• Journal of electromagnetic engineering and science
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• v.4 no.2
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• pp.56-62
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• 2004

We present a multi-Gbit/s digital I/O interface based on RF-modulation and capacitive-coupling over an impedance matched transmission line. The RF-interconnect(RFI) can greatly reduce the digital switching noise and eliminate the dc power dissipation over the channel. It also enables reduced signal amplitude(as low as 200 ㎷) with enhanced data rate and affordable circuit overhead. This paper addresses the system advantages and implementation issues of RFI. A prototype on-chip RFI transceiver is implemented in 0.18-${\mu}{\textrm}{m}$ CMOS. It demonstrates a maximum data rate of 2.2 Gbit/s via 10.5-㎓ RF-modulation. The RFI can be very instrumental for future high-speed inter- and intra-ULSI data links.

• The Proceeding of the Korean Institute of Electromagnetic Engineering and Science
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• v.24 no.2
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• pp.35-50
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• 2013

This paper discusses effects of mesh planes on signal integrity in high-speed glass ceramic packages. One of serious signal integrity issues in high-speed glass ceramic packages is high far-end (FE) noise coupling between signal interconnects. Based on signal integrity analysis, a methodology is presented for reducing far-end noise coupling between signal interconnects in high-speed glass ceramic modules. This methodology employing power/ground mesh planes with alternating spacing and a via-connected coplanar-type shield (VCS) structure is suggested to minimize far-end noise coupling between signal lines in high-speed glass ceramic packages. Optimized interconnect structure based on this methodology has demonstrated that the saturated far-end noise coupling of a typical interconnect structure in glass ceramic modules could be reduced significantly by 73.3 %.

• KEPCO Journal on Electric Power and Energy
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• v.5 no.2
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• pp.121-125
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• 2019

A YSZ electrolyte based ceramic supported Solid Oxide Cell (SOC) and a metal interconnect supported SOC was investigated under both fuel cell and co-electrolysis (steam and $CO_2$) mode at $800^{\circ}C$. The single cell performance was analyzed by impedance spectra and product gas composition with gas chromatography(GC). The long-term performance in the co-electrolysis mode under a current density of $800mA/cm^2$ was obtained using steam and carbon dioxide ($CO_2$) mixed gas condition.

• Journal of the Korea Society of Computer and Information
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• v.24 no.2
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• pp.57-66
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• 2019

This paper compared the performance with an overview of channel equalization techniques used in high-speed serial transceivers, including the homogeneous architecture and associated components for the GHz interconnect of backplane and cable channels. It also used the MATLAB tool to present system analysis and simulation results for continuous time equivalent structures. In the case of conventional continuous equalization, high frequency deficits occur due to the use of a comparator that is difficult to implement as well as the low speed limit. In this paper, the channel equalization technique based on the power spectrum analysis of clocks was used to compensate for the frequency loss, and the application of the TX+Channel and TX+Equalizer filters enabled the measurement of attenuation and equivalence without comparators. The application of blender and band-pass filters at high speeds also showed significant effectiveness.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2000.04a
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• pp.35-40
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• 2000

MCM technology languished troughout most of the 1990's due to high costs resulting from low yields and issues with known god die. During the last five years of the decade new developments in chip scale packages and high density, build up multi-layer printed wiring boards created new opportunities to design and produce ultra miniaturized modules using conventional surface mount manufacturing capabilities. Focus on the miniaturization of substrate based packages such as ball grid arrays (BGAs) resulted in chip scale packages (CSPs) offering many of the benefits of flip chip along with the handling, testing, manufacturing and reliability capabilities of packaged deviced. New developments in the PWB industry sought to reduce the size, weight, thickness and cost of high density interconnect (HDI) substrates. Shrinking geometries of vias and new constructions significantly increased the interconnect density available for MCM-L applications. This paper describes the most promising CSP and HDI technologies for portable products, high performance computing and dense multi-chip modules.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2013.05a
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• pp.479-480
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• 2013

• Communications of the Korean Institute of Information Scientists and Engineers
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• v.31 no.4
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• pp.62-69
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• 2013

• Proceedings of the Materials Research Society of Korea Conference
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• 1992.05a
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• pp.26-27
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• 1992

• Proceedings of the Korean Institute of Communication Sciences Conference
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• 2004.07a
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• pp.127-127
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• 2004

• 한국전기화학회:학술대회논문집
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• 2004.04a
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• pp.70-70
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• 2004