• 마이크로전자및패키징학회지
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• 제29권4호
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• pp.41-47
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• 2022

Ag sintering technologies have received great attention as it was applied to the inverter of Tesla's electric vehicle Model III. Ag sinter bonding technology has advantages in heat dissipation design as well as high-temperature stability due to the intrinsic properties of the material, so it is useful for practical use of SiC and GaN devices. This study was carried out to understand the sinter joining temperature effect on the robust Ag sintered joints in air without pressure within 10 min. Electroplated Ag finished Cu dies (3 mm × 3 mm × 2 mm) and substrates (10 mm × 10 mm × 2 mm) were introduced, respectively, and nano Ag paste was applied as a bonding material. The sinter joining process was performed without pressure in air with the bonding temperature as a variable of 175 ℃, 200 ℃, 225 ℃, and 250 ℃. As results, the bonding temperature of 175 ℃ caused 13.21 MPa of die shear strength, and when the bonding temperature was raised to 200 ℃, the bonding strength increased by 157% to 33.99 MPa. When the bonding temperature was increased to 225 ℃, the bonding strength of 46.54 MPa increased by about 37% compared to that of 200 ℃, and even at a bonding temperature of 250 ℃, the bonding strength exceeded 50 MPa. The bonding strength of Ag sinter joints was directly influenced by changes in the necking thickness and interfacial connection ratio. In addition, developments in the morphologies of the joint interface and porous structure have a significant effect on displacement. This study is systematically discussed on the relationship between processing temperatures and bonding strength of Ag sinter joints.

• Journal of Welding and Joining
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• 제30권3호
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• pp.26-31
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• 2012

Three-dimensional integrated circuit (3D IC) technology has become increasingly important due to the demand for high system performance and functionality. We have evaluated the effect of Buffered oxide etch (BOE) on the interfacial bonding strength of Cu-Cu pattern direct bonding. X-ray photoelectron spectroscopy (XPS) analysis of Cu surface revealed that Cu surface oxide layer was partially removed by BOE 2min. Two 8-inch Cu pattern wafers were bonded at $400^{\circ}C$ via the thermo-compression method. The interfacial adhesion energy of Cu-Cu bonding was quantitatively measured by the four-point bending method. After BOE 2min wet etching, the measured interfacial adhesion energies of pattern density for 0.06, 0.09, and 0.23 were $4.52J/m^2$, $5.06J/m^2$ and $3.42J/m^2$, respectively, which were lower than $5J/m^2$. Therefore, the effective removal of Cu surface oxide is critical to have reliable bonding quality of Cu pattern direct bonds.

• Journal of Welding and Joining
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• 제29권6호
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• pp.65-70
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• 2011

The effect of flip chip bonding parameters on formation of intermetallic compounds (IMCs) between Au stud bumps and Sn-3.5Ag solder was investigated. In this study, flip chip bonding temperature was performed at $260^{\circ}C$ and $300^{\circ}C$ with various bonding times of 5, 10, and 20 sec. AuSn, $AuSn_2$ and $AuSn_4$ IMCs were formed at the interface of joints and (Au, Cu)$_6Sn_5$ IMC was observed near Cu pad side in the joint. At bonding temperature of $260^{\circ}C$, $AuSn_4$ IMC was dominant in the joint compared to other Au-Sn IMCs as bonding time increased. At bonding temperature of $300^{\circ}C$, $AuSn_2$ IMC clusters, which were surrounded by $AuSn_4$ IMC, were observed in the solder joint due to fast diffusivity of Au to molten solder with increased bonding temperature. Bond strength of Au stud bump joined with Sn-3.5Ag solder was about 23 gf/bump and fracture mode of the joint was intergranular fracture between $AuSn_2$ and $AuSn_4$ IMCs regardless bonding conditions.

• 한국안전학회지
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• 제38권2호
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• pp.1-7
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• 2023

Fiber-metal laminates (FMLs) and polymer matrix composites (PMCs) are formed in various ways. In particular, FMLs in which aluminum is laminated as a reinforced layer are widely used. Also, glass fiber-reinforced plastics (GFRPs) are generally applied as fiber laminates. The bonding interface layer between the aluminum and fiber laminate exhibits low strength when subjected to hot press fabrication in the event of delamination fracture at the interface. This study presents a simple method for strengthening the interface bonding between the aluminum metal and GFRP layer of FML composites. The surfaces of the aluminum interface layer are engraved with three kinds of patterns by using the laser machine before the hot press works. Furthermore, the effect of the laser patterns on the interfacial toughness is investigated. The interfacial toughness was evaluated by the energy release rate (G) using an asymmetric double cantilever bending specimen (ADCB). From the experimental results, it was shown that the strip type pattern (STP) has the most proper pattern shape in GFRP/Al FML composites. Therefore, this will be considered a useful method for the safety assessment of FML composite structures.

• 한국주조공학회지
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• 제41권6호
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• pp.535-542
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• 2021

본 연구에서는 주철-알루미늄 이종재료의 계면결합강도를 향상시키기 위하여 탈흑연 열처리를 통해 주철 표면에서 일정 깊이까지의 흑연을 제거하였다. 열처리 시간이 증가함에 따라 흑연이 제거되는 깊이는 증가하였으며, 열처리 시간과 깊이 사이에 선형 관계가 나타났다. 일정 깊이의 흑연이 제거된 주철에 알루미늄을 다이캐스팅 공법으로 주조접합하여 주철에서 흑연이 제거된 공간을 알루미늄으로 채운 후, 계면 반응 및 알루미늄 침투 깊이를 조사하고 계면접합강도를 평가하였다. 다이캐스팅 공법을 통한 알루미늄은 탈흑연 열처리된 주철 표면에서 일정한 깊이까지 채워지는 것으로 확인되었으며, 주철-알루미늄 계면에 금속간화합물이 생성되지는 않은 것으로 확인되었다. 계면접합강도는 열처리 시간과는 큰 관계없이 90MPa 수준의 접합강도를 나타내었으며 이는 탈흑연 열처리를 하지 않은 소재의 접합강도 12MPa에 비해 매우 높은 강도이며, 주철의 탈흑연 영역에서 고압 다이캐스팅 공정에 의해 침투된 알루미늄 용탕이 응고되면서 언더컷 구조의 기계적 결합에 의한 것으로 생각된다.

• 한국염색가공학회지
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• 제9권4호
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• pp.47-53
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• 1997

To improve the interfacial bonding of carbon fiber-nylon 6 composite, carbon fiber(CF) were oxidized by nitric acid treatment, and two types of graft polymer(GP) of nylon 6-g-polyacrylamide (PAAm) -water dispersable GP(WDGP) and m-cresol solu ble GP(CSGP) were treated as coupling agents. Introduction of polar groups such as -COOH, -OH, etc, on the surface of the oxidized CF was confirmed by IR spectra. The stem polymer of nylon 6 in the coupling agent (GP) could be compatible with'matrix nylon 5, and the grafted branch of PAAm on GP could react to the polar groups on the oxidized CF in composite. The interfacial strength was measured by the transverse tensile test to the fiber direction for single CF embedded nylon 6 film especially prepared and by the pull-out test method. The interfacial strength of the composite reinforced with oxidized CF is greater than that reinforced with unoxidized CF. The interfacial strength of the composite was increased by treatment of coupling agents(GPs) considerably, and the increasing tendency by the WDGP is greater than that by the CSGP. The optimum conditions of coupling agent treatment are as follows: the concentration, adsorption tlme of GP, and curing temperature are 2%, 20 minutes, and $170^{\circ}$, respectively.

• 마이크로전자및패키징학회지
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• 제28권2호
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• pp.65-70
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• 2021

본 연구에서는 레이저 접합 공정을 이용하여 flame retardant-4 (FR-4) 인쇄회로기판 (printed circuit board, PCB)의 organic solderability preservative (OSP) 표면처리 된 Cu pad와 전자부품을 Sn-57Bi-1Ag 저온 솔더 페이스트로 접합을 한 후 접합부의 계면 특성과 기계적 특성에 대하여 보고 하였다. 레이저 접합 공정은 레이저 파워 및 시간 등을 다르게 진행하여 접합 공정 조건이 접합부의 계면 및 기계적 특성에 미치는 영향을 살펴보았다. 레이저 접합 공정의 산업적 적용을 위하여 산업적으로 많이 이용되고 있는 리플로우 접합 공정을 이용한 접합부의 특성과도 비교 하였다. 레이저 접합 공정 적용 결과 2, 3 s의 짧은 공정 시간에도 계면에 Cu₆Sn₅ 금속간화합물 (intermetallic compound, IMC)를 생성하여 접합부를 안정적으로 형성함을 확인 하였다. 또한, 리플로우 공정과 비교해 보았을 때 레이저 접합 공정을 적용할 경우 접합부의 보이드 형성이 억제됨을 확인할 수 있었으며 접합부의 전단강도도 리플로우 공정 접합부보다 높은 기계적 강도를 나타냈다. 따라서, 레이저 접합 공정을 적용할 경우 짧은 접합 공정 시간에도 불구하고 안정적인 접합부 형성 및 높은 기계적 강도를 확보할 수 있는 것으로 기대된다.

• 대한용접접합학회:학술대회논문집
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• 대한용접접합학회 1992년도 특별강연 및 추계학술발표 개요집
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• pp.119-121
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• 1992

• Macromolecular Research
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• 제10권1호
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• pp.24-33
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• 2002

Interfacial and microfailure properties of carbon fiber/epoxy composites were evaluated using both tensile fragmentation and compressive Broutman tests. A monomeric and two polymeric coupling agents were applied via the electrodeposition (ED) and the dipping applications. A monomeric and a polymeric coupling agent showed significant and comparable improvements in interfacial shear strength (IFSS) compared to the untreated case under both tensile and compressive tests. Typical microfailure modes including cone-shaped fiber break, matrix cracking, and partial interlayer failure were observed under tension, whereas the diagonal slipped failure at both ends of the fractured fiber appeared under compression. Adsorption and shear displacement mechanisms at the interface were described in terms of electrical attraction and primary and secondary bonding forces.

• KEPCO Journal on Electric Power and Energy
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• 제1권1호
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• pp.127-134
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• 2015

Recently, the external bonding of carbon fiber reinforced polymer (CFRP) sheets has come to be regarded as a very effective method for strengthening of reinforced concrete structures. The behavior of CFRP-strengthened RC structure is mainly governed by the interfacial behavior, which represents the stress transfer and relative slip between concrete and the CFRP sheet. In this study, the effects of bonded length, width and concrete strength on the interfacial behavior are verified and a bond-slip model is proposed. The proposed bond-slip model has nonlinear ascending regions and exponential descending regions, facilitated by modifying the conventional bilinear bond-slip model. Finite element analysis results of interface element implemented with bond-slip model have shown good agreement with the experimental results performed in this study. It is found that the failure load and strain distribution predicted by finite element analysis with the proposed bond-slip are in good agreement with results of experiments.