Characterization of Backside Passivation Process for Through Silicon via Wafer
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Kang, Dong Hyun
(Department of Electronic Engineering, Myongji University)
Gu, Jung Mo (Department of Electronic Engineering, Myongji University) Ko, Young-Don (Department of Mechanical and Industrial Engineering, University of Toronto) Hong, Sang Jeen (Department of Electronic Engineering, Myongji University) |
1 | S. W. Yoon, Electronics Packaging Technology Conference, 336 (2011). |
2 | A. Jourdain, Electronic Components and Technology Conference, 1122 (2011). |
3 | Z. Jing and J. Shi, IEEE Trans. Automation Science and Engineering, 7, 266 (2010). DOI |
4 | S. S. Han, Li Cai, G. S. May, and A. Rohatgi, IEEE Trans. Semiconductor Manufacturing, 9, 303 (1996). DOI ScienceOn |
5 | C. Iliescu, Journal of Micromechanics and Microengineering, 16, 869 (2006). DOI |
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