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http://dx.doi.org/10.4313/JKEM.2017.30.2.119

Effects of Ag on the Characteristics of Sn43Bi57Agx(wt%) Lead-free Solder for Photovoltaic Ribbon  

Jeong, Joo-Hyeon (Department of Nano Materials Engineering, Kyungpook National University)
Cho, Tae-Sik (Department of Nano Materials Engineering, Kyungpook National University)
Publication Information
Journal of the Korean Institute of Electrical and Electronic Material Engineers / v.30, no.2, 2017 , pp. 119-125 More about this Journal
Abstract
We have studied the effects of Ag on the characteristics of $Sn_{43}Bi_{57}Ag_x$(wt%) lead-free solders for photovoltaic ribbon. Ag atoms in the solder formed an alloy phase of Ag3Sn after reacting with some part of Sn atoms, while they did not react with Bi atoms, but decreased the mean size of Bi solid phase and the thickness of solder. When Ag atoms of 3.0 wt% was added to eutectic $Sn_{43}Bi_{57}$(wt%) solder, it showed the optimally useful results that the peel strength of photovoltaic ribbon greatly increased and the sheet resistance of the solder decreased. In the meanwhile, the eutectic $Sn_{43}Bi_{57}$(wt%) solder showed a low melting temperature of $138.9^{\circ}C$, and showed a very similar result regardless of the added amount of Ag atoms.
Keywords
Photovoltaic ribbon; Eutectic $Sn_{43}Bi_{57}$(wt%) lead-free solder; Ag addition; Enhancement of peel strength;
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