• Journal of the Microelectronics and Packaging Society
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• v.19 no.4
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• pp.57-64
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• 2012

Ball shear test was performed by test variables such as loading speed and annealing time in order to investigate the effect of surface finishes on the bonding strength of Sn-1.2Ag-0.7Cu-0.4In Pb-free solder. The shear strength increased and the ductility decreased with increasing shear speed. With increasing shear speed, the electroless nickel immersion gold (ENIG) finish showed dominant brittle fracture mode, while organic solderability preservative (OSP) finish showed pad open fracture mode. The shear strength and toughness for both surface finishes decreased with increasing annealing time under the high-speed shear test of 500 mm/s. Typically, the thickness of intermetallic compound increased with increasing annealing time, which means that exposure of brittle fracture became much easier. With increasing annealing time, the both ENIG and OSP finishes exhibited the pad open fracture mode. Overall, ENIG finish showed higher shear strength rather than OSP finish due to its superior barrier stability.

• Korean Chemical Engineering Research
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• v.46 no.2
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• pp.402-407
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• 2008

Recent popularity in mobile electronics requires higher standard on the mechanical strength of electronic packaging. Thus, the method of soldering between chip and substrate in electronic packaging process is changing from conventional method using intermetallic compound to a new method using organic solderability preservative (OSP) in order to improve the stability and the reliability of final product. Since current organic solder preservatives have several serious problems like thermo-stability during packaging process, however, it is necessary to develop new OSPs having thermo-stability. The main purpose of this study is to investigate the effect of MeOH/IPA (Isopropyl alcohol) ratio on the fluxing of a new OSP, developed in previous research, andto find out an optimum formulation of flux components for the application of the OSP in current packaging process. As a result of this study, it was revealed that higher MeOH/IPA ratio in flux showed better performance of fluxing a new OSP.

• Korean Chemical Engineering Research
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• v.49 no.2
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• pp.161-167
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• 2011

Recent popularity in mobile electronics requires higher standard on the mechanical strength of electronic packaging. Thus, the method of soldering between chip and substrate in electronic packaging process is changing from conventional method using intermetallic compound to a new method using organic solderability preservatives (OSP) in order to improve the stability and the reliability of final product. Since current OSPs have several serious problems like thermo-stability during packaging process, however, it is necessary to develop new OSPs having thermo-stability. The main purpose of this study is to develop various thermo-stable OSPs based upon poly(vinyl pyridine-co- methylmethacrylate) and to evaluate their anti-oxidation property protecting Cu pad, thermo-stability and solubility to acid- or alcohol-containing aqueous solution during pos-fluxing. All OSPs showed not only good anti-oxidation property, thermo-stability and solubility but also more advantages like low cost, less odor, and less hygroscopic.

• Transactions of the Korean hydrogen and new energy society
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• v.8 no.3
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• pp.121-129
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• 1997

$ZrV_{0.1}Mn_{0.7}Ni_{1.2}$ alloy ingot (bulk alloy) made by the arc melting was found to be consisting of mostly of $ZrV_{0.2}Mn_{0.98}Ni_{1.04}$ matrix alloy and $ZrV_{0.01}Mn_{0.13}Ni_{1.2}$ 2nd phase alloy. The former alloy had the form of the C15 type Laves alloy structure and the latter one had the intermetallic compound structure of $Zr_9Ni_{11}$. In order to investigate the effect of these two phases on the electrochemical charge-discharge characteristics of bulk $ZrV_[0.1}Mn_0.7}Ni_{1.2}$ alloy, the matrix and the 2nd phase alloys were fabricated separately by arc melting method and their electrochemical characteristics were studied and compared with the bulk alloy. It was found that the discharge capacity was the lowest of 160 mAh/g in the 2nd phase alloy. The matrix alloy exhibited 200 mAh/g. Both were lower than that of the bulk alloy of 250 mAh/g. The matrix and the bulk alloys showed a similar properties in the activation stage, the high rate dischargeability and the self discharge characteristics. Also a signigicant capacity decrease was observed after activation in both alloys. Whereas the 2nd phase alloy showed the very different characteristics. This alloy was found to be difficult to activate. However the capacity was remained constant after the activation. Also the self discharge rate was seen to be better than those of the matrix and the bulk alloys.

• Journal of the Microelectronics and Packaging Society
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• v.14 no.2 s.43
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• pp.49-57
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• 2007

Au-Sn solder alloy were deposited in multilayer and co-sputtered film by rf-magnetron sputter and the composition control and analysis were studied. For the alloy deposition condition, each components of Au or Sn were deposited separately. On the basis of pure Sn and Au deposition, the deposition condition for Au-Sn solder alloy were set up. As variables, the substrate temperature, the rf-power, and the thickness ratio were used for the optimum composition. For multilayer solder alloy, the roughness and the composition of solder alloy were controlled more accurately at the higher substrate temperature. In contrast, for co-sputtered solder, the substrate temperature influenced little to the composition, but the composition could be controlled easily by rf-power. In addition, the co-sputtered solder film mostly consisted of intermetallic compound, which formed during deposition. The compound were confirmed by XRD. Without flux during bonding of solder alloy film on leadframe, the adhesion strength were measured. The maximum shear stress was $330(N/mm^2)$ for multilayer solder with Au 10wt% and $460(N/mm^2)$ for co-sputtered solder with Au 5wt%.

• Journal of the Microelectronics and Packaging Society
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• v.17 no.2
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• pp.41-47
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• 2010

The effect of PCB and BGA pad designs was investigated on the mechanical property of Pb-free solder joints. The mechanical property of solder joint was tested by three different test methods of drop impact tests, bending impact test, and high speed shear test. Two kinds of pad design such as NSMD (Non-Solder Mask Defined) and SMD (Solder Mask Defined) were applied with the OSP finished Pb-free solder (Sn-3.0Ag-0.5Cu, Sn-1.2Ag-0.5Cu). in the drop impact test and bending impact test, the characterized lifetime showed the same tendency, and SMD design showed better mechanical property of solder joint than NSMD regardless of test method, which was due to the different crack path. The fracture crack on SMD pad was propagated along the intermetallic compound (IMC) layer of solder joint, while the fracture crack on NSMD pad propagated through upper edge of land which shields pattern. In the high speed shear test, pad lift occurred on the solder joint of NSMD. SMD/SMD combination of pad design consequently illustrated the best mechanical property of BGA/PCB solder joint, followed by SMD/NSMD, NSMD/SMD, and NSMD/NSMD.

• Journal of the Microelectronics and Packaging Society
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• v.24 no.1
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• pp.83-90
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• 2017

In this paper, we evaluated the solderability of thin electroless nickel-electroless palladium-immersion gold (ENEPIG) plating layer for fine-pitch package applications. Firstly, the wetting behavior, interfacial reactions, and mechanical reliability of a Sn-3.0Ag-0.5Cu (SAC305) solder alloy on a thin ENEPIG coated substrate were evaluated. In the wetting test, maximum wetting force increased with increasing immersion time, and the wetting force remained a constant value after 5 s immersion time. In the initial soldering reaction, $(Cu,Ni)_6Sn_5$ intermetallic compound (IMC) and P-rich Ni layer formed at the SAC305/ENEPIG interface. After a prolonged reaction, the P-rich Ni layer was destroyed, and $(Cu,Ni)_3Sn$ IMC formed underneath the destroyed P-rich Ni layer. In the high-speed shear test, the percentage of brittle fracture increased with increasing shear speed.

• Journal of the Microelectronics and Packaging Society
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• v.12 no.4 s.37
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• pp.289-299
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• 2005

The ball shear force was investigated in terms of test parameters, i.e. displacement rate and probe height, with an experimental and non-linear finite element analysis for evaluation of the solder joint integrity in area array packages. The increase in the displacement rate and the decrease in the probe height led to the increase in the shear force. Excessive probe height could cause some detrimental effects on the test results such as unexpected high standard deviation and probe sliding from the solder ball surface. The low shear height conditions were favorable for assessing the mechanical integrity of the solder joints. The mechanical and electrical properties of the Sn-37Pb/Cu and Sn-3.5Ag/Cu BGA solder joints were also investigated with the number of reflows. The total thickness of the intermetallic compound (IMC) layers, consisting of Cu6Sn5 and Cu3Sn, was increased as a function of cubic root of reflow time. The shear force was increased up to 3 or 4 reflows, and then was decreased with the number of reflows. The fracture occurred along the bulk solder, in irrespective of the number of reflows. The electrical resistivity was increased with increasing the number of reflows.

• Journal of the Microelectronics and Packaging Society
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• v.15 no.4
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• pp.65-70
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• 2008

The mechanical shear strength of BGA(Ball Grid Array) solder joints under high impact loading was investigated. The Sn-37Pb solder balls with a diameter of $500{\mu}m$ were placed on the pads of FR-4 substrates with ENIG(Electroless Nickel Immersion Gold) surface treatment and reflowed. For the High Temperature Storage(HTS) test, the samples were aged a constant testing temperature of $120^{\circ}C$ for up to 250h. After the HTS test, high speed shear tests with various shear speed of 0.01, 0.1, 1, 3 m/s were conducted. $Ni_3Sn_4$ intermetallic compound(IMC) layer was observed at the solder/Ni-P interface and thickness of IMC was increased with aging process. The shear strength increased with increasing shear speed. The fracture surfaces of solder joints showed various fracture modes dependent on shear speed and aging time. Fracture mode was changed from ductile fracture to brittle fracture with increasing shear speed.

• Journal of the Korean Applied Science and Technology
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• v.30 no.1
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• pp.71-77
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• 2013

Aluminium powder as reductant in aluminothermy process needs a fine particle size under 200 mesh, but it is not easy economically to make that because of its high ductility and powder production cost. In order to reduce the production cost of fine aluminum powder as reductant of $Mn_3O_4$ waste dust, therefore, the properties of aluminium alloy powder were investigated. Aluminium alloy ingot containing large amount of manganese can be crushed easily because of its intermetallic compounds having brittle properties. The manganese is also main element in ferro-manganese. We can obtain economically Al-15%Mn alloy powder by mechanical comminution process. And the result of thermite reaction using Al-15% Mn alloy powder instead of pure Al powder showed the fact that can be obtained the ferro-manganese which have a high purity in case of using pure aluminium powder as reductant. The recovery of manganese from $Mn_3O_4$ waste dust with Al-15%Mn alloy powder was higher level of about 70% than about 65% in case of using aluminium powder, that is due to lower spatter loss.