effective multilayer structure for preventing the intrusion of water vapor. Using synchrotron x-ray scattering and field emission scanning electron microscope (FESEM) examinations, we investigated the growth behavior of Ag layer on the $Al_2O_3$ layer to explain the SPR effect of the Ag layer. This indicates that an $Al_2O_3/Ag/Al_2O_3$ multilayer passivation is a promising thin film passivation scheme for organic based flexible optoelectronics.

• 한국재료학회지
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• 제23권1호
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• pp.35-40
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• 2013

In this study, the influence on the surface passivation properties of crystalline silicon according to silicon wafer thickness, and the correlation with a-Si:H/c-Si heterojunction solar cell performances were investigated. The wafers passivated by p(n)-doped a-Si:H layers show poor passivation properties because of the doping elements, such as boron(B) and phosphorous(P), which result in a low minority carrier lifetime (MCLT). A decrease in open circuit voltage ($V_{oc}$) was observed when the wafer thickness was thinned from $170{\mu}m$ to $50{\mu}m$. On the other hand, wafers incorporating intrinsic (i) a-Si:H as a passivation layer showed high quality passivation of a-Si:H/c-Si. The implied $V_{oc}$ of the ITO/p a-Si:H/i a-Si:H/n c-Si wafer/i a-Si:H/n a-Si:H/ITO stacked layers was 0.715 V for $50{\mu}m$ c-Si substrate, and 0.704 V for $170{\mu}m$ c-Si. The $V_{oc}$ in the heterojunction solar cells increased with decreases in the substrate thickness. The high quality passivation property on the c-Si led to an increasing of $V_{oc}$ in the thinner wafer. Short circuit current decreased as the substrate became thinner because of the low optical absorption for long wavelength light. In this paper, we show that high quality passivation of c-Si plays a role in heterojunction solar cells and is important in the development of thinner wafer technology.

• 마이크로전자및패키징학회지
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• 제23권1호
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• pp.11-15
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• 2016

유기발광다이오드(orgianic light emitting diodes, OLEDs)는 대형 유연 디스플레이와 발광원으로서 사물인터넷 (IoT)의 하드웨어 기기 등 다양한 분야에서 연구가 진행되고 있다. 그러나 낮은 일함수의 금속 및 쉽게 반응하는 유기재료 자체의 특성으로 인하여 외부환경에 매우 취약한 단점을 가지고 있으며 특히, 수분과 산소에 민감하여 외부와의 접촉 시 성능이 급속도로 저하되는 현상을 나타내게 된다. 이를 방지하기 위해 PVD, CVD, ALD 와 같은 방법으로 보호막 형성 연구를 진행 중에 있지만 복잡한 공정 및 높은 비용의 문제점 등이 있다. 그러므로 외부 환경에 의한 성능 저하를 차단해주는 저렴하고 단순한 공정의 페시베이션(passivation) 박막 기술 개발이 매우 중요하다. 본 연구에서는 유기발광다이오드의 수명 향상을 위하여 스핀코팅(spin-coating) 방법으로 녹색 유기발광다이오드 소자 위에 조성비에 따른 페시베이션 박막을 형성한 후 녹색 유기발광다이오드의 휘도특성 변화를 조사하였다. 페시베이션 용액은 poly vinyl alcohol (PVA)를 기반으로 sodium alginate (SA)를 0, 10, 20, 40 wt%의 조성비로 제조하였으며, 40 wt%의 조성비에서 가장 좋은 배리어 보호 특성을 나타내었다. 최종적으로 PVA + SA 용액의 최적화된 페시베이션 보호막을 제작할 수 있었다.

• Korean Chemical Engineering Research
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• 제48권4호
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• pp.511-514
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• 2010

불소계 고분자 물질인 $Cytop^{TM}$ 박막을 간단하고 경제적인 스핀코팅 방법을 이용하여 반도체 표면에 선택적으로 형성시킨 후, AlGaN/GaN HEMT 소자의 반도체 보호막(passivation layer)으로써 활용가능성을 고찰하기 위하여 전기적 특성이 분석되었다. $Cytop^{TM}$ 보호막이 적용된 AlGaN/GaN HEMT 소자와 적용되지 않은 소자의 게이트 래그 특성이 비교되었다. 보호막이 적용된 소자는 dc 대비 65%의 향상된 펄스 드레인 전류를 보였다. HEMT 소자의 rf 특성이 측정되었으며, $Cytop^{TM}$ 박막이 적용된 소자는 PECVE $Si_3N_4$ 보호막이 적용된 소자와 유사한 소자 특성을 나타냈다. 이는 게이트와 드레인 사이에 존재하는 표면상태 트랩의 보호막에 의한 감소에 의한 것으로 판단된다.

• 한국전기전자재료학회논문지
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• 제27권3호
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• pp.137-140
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• 2014

With the recent advent of through silicon via (TSV) technology, wafer level-TSV interconnection become feasible in high volume manufacturing. To increase the manufacturing productivity, it is required to develop equipment for backside passivation layer deposition for TSV wafer bonding process with high deposition rate and low film stress. In this research, we investigated the relationship between process parameters and the induced wafer stress of PECVD silicon nitride film on 300 mm wafers employing statistical and artificial intelligence modeling. We found that the film stress increases with increased RF power, but the pressure has inversely proportional to the stress. It is also observed that no significant stress change is observed when the gas flow rate is low.

• 센서학회지
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• 제29권4호
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• pp.266-269
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• 2020

In this study, we investigated the effect of a sulfur passivation (S-passivation) process step on the electrical properties of surface-channel In_0.7Ga_0.3As quantum-well (QW) metal-oxide-semiconductor field-effect transistors (MOSFETs) with S/D regrowth contacts. We fabricated long-channel In_0.7Ga_0.3As QW MOSFETs with and without (NH₄)₂S treatment and then deposited 1/4 nm of Al₂O₃/HfO₂ through atomic layer deposition. The devices with S-passivation exhibited lower values of subthreshold swing (74 mV/decade) and drain-induced barrier lowering (19 mV/V) than the devices without S-passivation. A conductance method was applied, and a low value of interface trap density D_it (2.83×10¹² cm^-2eV^-1) was obtained for the devices with S-passivation. Based on these results, interface traps between InGaAs and high-κ are other defect sources that need to be considered in future studies to improve III-V microsensor sensing platforms.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 1997년도 추계학술대회 논문집
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• pp.468-472
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• 1997

The effect of the surface state on the quantum efficiency of underlying GaAs/AlGaAs multi-quantum well(MQW) structures consisting of three GaAs quantum wells with different thickness, is studied by low temperature photoluminescence(PL). The structure was grown by molecular beam epitaxy(MBE) on (100) GaAs substrate. The thickness of three GaAs quantum wells was 3, 6 and 9 nm, respectively. The MQWs were placed apart from 50 nm AlGaAs edge-barriers including two inner-barriers with 15 nm in thickness. The samples used in this study were prepared with different growth temperatures. Particularly, the hydrogen passivation effect to the 9 nm quantum well located at near surface appeared much stronger than any others. Transition energy and optical gain related to the hydrogen passivation effects on the multi-quantum well structure was calculated by transfer matrix method.

• 대한전기학회:학술대회논문집
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• 대한전기학회 1996년도 하계학술대회 논문집 C
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• pp.1642-1644
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• 1996

Passivation must prevent ionic charge movement on the surface of the junction, thereby minimizing the junction leakage and maximizing the breakdown voltage of the devices. Borosilicate glasses are widely used as surface passivants for such silicon power devices as thyristors, transistor, and diodes. Since these 91asses are electrically stable at high temperatures and in high electric fields, they can readily be applied as a thick film, and they are resistant to humidity and have low ionic mobility. A deposition technique of glass film on the silicon surface by electrophoresis in which acetone is used as a suspension medium has been investigated. The purpose of this paper is to describe electrophoretic deposition method for glass passivation and characteristics of glass films which were compared using DTA, SEM, XRD, as a function of firing temperature.