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http://dx.doi.org/10.5302/J.ICROS.2008.14.5.453

Development of Inspection System for the IC package  

Lee, Jung-Seob (호서대학교 디지털디스플레이공학과)
Kwon, Oh-Min (호서대학교 전자공학과)
Joo, Hyo-Nam (호서대학교 디지털디스플레이공학과)
Kim, Joon-Sik (호서대학교 전자공학과)
Rew, Keun-Ho (호서대학교 로봇공학과)
Publication Information
Journal of Institute of Control, Robotics and Systems / v.14, no.5, 2008 , pp. 453-461 More about this Journal
Abstract
In this paper, new inspection method is proposed for the surfaces of lead frame and IC's. Optimal optical system and the accurate algorithm for the surface inspection are needed in machine vision area. The proposed optical system is composed of rectangular oblique light illumination and coaxial light illumination for the higher contrast and the results shows the better performances through experiments. The markings of IC surface are inspected using the accurate proposed method using the partitioned correlation coefficient, and the result shows reduction of under kill ratio compared to the previous method.
Keywords
machine vision; optical system; IC package; inspection; correlation coefficient;
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