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A Study on the Fracture Mode Characteristics of Automotive Application Component Lead-free Solder Joints  

Jeon, Yu-Jae (Graduate School of Mechanical Engineering, Chung-Ang University)
Kim, Do-Seok (School of Mechanical Engineering, Chung-Ang University)
Shin, Young-Eui (School of Mechanical Engineering, Chung-Ang University)
Publication Information
Transactions of the Korean Society of Automotive Engineers / v.19, no.6, 2011 , pp. 90-96 More about this Journal
Abstract
In this study, the characteristic of fractured portion and shape on solder joints were investigated according to the thermal shock test for Automotive Application Component using Sn-3.0Ag-0.5Cu solder, which has a outstanding property as Lead-free solder. The value of pull and shear strength was decreased in principle after 432 cycles thermal shock test. In addition, fracture mode was verified by using EDS and SEM to observe fractured shape on the solder joints before and after thermal shock. In before thermal shock test, the fracture mode revealed typically solder layer's fracture mode. In after thermal shock test, we identified multiple fracture mode of the ductile and brittle fracture. Even though same composition of solder was used to experimental for estimating. the fracture mode varied on the fracture portion's height and the directional angles of shear strength. In conclusion, we identified that mechanical strength was affected on the solder layer's fracture mode.
Keywords
Automotive application component; Lead-free solder; Fracture mode; Pull strength test; Shear strength test; Thermal shock test;
Citations & Related Records
Times Cited By KSCI : 3  (Citation Analysis)
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