Maskless Screen Printing Process using Solder Bump Maker (SBM) for Low-cost, Fine-pitch Solder-on-Pad (SoP) Technology |
Choi, Kwang-Seong
(IT Materials and Components Laboratory Electronics and Telecommunications Research Institute)
Lee, Haksun (IT Materials and Components Laboratory Electronics and Telecommunications Research Institute) Bae, Hyun-Cheol (IT Materials and Components Laboratory Electronics and Telecommunications Research Institute) Eom, Yong-Sung (IT Materials and Components Laboratory Electronics and Telecommunications Research Institute) |
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