• Proceedings of the Materials Research Society of Korea Conference
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• 2011.05a
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• pp.50.1-50.1
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• 2011

Lead-free ceramics with a composition of 0.55 mol%$K_4CuNb_8O_23-(K_{1-x}Na_x)NbO_3$ (KCN-KNNx) where $0.45{\leq}x{\leq}0.60$ were synthesized by conventional ceramic processing. Results revealed that the addition of Na was effective in changing the microstructure and relative density of KCN-KNNx. Further, the addition of Na resulted in a slight shift of the phase transition temperatures (To-t and Tc) toward low values. A high mechanical quality factor (Qm) of 1850 was found atx=0.54, which might be due to the build-up of an internal bias field (Ei) within KCN. Thermal hysteresis in KNNx was confirmed with an increase in the Na content during the heating and cooling cycles, resulting from structural changes. Thus, KCN-KNNx with x=0.54 exhibits excellent piezoelectric properties with d33 (97 pC/N), kp (36%), and Qm (1850), being promising candidates for application in high-power piezoelectric devices.

• Journal of Applied Reliability
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• v.5 no.2
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• pp.241-259
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• 2005

The environmental problem is a main subject of the 21C and an environment destruction phenomenon by various kinds of environmental materials is reaching serious level. Nations to be classified as the environmental developed country, are born again environmental rich country. And they earn a large income by trade Every kind environmental resource in an international commercial transaction. Especially, the study that a reliability assessment method to prevent to reliability problem to be happened when the solder lead(lead-free solder), non-cd component, non-bromide component(without the polybrominated biphenyls(PBB) and polybrominated diphenyl ethers(PBDE))and hexavalent chromium(Cr VI) clearance component and mercury-free applied to electronic equipment is progressed. As the result of the study for applying of a reliability assessment technique of lead-free solder that recognized the most of urgent problem at the company, combination accelerated life test could taken by adding and appling the part of a humidity acceleration part to Eyring Model which is proposed by R.E.Thomas. The reliability assessment methods study of PWB clean environmental materials is expected to respond to a reliability elevation and environmental material regulation policy spreading all over the world by beginning form Europe.

• Ceramist
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• v.23 no.1
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• pp.101-109
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• 2020

In this study, the phase transition behaviors of lead-free (Na_1/2Bi_1/2TiO₃)_(1-x)-(BaTiO₃)_x (NBT-BT) are investigated by using Brillouin spectroscopy. The elastic properties, sound velocity and absorption coefficient of NBT-BT are characterized as a function of temperature along different crystallographic axes. The temperature dependences of the elastic constants of NBT-BT near the morphotropic phase boundary are determined for the first time. The unpoled NBT-BT single crystals exhibits the typical relaxor behaviors, presenting broad acoustic and dielectric anomalies. The application of electric field induced discontinuous changes in the elastic properties at ~110℃, which indicates field-induced phase transition occurred. The electric field also changes the dielectric constant from more relaxor-like to ferroelectric-like dielectric behavior.

• Journal of the Korean Ceramic Society
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• v.53 no.2
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• pp.171-177
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• 2016

Rhombohedral $Ba(Ti_{0.92}Zr_{0.08})O_3$ single crystals are fabricated using the cost-effective solid-state single crystal growth (SSCG) method; their dielectric and piezoelectric properties are also characterized. Measurements show that (001) $Ba(Ti_{0.92}Zr_{0.08})O_3$ single crystals have an electromechanical coupling factor ($k_{33}$) higher than 0.85, piezoelectric charge constant ($d_{33}$) of about 950 [pC/N], and piezoelectric voltage constant ($g_{33}$) higher than 40 [${\times}10^{-3}Vm/N$]. Especially the $d_{33}$ of (001) $Ba(Ti_{0.92}Zr_{0.08})O_3$ single crystals was by about six times higher than that of their ceramics. Because their electromechanical coupling factor ($k_{33}$) and piezoelectric voltage constant ($d_{33}$, $g_{33}$) are higher than those of soft PZT ceramics, it is expected that rhombohedral (001) $Ba(Ti_{0.92}Zr_{0.08})O_3$ single crystals can be used as "lead-free" piezoelectric materials in many piezoelectric applications such as actuator, sensor, and transducer.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.30 no.2
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• pp.119-125
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• 2017

We have studied the effects of Ag on the characteristics of $Sn_{43}Bi_{57}Ag_x$(wt%) lead-free solders for photovoltaic ribbon. Ag atoms in the solder formed an alloy phase of Ag3Sn after reacting with some part of Sn atoms, while they did not react with Bi atoms, but decreased the mean size of Bi solid phase and the thickness of solder. When Ag atoms of 3.0 wt% was added to eutectic $Sn_{43}Bi_{57}$(wt%) solder, it showed the optimally useful results that the peel strength of photovoltaic ribbon greatly increased and the sheet resistance of the solder decreased. In the meanwhile, the eutectic $Sn_{43}Bi_{57}$(wt%) solder showed a low melting temperature of $138.9^{\circ}C$, and showed a very similar result regardless of the added amount of Ag atoms.

• Journal of the Microelectronics and Packaging Society
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• v.20 no.4
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• pp.65-68
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• 2013

A novel bumping process using solder bump maker (SBM) is developed for fine-pitch flip chip bonding. It features maskless screen printing process. A selective solder bumping mechanism without the mask is based on the material design of SBM. Maskless screen printing process can implement easily a fine-pitch, low-cost, and lead-free solder-on-pad (SoP) technology. Its another advantage is ternary or quaternary lead-free SoP can be formed easily. The process includes two main steps: one is the thermally activated aggregation of solder powder on the metal pads on a substrate and the other is the reflow of the deposited powder on the pads. Only a small quantity of solder powder adjacent to the pads can join the first step, so a quite uniform SoP array on the substrate can be easily obtained regardless of the pad configurations. Through this process, an SoP array on an organic substrate with a pitch of 130 ${\mu}m$ is, successfully, formed.

• Journal of the Korean Society of Safety
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• v.30 no.6
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• pp.7-11
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• 2015

The present study investigates the impact shear strength of thermal aged Sn-3Ag-0.5Cu lead-free solder joints at impact speeds ranging from 0.5 m/s to 2.5 m/s. The specimens were thermal aged for 24, 100, 250 and 1000 hours at $100^{\circ}C$. The experimental results demonstrate that the shear strength of the solder joint decreases with an increase in the load speed and aging time. The shear strength of the solder joint aged averagely decreased by 43% with an increase in the strain rate. For the as-reflowed specimens, the mode II stress intensity factor ($K_{II}$) of interfacial IMC between Sn-3.0Ag-0.5Cu and a copper substrate also was found to decrease from $1.63MPa.m^{0.5}$ to $0.97MPa.m^{0.5}$ in the speed range tested here. The degradations in the shear strength and fracture toughness of the aged solder joints are mainly caused by the growth of IMC layers at the solder/substrate interface.

• Journal of the Korean Society for Heat Treatment
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• v.25 no.1
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• pp.14-21
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• 2012

The effects of cutting condition and tempering temperature for the shape of cutting chip were investigated. For this purpose, a lead-free brass containing 1wt.% of Bi extruded at $750^{\circ}C$ in straight turning was used in this study. The cutting chip preferred was mainly found to be loose form of arc chips with curling discontinuity, and these were formed by shear fracture. However, some of fragmental element chip were found to be mixed when tempering temperature was as high as $500^{\circ}C$. The form and size of chip was more affected by feed rate than by tempering temperature and cutting rate. In addition, the cutting surface was observed to be formed more rough in the case of high feed rate and low cutting rate compared to low feed rate and high cutting rate.

• Transactions of the Korean Society of Automotive Engineers
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• v.19 no.6
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• pp.90-96
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• 2011

In this study, the characteristic of fractured portion and shape on solder joints were investigated according to the thermal shock test for Automotive Application Component using Sn-3.0Ag-0.5Cu solder, which has a outstanding property as Lead-free solder. The value of pull and shear strength was decreased in principle after 432 cycles thermal shock test. In addition, fracture mode was verified by using EDS and SEM to observe fractured shape on the solder joints before and after thermal shock. In before thermal shock test, the fracture mode revealed typically solder layer's fracture mode. In after thermal shock test, we identified multiple fracture mode of the ductile and brittle fracture. Even though same composition of solder was used to experimental for estimating. the fracture mode varied on the fracture portion's height and the directional angles of shear strength. In conclusion, we identified that mechanical strength was affected on the solder layer's fracture mode.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.19 no.8
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• pp.717-723
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• 2006

Lead free $(Na_{0.5}K_{0.47}Cd_x)NbO_3$ ceramics (x=0.015-0.005) were prepared by the conventional mixed oxide route. The effects of CdO addition on the sintering, dielectric and piezoelectric properties of the samples were examined. The addition of CdO greatly enhanced the sinterability of ceramics and the sample has a lower dielectric loss. The $k_p\;and\;Q_m$ of the samples with 0.02 mol CdO addition are 0.35 and 125, respectively, The $(Na,K)NbO_3$ ceramics show a large degradation of $k_p$ due to the deliquescence when exposed to humidity, while the $(Na,K,Cd)NbO_3$ ceramics have no a significant degradation of it.