• 전자공학회논문지A
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• 제29A권1호
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• pp.41-47
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• 1992

In SFB Process, after 110$0^{\circ}C$ annealing in wet OS12T(95$^{\circ}C$ HS12TO bubbling) atmosphere, the existence of the interfacial oxide film in micro-gap at Si-Si bonding interface was identified. The angle lapping/staining and SEM morphologies of bonding interface showed that the growing behavior of interfacial oxide made a contribution to eliminate the micro-gaps having a width of 200-300$\AA$. In case of the diodes composed of p-n wafer pairs made by SFB processes, the annealed one in wet OS12T atmosphere exhibited a dielectric breakdown phenomena of interfacial oxide at 37-40 volts d.c.

• 대한치과기공학회지
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• 제24권1호
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• pp.65-71
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• 2002

This study was performed to observe the microhardness change of the surface and the bonding strength between the porcelain and alloy specimens in order to investigate the effects of appended indium, tin and copper on interfacial properties of Au-Pd-Ag alloys. The hardness of castings was measured with a micro-Vicker's hardness tester. The interfacial shear bonding strength between alloy specimen and fused porcelain was measured with a mechanical testing system(MTS 858.20). The microhardness of Au-Pd-Ag alloy was increased by adding indium and tin, but not increased by adding copper. The shear bonding strength of Au-Pd-Ag-Sn alloy and Au-Pd-Ag-Cu alloy showed 87MPa, 57MPa. The higher concentration of adding elements showed the higher shear bonding strength.

• Nuclear Engineering and Technology
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• 제51권5호
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• pp.1333-1344
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• 2019

An integrated approach of model simplification for high burnup spent nuclear fuel is proposed based on material calibration using optimization. The spent fuel rods are simplified into a beam with a homogenous isotropic material. The proposed approach of model simplification is applied to fuel rods with two kinds of interfacial configurations between the fuel pellets and cladding. The differences among the generated models and the effects of interfacial bonding efficiency are discussed. The strategy of model simplification adopted in this work is to force the simplified beam model of spent fuel rods to possess the same compliance and failure characteristics under critical loads as those that result in the failure of detailed fuel rod models. It is envisioned that the simplified model would enable the assessment of fuel rod failure through an assembly-level analysis, without resorting to a refined model for an individual fuel rod. The effective material properties of the simplified beam model were successfully identified using the integrated optimization process. The feasibility of using the developed simplified beam models in dynamic impact simulations for a horizontal drop condition is examined, and discussions are provided.

• 한국안전학회지
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• 제38권2호
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• pp.1-7
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• 2023

Fiber-metal laminates (FMLs) and polymer matrix composites (PMCs) are formed in various ways. In particular, FMLs in which aluminum is laminated as a reinforced layer are widely used. Also, glass fiber-reinforced plastics (GFRPs) are generally applied as fiber laminates. The bonding interface layer between the aluminum and fiber laminate exhibits low strength when subjected to hot press fabrication in the event of delamination fracture at the interface. This study presents a simple method for strengthening the interface bonding between the aluminum metal and GFRP layer of FML composites. The surfaces of the aluminum interface layer are engraved with three kinds of patterns by using the laser machine before the hot press works. Furthermore, the effect of the laser patterns on the interfacial toughness is investigated. The interfacial toughness was evaluated by the energy release rate (G) using an asymmetric double cantilever bending specimen (ADCB). From the experimental results, it was shown that the strip type pattern (STP) has the most proper pattern shape in GFRP/Al FML composites. Therefore, this will be considered a useful method for the safety assessment of FML composite structures.

• Structural Engineering and Mechanics
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• 제74권5호
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• pp.589-600
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• 2020

The bonding interface of the concrete slab track and cement-asphalt mortar layer plays an important role in transferring load and restraining the track slab's deformation for slab track structures without concrete bollards in high-speed railway. However, the interfacial bond-slip behavior is seldom considered in the structural analysis; no credible constitutive model has been presented until now. Elaborating the field tests of concrete to cement-asphalt mortar interface subjected to longitudinal and transverse shear loads, this paper revealed its bond capacity and failure characteristics. Interfacial fractures all happen on the contact surface of the concrete track slab and mortar-layer in the experiments. Aiming at this failure mechanism, an interfacial mechanical model that employed the bilinear local bond-slip law was established. Then, the interfacial shear stresses of different loading stages and the load-displacement response were derived. By ensuring that the theoretical load-displacement curve is consistent with the experiment result, an interfacial bond-slip constitutive model including its the corresponding parameters was proposed in this paper. Additionally, a finite element model was used to validate this constitutive model further. The constitutive model presented in this paper can be used to describe the real interfacial bonding effect of slab track structures with similar materials under shear loads.

• 대한금속재료학회지
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• 제47권1호
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• pp.26-31
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• 2009

The effects of $Ar/O_2$ ion-beam pre-treatment conditions on the interfacial adhesion energy of sputterdeposited Cu thin film to FR-4 substrate were systematically investigated in order to understand the interfacial bonding mechanism for practical application to advanced chip-in-substrate package systems. Measured peel strength increases from $45.8{\pm}5.7g/mm$ to $61.3{\pm}2.4g/mm$ by $Ar/O_2$ ion-beam pre-treatment with anode voltage of 64 V. Interfacial bonding mechanism between sputter-deposited Cu film and FR-4 substrate seems to be dominated by chemical bonding effect rather than mechanical interlocking effect. It is found that chemical bonding intensity between carbon and oxygen at FR-4 surface increases due to $Ar/O_2$ ion-beam pretreatment, which seems to be related to the strong adhesion energy between sputter-deposited Cu film and FR-4 substrate.

• 마이크로전자및패키징학회지
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• 제18권4호
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• pp.11-18
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• 2011

3차원 칩 적층 접합에 사용하기 위한 Cu-Cu 금속 저온 접합 공정을 위하여 접합 온도 및 플라즈마 표면 전처리에 따른 열 압착 접합을 수행 하였다. 4점굽힘시험과 CCD 카메라를 이용하여 Cu 접합부의 정량적인 계면접착에너지를 평가하였다. 접합 온도 $250^{\circ}C$, $300^{\circ}C$, $350^{\circ}C$에서 각각 $1.38{\pm}1.06$(상한값), $7.91{\pm}0.27$(하한값), $10.36{\pm}1.01$(하한값) $J/m^2$으로 접합온도 $300^{\circ}C$ 이상에서 계면접착에너지 5 $J/m^2$ 이상의 값을 얻었다. 접합 온도 $300^{\circ}C$ 이하 낮은 온도에서 접합하기 위해 Cu-Cu 열 압착 접합 전 Ar+$H_2$ 플라즈마로 $200^{\circ}C$에서 2분간 표면 전처리 후 $250^{\circ}C$ 조건에서 열 압착 접합할 경우 계면접착에너지 값이 $6.59${\pm}0.03$(하한값) $J/m^2$로 표면 전 처리하지 않은 시험편에 비해 접합 특성이 크게 증가 하였다.

• Composites Research
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• 제21권4호
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• pp.7-14
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• 2008

접착제 이용 결합 조인트의 하중지지 능력 예측 기법은 점착제를 이용한 접합 조인트 설계에 있어서 가장 중요한 기술이다. 본 연구 계면 파괴역학을 이용하여 복합재료/금속 접착 조인트의 하중지시 능력을 예측하는 기법을 소개한다. 구체적으로 복합재료/탄소강 결합의 접착 강도를 계면 균열의 에너지 방출률과 계면 파괴인성치 개념을 사용하여 평가하는 방법을 제시 검증하였다. 계면 균열의 에너지 방출률은 유한요소해선 결과를 이용한 가상 균열 닫음 기법 (VCCT)을 사용하여 계산하였으며, 게면 파괴인성치는 이종재료 ENF (end-notched flexure) 시편을 고안하여 측정하였다. 고안된 이종 재료 ENF 시편을 사용하여 시편의 두께에 상관없이 일관된 Mode II 계면 파괴인성치를 측정할 수 있음과 양면 겹치기 접합 조인트의 특성 에너지 방출률이 측정된 계면 파괴인성치와 일치함을 확인하였다. 따라서 에너지 방출률에 근거한 계면 균열 진전 기준은 접착 조인트의 하중지지 능력을 신뢰성 있게 예측하는 실제적인 설계 도구로서 활용될 수 있다.

• Journal of Welding and Joining
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• 제29권6호
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• pp.65-70
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• 2011

The effect of flip chip bonding parameters on formation of intermetallic compounds (IMCs) between Au stud bumps and Sn-3.5Ag solder was investigated. In this study, flip chip bonding temperature was performed at $260^{\circ}C$ and $300^{\circ}C$ with various bonding times of 5, 10, and 20 sec. AuSn, $AuSn_2$ and $AuSn_4$ IMCs were formed at the interface of joints and (Au, Cu)$_6Sn_5$ IMC was observed near Cu pad side in the joint. At bonding temperature of $260^{\circ}C$, $AuSn_4$ IMC was dominant in the joint compared to other Au-Sn IMCs as bonding time increased. At bonding temperature of $300^{\circ}C$, $AuSn_2$ IMC clusters, which were surrounded by $AuSn_4$ IMC, were observed in the solder joint due to fast diffusivity of Au to molten solder with increased bonding temperature. Bond strength of Au stud bump joined with Sn-3.5Ag solder was about 23 gf/bump and fracture mode of the joint was intergranular fracture between $AuSn_2$ and $AuSn_4$ IMCs regardless bonding conditions.

• 대한용접접합학회:학술대회논문집
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• 대한용접접합학회 2002년도 Proceedings of the International Welding/Joining Conference-Korea
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• pp.65-69
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• 2002

An Al film deposited on the Kovar alloy substrate was anodically-bonded to the borosilicate glass, and the bond interfaces was closely investigated by transmission electron microscopy. Al oxide was found to form a layer ~l0 nm thick at the bond interface, and fibrous structure of the same oxide was found to grow epitaxially in the glass from the oxide layer. The fibrous structure grew with the bonding time. The mechanism of the formation of this fibrous structure is proposed on the basis of the migration of Al ions under the electric field. Penetration of Al into glass beyond the interfacial Al oxide was not detected. The comparison of the amount of excess oxygen ions generated in the alkali depletion layer with that incorporated in the Al oxide suggests that the growth of the alkali-ion depletion layer is controlled by the consumption of excess oxygen to form the interfacial Al oxide.