• Title/Summary/Keyword: laser scan

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A Study on Electrostatic Powder Coating for 3D Scanning of Diffused Surfaces (난반사 표면의 3D 스캐닝을 위한 정전분말코팅 연구)

  • Maeng, Heeyoung;Lee, Myoung Sang
    • Journal of the Korean Society of Manufacturing Technology Engineers
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    • v.24 no.1
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    • pp.56-62
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    • 2015
  • Using an optical 3D scanning device to collect data from a diffused reflection surface is very difficult. To solve this problem, there are many applications including a spray-type developer and silicon molds. However, using a developer can cause chemical reactions between objects and particles of the developer and uneven surfaces on the object. To overcome these problems, we suggest an electrostatic powder coating method for even coating of particles onto surfaces for collecting 3D shape data. We have developed an automatic, electrostatic powder-coating machine and performed three different experiments to compare this system with a laser interferometer and a T-scan 3D scanner. As a result, we could ascertain the various characteristics of this new method, including good sensitivity for the various surface states of the bare surface, developer, and electrostatic powder coating. Finally, we verified the outstanding scanning performance and were able to demonstrate that this method achieves quality than traditional methods.

Confocal Scanning Microscopy : a High-Resolution Nondestructive Surface Profiler

  • Yoo, Hong-Ki;Lee, Seung-Woo;Kang, Dong-Kyun;Kim, Tae-Joong;Gweon, Dae-Gab;Lee, Suk-Won;Kim, Kwang-Soo
    • International Journal of Precision Engineering and Manufacturing
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    • v.7 no.4
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    • pp.3-7
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    • 2006
  • Confocal scanning microscopy is a measurement technique used to observe micrometer and sub-micrometer features due to its high resolution, nondestructive properties, and 3D surface profiling capabilities. The design, implementation, and performance test of a confocal scanning microscopy system are presented in this paper. A short-wavelength laser (405 nm) and an objective lens with a high numerical aperture (0.95) were used to achieve the desired high resolution, while the x- and y-axis scans were implemented using an acousto-optic deflector and galvanomirror, respectively. An objective lens with a piezo-actuator was used to scan the z-axis. A spatial resolution of less than 138 nm was achieved, along with successful 3D surface reconstructions.

Local transport properties of coated conductors by laser-scan imaging methods

  • Kim, Gracia;Jo, William;Nam, Dahyun;Cheong, Hyeonsik;Moon, Seoung Hyun
    • Progress in Superconductivity and Cryogenics
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    • v.18 no.2
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    • pp.1-4
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    • 2016
  • To observe the superconducting current and structural properties of high critical temperature ($T_c$) superconductors (HTS), we suggest the following imaging methods: Room temperature imaging (RTI) through thermal heating, low-temperature bolometric microscopy (LTBM) and Raman scattering imaging. RTI and LTBM images visualize thermal-electric voltages as different thermal gradients at room temperature (RT) and superconducting current dissipation at near-$T_c$, respectively. Using RTI, we can obtain structural information about the surface uniformity and positions of impurities. LTBM images show the flux flow in two dimensions as a function of the local critical currents. Raman imaging is transformed from Raman survey spectra in particular areas, and the Raman vibration modes can be combined. Raman imaging can quantify the vibration modes of the areas. Therefore, we demonstrate the spatial transport properties of superconducting materials by combining the results. In addition, this enables visualization of the effect of current flow on the distribution of impurities in a uniform superconducting crystalline material. These imaging methods facilitate direct examination of the local properties of superconducting materials and wires.

Confocal Scanning Microscopy with Multiple Optical Probes for High Speed 3D Measurements and Color Imaging (고속 3차원 측정 및 칼라 이미징을 위한 다중 광탐침 공초점 주사 현미경)

  • Chun, Wan-Hee;Lee, Seung-Woo;Ahn, Jin-Woo;Gweon, Dae-Gab
    • Journal of the Semiconductor & Display Technology
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    • v.7 no.1
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    • pp.11-16
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    • 2008
  • Confocal scanning microscopy is a widely used technique for three dimensional measurements because it is characterized by high resolution, high SNR and depth discrimination. Generally an image is generated by moving one optical probe that satisfies the confocal condition on the specimen. Measurement speed is limited by movement speed of the optical probe; scanning speed. To improve measurement speed we increase the number of optical probes. Specimen region to scan is divided by optical probes. Multi-point information each optical probe points to can be obtained simultaneously. Therefore image acquisition speed is increased in proportion to the number of optical probes. And multiple optical probes from red, green and blue laser sources can be used for color imaging and image quality, i.e., contrast, is improved by adding color information by this way. To conclude, this technique contributes to the improvement of measurement speed and image quality.

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A 16-channel CMOS Inverter Transimpedance Amplifier Array for 3-D Image Processing of Unmanned Vehicles (무인차량용 3차원 영상처리를 위한 16-채널 CMOS 인버터 트랜스임피던스 증폭기 어레이)

  • Park, Sung Min
    • The Transactions of The Korean Institute of Electrical Engineers
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    • v.64 no.12
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    • pp.1730-1736
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    • 2015
  • This paper presents a 16-channel transimpedance amplifier (TIA) array implemented in a standard $0.18-{\mu}m$ CMOS technology for the applications of panoramic scan LADAR (PSL) systems. Since this array is the front-end circuits of the PSL systems to recover three dimensional image for unmanned vehicles, low-noise and high-gain characteristics are necessary. Thus, we propose a voltage-mode inverter TIA (I-TIA) array in this paper, of which measured results demonstrate that each channel of the array achieves $82-dB{\Omega}$ transimpedance gain, 565-MHz bandwidth for 0.5-pF photodiode capacitance, 6.7-pA/sqrt(Hz) noise current spectral density, and 33.8-mW power dissipation from a single 1.8-V supply. The measured eye-diagrams of the array confirm wide and clear eye-openings up to 1.3-Gb/s operations. Also, the optical pulse measurements estimate that the proposed 16-channel TIA array chip can detect signals within 20 meters away from the laser source. The whole chip occupies the area of $5.0{\times}1.1mm^2$ including I/O pads. For comparison, a current-mode 16-channel TIA array is also realized in the same $0.18-{\mu}m$ CMOS technology, which exploits regulated-cascode (RGC) input configuration. Measurements reveal that the I-TIA array achieves superior performance in optical pulse measurements.

Joint Properties of Inconel 718 Additive Manufactured on Ti-6Al-4V by FGM method (Ti-6Al-4V 합금 기지 위에 FGM 방식으로 적층제조 된 Inconel 718의 접합 특성 분석)

  • Park, Chan Woong;Park, Jin Woong;Jung, Ki Chae;Lee, Se-Hwan;Kim, Sung-Hoon;Kim, Jeoung Han
    • Journal of Powder Materials
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    • v.28 no.5
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    • pp.417-422
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    • 2021
  • In the present work, Inconel 718 alloy is additively manufactured on the Ti-6Al-4V alloy, and a functionally graded material is built between Inconel 718 and Ti-6Al-4V alloys. The vanadium interlayer is applied to prevent the formation of detrimental intermetallic compounds between Ti-6Al-4V and Inconel 718 by direct joining. The additive manufacturing of Inconel 718 alloy is performed by changing the laser power and scan speed. The microstructures of the joint interface are characterized by scanning electron microscopy, energy-dispersive X-ray spectroscopy, and micro X-ray diffraction. Additive manufacturing is successfully performed by changing the energy input. The micro Vickers hardness of the additive manufactured Inconel 718 dramatically increased owing to the presence of the Cr-oxide phase, which is formed by the difference in energy input.

Investigation into the Effects of Process Parameters of DED Process on Deposition and Residual Stress Characteristics for Remanufacturing of Mechanical Parts (기계 부품 재제조를 위한 DED 공정 조건에 따른 적층 및 잔류응력 특성 분석)

  • Kim, D.A.;Lee, K.K.;Ahn, D.G.
    • Transactions of Materials Processing
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    • v.30 no.3
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    • pp.109-118
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    • 2021
  • Recently, there has been an increased interest in the remanufacturing of mechanical parts using metal additive manufacturing processes in regards to resource recycling and carbon neutrality. DED (directed energy deposition) process can create desired metallic shapes on both even and uneven substrate via line-by-line deposition. Hence, DED process is very useful for the repair, retrofit and remanufacturing of mechanical parts with irregular damages. The objective of the current paper is to investigate the effects DED process parameters, including the effects of power and the scan speed of the laser, on deposition and residual stress characteristics for remanufacturing of mechanical parts using experiments and finite element analyses (FEAs). AISI 1045 is used as the substrate material and the feeding powder. The characteristic dimensions of the bead shape and the heat affected zone (HAZ) for different deposition conditions are obtained from the experimental results. Efficiencies of the heat flux model for different deposition conditions are estimated by the comparison of the results of FEAs with those of experiments in terms of the width and the depth of HAZ. In addition, the influence of the process parameters on residual stress distributions in the vicinity of the deposited region is investigated using the results of FEAs. Finally, a suitable deposition condition is predicted in regards to the bead formation and the residual stress.

Reconfiguration of Physical Structure of Vegetation by Voxelization Based on 3D Point Clouds (3차원 포인트 클라우드 기반 복셀화에 의한 식생의 물리적 구조 재구현)

  • Ahn, Myeonghui;Jang, Eun-kyung;Bae, Inhyeok;Ji, Un
    • KSCE Journal of Civil and Environmental Engineering Research
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    • v.40 no.6
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    • pp.571-581
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    • 2020
  • Vegetation affects water level change and flow resistance in rivers and impacts waterway ecosystems as a whole. Therefore, it is important to have accurate information about the species, shape, and size of any river vegetation. However, it is not easy to collect full vegetation data on-site, so recent studies have attempted to obtain large amounts of vegetation data using terrestrial laser scanning (TLS). Also, due to the complex shape of vegetation, it is not easy to obtain accurate information about the canopy area, and there are limitations due to a complex range of variables. Therefore, the physical structure of vegetation was analyzed in this study by reconfiguring high-resolution point cloud data collected through 3-dimensional terrestrial laser scanning (3D TLS) in a voxel. Each physical structure was analyzed under three different conditions: a simple vegetation formation without leaves, a complete formation with leaves, and a patch-scale vegetation formation. In the raw data, the outlier and unnecessary data were filtered and removed by Statistical Outlier Removal (SOR), resulting in 17%, 26%, and 25% of data being removed, respectively. Also, vegetation volume by voxel size was reconfigured from post-processed point clouds and compared with vegetation volume; the analysis showed that the margin of error was 8%, 25%, and 63% for each condition, respectively. The larger the size of the target sample, the larger the error. The vegetation surface looked visually similar when resizing the voxel; however, the volume of the entire vegetation was susceptible to error.

A proposal of soft tissue landmarks for craniofacial analysis using three-dimensional laser scan imaging (3차원 레이저 스캔을 이용한 안면 연조직 분석을 위한 계측점의 제안)

  • Baik, Hyoung-Seon;Lee, Hwa-Jin;Jeon, Jai-Min
    • The korean journal of orthodontics
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    • v.36 no.1 s.114
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    • pp.1-13
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    • 2006
  • Three-dimensional (3-D) laser scans can provide a 3-D image of the face and it is efficient in examining specific structures of the craniofacial soft tissues. Due to the increasing concerns with the soft tissues and expansion of the treatment range, a need for 3-D soft tissue analysis has become urgent. Therefore, the purpose of this study was to evaluate the scanning error of the Vivid 900 (Minolta, Tokyo, Japan) 3-D laser scanner and Rapidform program (Inus Technology Inc., Seoul, Korea) and to evaluate the mean error and the magnification percentage of the image obtained from 3-D laser scans. In addition, soft tissue landmarks that are easy to designate and reproduce in 3-D images of normal, Class II and Class III malocclusion patients were obtained. The conclusions are as follows; scanning errors of the Vivid 900 3-D laser scanner using a manikin were 0.16 mm in the X axis, 0.15 mm in the Y axis, and 0.15 mm in the Z axis. In the comparison of actual measurements from the manikin and the 3-D image obtained from the Rapidform program, the mean error was 0.37 mm and the magnification was 0.66%. Except for the right soft tissue gonion from the 3-D image, errors of all soft tissue landmarks were within 2.0 mm. Glabella, soft tissue nasion, endocanthion, exocanthion, pronasale, subnasale, nasal alare, upper lip point, cheilion, lower lip point, soft tissue B point, soft tissue pogonion, soft tissue menton and preaurale had especially small errors. Therefore, the Rapidform program can be considered a clinically efficient tool to produce and measure 3-D images. The soft tissue landmarks proposed above are mostly anatomically important points which are also easily reproducible. These landmarks can be beneficial in 3-D diagnosis and analysis.

An implementation of 2D/3D Complex Optical System and its Algorithm for High Speed, Precision Solder Paste Vision Inspection (솔더 페이스트의 고속, 고정밀 검사를 위한 이차원/삼차원 복합 광학계 및 알고리즘 구현)

  • 조상현;최흥문
    • Journal of the Institute of Electronics Engineers of Korea SP
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    • v.41 no.3
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    • pp.139-146
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    • 2004
  • A 2D/3D complex optical system and its vision inspection algerian is proposed and implemented as a single probe system for high speed, precise vision inspection of the solder pastes. One pass un length labeling algorithm is proposed instead of the conventional two pass labeling algorithm for fast extraction of the 2D shape of the solder paste image from the recent line-scan camera as well as the conventional area-scan camera, and the optical probe path generation is also proposed for the efficient 2D/3D inspection. The Moire interferometry-based phase shift algerian and its optical system implementation is introduced, instead of the conventional laser slit-beam method, for the high precision 3D vision inspection. All of the time-critical algorithms are MMX SIMD parallel-coded for further speedup. The proposed system is implemented for simultaneous 2D/3D inspection of 10mm${\times}$10mm FOV with resolutions of 10 ${\mu}{\textrm}{m}$ for both x, y axis and 1 ${\mu}{\textrm}{m}$ for z axis. Experiments conducted on several nBs show that the 2D/3D inspection of an FOV, excluding an image capturing, results in high speed of about 0.011sec/0.01sec, respectively, after image capturing, with $\pm$1${\mu}{\textrm}{m}$ height accuracy.