• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 1993년도 추계학술대회 논문집
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• pp.49-54
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• 1993

This paper discusses the reliability of solder joints of electronic devices on printed circuit board. Solder application is usually done by screen printing method for the bonding between outer leads of devices and thick film(Ag/Pd) pattern on Hybrid IC as wel1 as Cu lands on PCB. As result of thermal stresses generated at the solder joints due to the differences of thermal expansion coefficients between packge body and PCB, Micro cracking often occurs due to thermal fatigue failure at solder joints. The initiation and the propagate of solder joint crack depends on the environmental conditions, such as storage temperature and thermal cycling. The principal mechanisms of the cracking pheno- mana are the formation of kirkendal void caused by the differences in diffusion rate of materials, ant the thermal fatigue effect due to the differences of thermal expansion coefficient between package body and PCB. Finally, This paper experimentally shows a way to supress solder joints cracks by using low-${\alpha}$ PCB and the packages with thin lead frame, and investigates the phenomena of diffusion near the bonding interfaces.

• 전자공학회논문지A
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• 제31A권10호
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• pp.94-100
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• 1994

By using the RAPHAEL 3D inductance calculation program RI3, the PGA package inductance values of INTEL i486 microprocessor have been extracted. The lead frame layouts are drawn using the mentor Boardstation and the output files are converted into the RI3 program input format of RAPHAEL. The power and ground planes of the PGA package are modeled y grid-line structures of single bars. The capacitance valuse of signal lines have been clalculated by using the RAPHAEL 2D/3D capacitance extraction program. The extraced L, C, R values have been converted into the SPICE netlist formats with lumped circuit model for future use in the signal ingegrity analysis.

• 한국생산제조학회지
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• 제9권3호
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• pp.76-82
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• 2000

It is well known that during the oxygen cutting process residual thermal stresses are produced in weldment. The local non-uniform heating and subsequent cooling which takes place during any welding process causes complex thermal strains and stresses to finally lead to residual stresses exceed to the yield stress. High tensile stresses combined with applied structural load in the region near the welded joint can given rise to distortion brittle fracture change of the fatigue strength and stress corrosion cracking. The appropriate treatment of the welded component which reduces the peak of he welding residual stresses is believed to lower risk of the fracture during the service of the structure. In this study the impact loading in oxygen cutting frame was applied to reduce the residual stress. After applying the impact loading redistribution of resid-ual stress was measured by cutting method and the effect of fatigue was tested.

• 한국공작기계학회논문집
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• 제16권5호
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• pp.157-161
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• 2007

There are technological changes to reduce the size and weight of electronic components and to accommodate multi-functions in them. To meet this trend, more complicated technological processes are required. To maintain the processes, more accurate inspection systems are also necessary. Therefore, new inspection methods are needed, which is differ from conventional inspection methods such as electrical test methods ICT(In-Circuit Test), FCT(Function Test) and visual test using optical equipments. One of the possible approaches is non-destructive test using X-ray. In this paper, an inspection method using X-ray is developed and applied to inspection of soldering state and internal defects of electronic components.

• Structural Engineering and Mechanics
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• 제31권3호
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• pp.297-314
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• 2009

When the temperature of a structure varies, there is a tendency to produce changes in the shape of the structure. The resulting actions may be of considerable importance in the analysis of the structures having non-prismatic members. Therefore, this study aimed to investigate the modeling, analysis and behavior of the non-prismatic members subjected to temperature changes with the aid of finite element modeling. The fixed-end moments and fixed-end forces of such members due to temperature changes were computed through a comprehensive parametric study. It was demonstrated that the conventional methods using frame elements can lead to significant errors, and the deviations can reach to unacceptable levels for these types of structures. The design formulas and the dimensionless design coefficients were proposed based on a comprehensive parametric study using two-dimensional plane-stress finite element models. The fixed-end actions of the non-prismatic members having parabolic and straight haunches due to temperature changes can be determined using the proposed approach without necessitating a detailed finite element model solution. Additionally, the robust results of the finite element analyses allowed examining the sources and magnitudes of the errors in the conventional analysis.

• 한국신뢰성학회:학술대회논문집
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• 한국신뢰성학회 2002년도 정기학술대회
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• pp.123-129
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• 2002

본 논문에서는 Regulator IC의 불량원인 규명을 통해 반도체 고장분석 방법 및 개선사례를 소개하고자 한다. 고장분석에 사용된 반도체 Package는 8Pin MSOP(Mini Small Outline Package)로, 시장 불량품을 분석한 결과 Regulator IC의 Stitch Bond에 Heel Crack이 발생하여 불안정한 출력을 발생시킴을 알 수 있었다. Stitch Bond Heel Crack의 원인은 Lead Frame부의 박리(Delamination)에 의해 열이나 진동 등의 외부 Stress가 직접 Stitch Bond에 가해져 Crack이 발생된 것으로, Reflow 재현시험을 통해 확인 할 수 있었다. 박리 발생에 의한 Stitch Bond Heel Crack 방지 대책으로 첫째, Bonding Type을 Stitch Bond 에서 Ball Bond로 변경하여 강도를 개선하고 둘째, PCB Layout 변경을 통해 외력이 직접 Regulator IC에 가해지지 않도록 하였다. 개선 결과 현재까지 시장에서 동일 불량은 발생하지 않았다.

• 산업경영시스템학회지
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• 제23권59호
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• pp.21-36
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• 2000

The drum-buffer-rope(DBR) system is a finite scheduling mechanism that balances the flow of the production system. DBR controls the flow of materials through the plant in order to produce products in accordance with market demand, with a minimum of manufacturing lead time, inventory, and operating expenses. This paper integrates the best of MRP push system and JIT pull system with DBR system, efficiently adapts these logics to capacity constraint resources, and contributes to the evolution of synchronous manufacturing. The purpose of this paper is, thus, threefold. The first objective is to identify the frame of theory of constraints(TOC) and the logic of DBR scheduling. The second objective is to formulate the DBR constraint scheduling problems(DBRCSP) in a job shop environments. Finally, the paper is to suggest the solution procedure of DBRCSP for embedding TOC into MRP/JIT along with an numerical expression. In addition, illustrative numerical example is given.

• Journal of Welding and Joining
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• 제12권4호
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• pp.110-116
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• 1994

This paper has been researched bondability of electronics devices, such as lead frame and the thick film of Ag/Pd on an alumina substrate by different heat sources. To obtain the bonds with high quality, it is very important to consist of different materials. Therefore, this paper clarifies not only heat mechanism of micro parallel gap resistance bonding method and pulse heat tip bonding method but also investigates selection of heat sources with micro-electronic materials for bonding. Finally, it is realized fluxless bonding process with filler metal such as plating layers.

• 제어로봇시스템학회논문지
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• 제14권5호
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• pp.453-461
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• 2008

In this paper, new inspection method is proposed for the surfaces of lead frame and IC's. Optimal optical system and the accurate algorithm for the surface inspection are needed in machine vision area. The proposed optical system is composed of rectangular oblique light illumination and coaxial light illumination for the higher contrast and the results shows the better performances through experiments. The markings of IC surface are inspected using the accurate proposed method using the partitioned correlation coefficient, and the result shows reduction of under kill ratio compared to the previous method.

• 한국공작기계학회:학술대회논문집
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• 한국공작기계학회 1995년도 추계학술대회 논문집
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• pp.64-67
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• 1995

Transfer Molding is currently the most widely used process for encapsulation integrated circuits(;IC). Although the process has been introduced over 20 years ago, generating billions of parts each year, it is far from being optimized. With each new mold, epoxy mold, epoxy mold compound, and lead-frame, lengthy period and expensive qualification runs have to be performed to minimized defects ranging from wire sweep, incomplete fill, and internal voids etc. This studies describes how simulation can be applied to transfer molding to yield acceptable design and processing parameter. The non-isothermal filling of non-newtonian reactive epoxy molding compound(;EMC) in a multi-cavity mold is analyzed. Sensitivity analysis is conducted to investigate the influence of process deviations on the final molded profile. This study trend is carried out by following some heuristic process guidelines.