• 전자통신동향분석
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• 제33권6호
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• pp.34-40
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• 2018

Traditionally, many researchers have conducted research on terahertz technology utilizing optical devices such as lasers. However, nanometer-scale electronic devices using silicon or III-V compound semiconductors have received significant attention regarding the development of a terahertz system owing to the rapid scaling down of devices. This enables an operating frequency of up to approximately 0.5 THz for silicon, and approximately 1 THz for III-V devices. This article reviews the recent trends of terahertz monolithic integrated circuits based on several electronic devices such as CMOS, SiGe BiCMOS, and InP HBT/HEMT, and a particular quantum device, an RTD.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2000년도 Proceedings of 5th International Joint Symposium on Microeletronics and Packaging
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• pp.29-33
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• 2000

MEMS, Micro Electro-Mechanical Systems, present one of the greatest advanced packaging challenges of the next decade. Historically hybrid technology, generally thick film, provided sensors and actuators while integrated circuit technologies provided the microelectronics for interpretation and control of the sensor input and actuator output. Brought together in MEMS these technical fields create new opportunities for miniaturization and performance. Integrated circuit processing technologies combined with hybrid design systems yield innovative sensors and actuators for a variety of applications from single crystal silicon wafers. MEMS packages, far more simple in principle than today's electronic packages, provide only physical protection to the devices they house. However, they cannot interfere with the function of the devices and often must actually facilitate the performance of the device. For example, a pressure transducer may need to be open to atmospheric pressure on one side of the detector yet protected from contamination and blockage. Similarly, an optical device requires protection from contamination without optical attenuation or distortion being introduced. Despite impediments such as package standardization and complexity, MEMS markets expect to double by 2003 to more than ＄9 billion, largely driven by micro-fluidic applications in the medical arena. Like the semiconductor industry before it. MEMS present many diverse demands on the advanced packaging engineering community. With focused effort, particularly on standards and packaging process efficiency. MEMS may offer the greatest opportunity for technical advancement as well as profitability in advanced packaging in the first decade of the 21st century! This paper explores MEMS packaging opportunities and reviews specific technical challenges to be met.

• 한국광학회지
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• 제16권4호
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• pp.366-375
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• 2005

Ti 확산 리튬나오베이트 채널 광도파로의 z-축 분극을 주기적으로 $180^{\circ}$ 위상 변화시키는 Ti:PPLN 제작 공정을 검토하고, 개선하였다. 분극반전 공정에 적합한 지그와 Labview 프로그램을 이용하여 전하량 제어시스템을 고안하였다. 분극반전에 필요한 전하량으로부터 분극에 적절한 고전압 펄스와 duty-cycle을 조절하였으며, 분극에 필요한 임계 전압 보다 작은 전압을 인가한 상태에서 누설전류의 변화를 관찰하여 절연파괴 현상을 또한 최소화하였다.

• 진공이야기
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• 제4권3호
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• pp.16-20
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• 2017

Graphene has emerged as a promising material for optoelectronic applications including as ultrafast and broadband photodetector, optical modulator, and nonlinear photonic devices. Graphene based devices have shown the feasibility of ultrafast signal processing for required for photonic integrated circuits. However, on-chip monolithic nanoscale light source has remained challenges. Graphene's high current density, thermal stability, low heat capacity and non-equilibrium of electron and lattice temperature properties suggest that graphene as promising thermal light source. Early efforts showed infrared thermal radiation from substrate supported graphene device, with temperature limited due to significant cooling to substrate. The recent demonstration of bright visible light emission from suspended graphene achieve temperature up to ~3000 K and increase efficiency by reducing the heat dissipation and electron scattering. The world's thinnest graphene light source provides a promising path for on-chip light source for optical communication and next-generation display module.

• Journal of the Optical Society of Korea
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• 제20권2호
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• pp.291-299
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• 2016

We have investigated the ultimate limits of nonuniform grating couplers (NGCs) for optimized fiber coupling to silicon waveguides, compared to uniform grating couplers (UGCs). Simple grating coupler schemes, which can be fabricated in etching steps of the conventional complementary metal-oxide semiconductor (CMOS) process on silicon-on-insulator (SOI) wafers without forming any additional overlay structure, have been simulated numerically and demonstrated experimentally. Optimum values of the grating period, fill factor, and groove number for ultimate coupling efficiency of the NGCs are determined from finite-difference time-domain (FDTD) simulation, and confirmed with experimentally demonstrated devices by comparison to those for the UGCs. Our simulated results indicate that maximum coupling efficiency of NGCs is possible when the minimum pattern size is below 50 nm, but the experimental value for the maximum coupling efficiency is limited by the attainable fabrication tolerance in a practical device process.

• Journal of Electrical Engineering and Technology
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• 제4권2호
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• pp.287-291
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• 2009

In this paper, an optical switch/modulator is designed and its light propagating characteristics analyzed using a simplified BPM. The distinctive feature of this switch/modulator is that all its waveguide branches are designed as single-mode. The principle of the device is based on the coupled mode theory in the Y-junction interconnecting waveguide. In spite of the fact all waveguides are designed as single-mode, by adjusting the interconnecting waveguide length'of the device the same characteristics as existing up to date devices are obtainable. Numerical results show that the switching characteristics periodically depend upon an interconnecting waveguide length with a spatial of about $150^{{\mu}m}$ in the $Ti:LiNbO_3$ step index waveguide. The design concept would therefore be utilized effectively in fabricating a monolithic high density optical integrated circuit.

• Investigative Magnetic Resonance Imaging
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• 제25권4호
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• pp.218-228
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• 2021

Due to their high degree of freedom to transfer and acquire light, fiber optics can be used in the presence of strong magnetic fields. Hence, optical sensing and imaging based on fiber optics can be integrated with magnetic resonance imaging (MRI) diagnostic systems to acquire valuable information on biological tissues and organs based on a magnetic field. In this article, we explored the combination of MRI and optical sensing/imaging techniques by classifying them into the following topics: 1) functional near-infrared spectroscopy with functional MRI for brain studies and brain disease diagnoses, 2) integration of fiber-optic molecular imaging and optogenetic stimulation with MRI, and 3) optical therapeutic applications with an MRI guidance system. Through these investigations, we believe that a combination of MRI and optical sensing/imaging techniques can be employed as both research methods for multidisciplinary studies and clinical diagnostic/therapeutic devices.

• Nano
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• 제13권11호
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• pp.1850126.1-1850126.10
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• 2018

Flexible strain sensors, as the core member of the family of smart electronic devices, along with reasonable sensing range and sensitivity plus low cost, have rose a huge consumer market and also immense interests in fundamental studies and technological applications, especially in the field of biomimetic robots movement detection and human health condition monitoring. In this paper, we propose a new flexible strain sensor based on thick CVD graphene film and its low-cost fabrication strategy by using the commercial adhesive tape as flexible substrate. The tensile tests in a strain range of ~30% were implemented, and a gage factor of 30 was achieved under high strain condition. The optical microscopic observation with different strains showed the evolution of cracks in graphene film. Together with commonly used platelet overlap theory and percolation network theory for sensor resistance modeling, we established an overlap destructive resistance model to analyze the sensing mechanism of our devices, which fitted the experimental data very well. The finding of difference of fitting parameters in small and large strain ranges revealed the multiple stage feature of graphene crack evolution. The resistance fallback phenomenon due to the viscoelasticity of flexible substrate was analyzed. Our flexible strain sensor with low cost and simple fabrication process exhibits great potential for commercial applications.

• 한국광학회지
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• 제16권4호
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• pp.376-383
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• 2005

[ $Ti:LiNbO_3$ ] 채널 광도파로와 전기광학효과를 이용하여 설계된 집적광학 파장가변 편광모드 조절기를 설계 및 제작하고, 동작특성을 측정하였다. 소자는 $TE↔TM$ 모드변환기와 TE./TM 위상변환기로 구성되었으며, Jones 매트릭스를 이용하여 각각의 전달 매트릭스를 유도하였다. 위상변환기에 의한 파장 변환율을 전산 모사하였으며, 제작된 소자의 동작 특성들을 확인하였다. 폴래리미터와 Poincare 구 좌표계를 이용하여 편광 조절기의 동작 상태를 체계적으로 측정하였다.

• 한국통신학회논문지
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• 제25권5A호
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• pp.674-681
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• 2000

제작 공정이 단순하고 결합길이가 매우 짧은 폴리머를 이용한 수직형 비대칭 광 결합기를 새로이 제안하였다. 제안된 소자의 결합 특성을 분석하여 최적화를 도모하였다. 광통신 파장대인 1.33$\mu\textrm{m}$, TE모드에서 중간 버퍼층 두께 t=0.4$\mu\textrm{m}$이고, nu=1.522, n1=1.51이고 nt=1.49일 때, 결합길이가 277$\mu\textrm{m}$이며, 최고 94%의 결합효율을 얻을 수 있었다. 이는 전체 소자길이를 감소시켜, 도파 손실을 줄일 수 있으며, 고직적화는 물론 공정의 단순화로 인한 생산 시간 및 비용 절감과 향 후 광 스위치나 변조기로의 응용도 기대된다.