• 제목/요약/키워드: hot electron degradation

검색결과 40건 처리시간 0.022초

A New Strained-Si Channel Power MOSFET for High Performance Applications

  • Cho, Young-Kyun;Roh, Tae-Moon;Kim, Jong-Dae
    • ETRI Journal
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    • 제28권2호
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    • pp.253-256
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    • 2006
  • We propose a novel power metal oxide semiconductor field effect transistor (MOSFET) employing a strained-Si channel structure to improve the current drivability and on-resistance characteristic of the high-voltage MOSFET. A 20 nm thick strained-Si low field channel NMOSFET with a $0.75\;{\mu}m$ thick $Si_{0.8}Ge_{0.2}$ buffer layer improved the drive current by 20% with a 25% reduction in on-resistance compared with a conventional Si channel high-voltage NMOSFET, while suppressing the breakdown voltage and subthreshold slope characteristic degradation by 6% and 8%, respectively. Also, the strained-Si high-voltage NMOSFET improved the transconductance by 28% and 52% at the linear and saturation regimes.

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고집적화된 1TC SONOS 플래시 메모리에 관한 연구 (A Study on the High Integrated 1TC SONOS flash Memory)

  • 김주연;김병철;서광열
    • 한국전기전자재료학회논문지
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    • 제16권5호
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    • pp.372-377
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    • 2003
  • To realize a high integrated flash memory utilizing SONOS memory devices, the NOR type ITC(one Transistor Cell) SONOS flash arrays are fabricated and characterized. This SONOS flash arrays with the common source lines are designed and fabricated by conventional 0.35$\mu\textrm{m}$ CMOS process. The thickness of ONO for memory cells is tunnel oxide of 34${\AA}$, nitride of 73${\AA}$ and blocking oxide of 34${\AA}$ . To investigate operating characteristics, CHEI(Channel Hot Electron Injection) method and bit line method are selected as the program and 4he erase operation, respectively. The disturbance characteristics ,according to the program/erase/read cycling are also examined. The degradation characteristics are investigated and then the reliability of SONOS flash memory is guaranteed.

Effect of Biological and Liquid Hot Water Pretreatments on Ethanol Yield from Mengkuang (Pandanus artocarpus Griff)

  • Yanti, Hikma;Syafii, Wasrin;Wistara, Nyoman J;Febrianto, Fauzi;Kim, Nam Hun
    • Journal of the Korean Wood Science and Technology
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    • 제47권2호
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    • pp.145-162
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    • 2019
  • This study aimed to increase the sugar and ethanol yield from the mengkuang plant biomass through biological and liquid hot water (LHW) pretreatment and their combination. The results showed that biological pretreatments with 5% inoculum of the fungus Trametes versicolor resulted in the highest alpha cellulose content incubated for 30 days, and 10% inoculum resulted in the lowest lignin content. LHW pretreatment decreased the hemicellulose content of pulps from 10.17% to 9.99%. T. versicolor altered the structure of the mengkuang pulp by degrading the lignin and lignocellulose matrix. The resulting delignification and cellulose degradation facilitate the hydrolysis of cellulose into sugars. The alpha cellulose content after biological-LHW pretreatment was higher (78.99%) compared to LHW-biological pretreatment (76.85%). Scanning electron microscopy analysis showed that biological-LHW combinated treatment degrades the cell wall structures. The ethanol yield for biological-LHW pretreated sample was observed 43.86% (13.11 g/L ethanol by weight of the substrate, which is much higher than that of LHW-biological pretreatment (34.02%; 9.097 g/L). The highest reducing sugar content about 45.10% was observed with a resulting ethanol content of 15.5 g/L at LHW pretreatment temperature of $180^{\circ}C$ for 30 min.

초고집적 회로를 위한 SIMOX SOI 기술

  • 조남인
    • 전자통신동향분석
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    • 제5권1호
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    • pp.55-70
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    • 1990
  • SIMOX SOI is known to be one of the most useful technologies for fabrications of new generation ULSI devices. This paper describes the current status of SIMOX SOI technology for ULSI applications. The SIMOX wafer is vertically composed of buried oxide layer and silicon epitaxial layer on top of the silicon substrate. The buried oxide layer is used for the vertical isolation of devices The oxide layer is formed by high energy ion implantation of high dose oxygen into the silicon wafer, followed by high temperature annealing. SIMOX-based CMOS fabrication is transparent to the conventional IC processing steps without well formation. Furthermore, thin film CMOX/SIMOX can overcome the technological limitations which encountered in submicron bulk-based CMOS devices, i.e., soft-error rate, subthreshold slope, threshold voltage roll-off, and hot electron degradation can be improved. SIMOX-based bipolar devices are expected to have high density which comparable to the CMOX circuits. Radiation hardness properties of SIMOX SOI extend its application fields to space and military devices, since military ICs should be operational in radiation-hardened and harsh environments. The cost of SIMOX wafer preparation is high at present, but it is expected to reduce as volume increases. Recent studies about SIMOX SOI technology have demonstrated that the performance of the SIMOX-based submicron devices is superior to the circuits using the bulk silicon.

내산화 및 열차폐 코팅처리 가스터빈 블레이드의 균열거동 (Crack Initiation and Propagation at the Gas Turbine Blade with Antioxidation and Thermal Barrier Coating)

  • 강명수;김준성
    • 한국정밀공학회지
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    • 제27권12호
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    • pp.99-106
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    • 2010
  • Gas turbines operation for power generation increased rapidly since 1990 due to the high efficiency in combined cycle, relatively low construction cost and low emission. But the operation and maintenance cost for gas turbine is high because the expensive superalloy hot gas path parts should be repaired and replaced periodically This study analyzed the initiation and propagation of the crack at the gas turbine blades which are coated with MCrAIY as a bond coat and TBC as a top coat. The sample blades had been serviced at the actual gas turbines for power generation. Total 7 sets of blades were analyzed and they have different EOH(equivalent operation hour). Blades were sectioned and the cracking distribution were measured and analyzed utilizing SEM(scanning electron microscope) and optical microscope. The blades which had 52,000 EOH of operation had cracks at the substrate and the maximum depth was 0.2 mm. Most of the cracks initiated at the boundary layer between TBC and bond coat and propagated down to the bond coat. Once bond coat is cracked, the base metal is exposed to the oxidation condition and undergoes notch effect. Under this environment, the crack branched at the inter-diffusion layer and propagated to the substrate. Critical cracks affecting the blade life were analyzed as those on suction side and platform.

게이트 물질을 달리한 MOS소자의 플라즈마 피해에 대한 신뢰도 특성 분석 (The Evaluation for Reliability Characteristics of MOS Devices with Different Gate Materials by Plasma Etching Process)

  • 윤재석
    • 한국정보통신학회논문지
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    • 제4권2호
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    • pp.297-305
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    • 2000
  • 본 논문에서는 다양한 안테나 면적을 가지는 다결정실리콘(poly-Si) 및 폴리사이드(polycide) 게이트 물질을 게이트로 갖는 커패시터 및 n/p-MOS 트랜지스터를 사용하여 AAR(Antenna Area Ratio)의 크기에 따른 플라즈마 피해를 측정 및 분석하였다. 플라즈마 공정에 대한 신뢰도 특성을 조사하기 위해, MOS 소자의 게이트 물질을 달리하여 플라즈마 공정에 대한 초기 특성 및 F-N 스트레스와 hot carrier 스트레스 인가시의 n/p-MOSFET의 열화 특성을 측정한 결과 금속 AR에 의하여 플라즈마 공정의 영향을 받는 것으로 관찰되었다. 폴리사이드 게이트 구조가 다결정실리콘 게이트 구조보다 AAR에 따른 정전류 스트레스 인가시의 TDDB(Time Dependent Dielectric Breakdown)및 게이트 전압의 변화 등과 같은 신뢰성 특성에서 상당히 개선됨을 알 수 있었다. 이는 텅스텐 폴리사이드 형성 공정 중에 불소가 게이트 산화막에 함유되었기 때문인 것으로 설명할 수 있으며, 게이트 물질로 폴리사이드를 사용한 소자에서 플라즈마 영향을 줄일 수 있다는 사실이 차세대 MOS 소자의 게이트 박막으로 폴리사이드 게이트 박막을 활용할 수 있는 가능성을 확인하였다.

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실리콘 게이트전극을 갖는 고온소자와 금속 게이트전극을 갖는 P형 저온 다결정 실리콘 박막 트랜지스터의 전기특성 비교 연구 (A Research About P-type Polycrystalline Silicon Thin Film Transistors of Low Temperature with Metal Gate Electrode and High Temperature with Gate Poly Silicon)

  • 이진민
    • 한국전기전자재료학회논문지
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    • 제24권6호
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    • pp.433-439
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    • 2011
  • Poly Si TFTs (poly silicon thin film transistors) with p channel those are annealed HT (high temperature) with gate poly crystalline silicon and LT (low temperature) with metal gate electrode were fabricated on quartz substrate using the analyzed data and compared according to the activated grade silicon thin films and the size of device channel. The electrical characteristics of HT poly-Si TFTs increased those are the on current, electron mobility and decrease threshold voltage by the quality of particles of active thin films annealed at high temperature. But the on/off current ratio reduced by increase of the off current depend on the hot carrier applied to high gate voltage. Even though the size of the particles annealed at low temperature are bigger than HT poly-Si TFTs due to defect in the activated grade poly crystal silicon and the grain boundary, the characteristics of LT poly-Si TFTs were investigated deterioration phenomena those are decrease the electric off current, electron mobility and increase threshold voltage. The results of transconductance show that slope depend on the quality of particles and the amplitude depend on the size of the active silicon particles.

염소(Chlorine)가 도입된 $SiO_2/Si$ 계면을 가지는 게이트 산화막의 특성 분석 (Characterization of Gate Oxides with a Chlorine Incorporated $SiO_2/Si$ Interface)

  • 유병곤;유종선;노태문;남기수
    • 한국진공학회지
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    • 제2권2호
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    • pp.188-198
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    • 1993
  • 두께가 6~10 nm인 게이트 산화막의 계면에 염소(Cl)를 도입시킨 n-MOS capacitor 및 n-MOSFET을 제잘하여 물성적인 방법(SIMS, ESCA)과 전기적인 방법에 의해서 소자의 특성을 분석, 평가하였다. Last step TCA법을 이용하여 성장시킨 산화막은 No TCA법으로 성장시킨 것보다 mobility가 7% 정도 증가하였고, 결함 밀도도 감소하였다. Time-zero-dielectric-breakdown(TZDB)으로 측정한 결과, Cl를 도입한 막의 파괴 전계(breakdon field)는 18 MV/cm인데, 이것은 Cl을 도입하지 않은 것보다 약 0.6 MV/cm 정도 높은 값이다. 또한 time-dependent-dielectric-breakdown(TDDB) 결과로부터 수명이 20년 이상인 것으로 평가되었고, hot carrier 신뢰성 측정으로부터 평가한 소자의 수명도 양호한 것으로 나타났다. 이상의 결과에서 Cl을 계면에 도입시킨 게이트 산화막을 가진 소자가 좋은 특성을 나타내고 있으므로 Last step TCA법을 종래의 산화막 성장 방법 대신에 사용하면 MOSFET 소자의 새로운 게이트 절연막 성장법으로서 대단히 유용할 것으로 생각된다.

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두과 작물의 경실종자 발아촉진에 대한 종피연화처리의 효과 (Effects of Scarification and Water Soaking Treatment on Germination of Hard-Seeded Legumes)

  • 김석현;장미하;정종일;심상인
    • 한국작물학회지
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    • 제54권3호
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    • pp.320-326
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    • 2009
  • 우리나라 재래 수집종인 제비콩, 갓끈동부와 쥐눈이콩은 종피가 매우 두껍고 딱딱하여 물 흡수가 어려워 발아율이 각각 26%, 17%와 5%에 불가하다. 이들 종자는 저장성에서 그 가치가 높이 평가되지만, 포장에 파종할 때 발아율이 낮아 문제가 되고 있다. 본 연구에서는 이들 종자의 발아율을 향상시키기 위하여 몇 가지 종피약화 처리를 실시하여 가장 효과적인 방법을 도출하였다. 종피약화 처리방법 중 가장 정상묘율이 높은 것은 제비콩은 tap water ($20^{\circ}C$)에서 24시간 침지 했을 때 85%이였으며, 갓끈동부는 hot water에서 8시간 침지했을 때 45%이였다. 그러나 소립이고 경도가 높은 쥐눈이콩은 진한 sulfuric acid에 10분간 침지 했을 때 72%의 정상묘율을 보였다.

진공 플라즈마 용사법을 통해 형성된 NiCoCrAlY 오버레이 코팅의 반복 산화 거동 (Cyclic Oxidation Behavior of Vacuum Plasma Sprayed NiCoCrAlY Overlay Coatings)

  • 유연우;남욱희;박훈관;박영진;이성훈;변응선
    • 한국표면공학회지
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    • 제52권6호
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    • pp.283-288
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    • 2019
  • MCrAlY overaly coatings are used as oxidation barrier coatings to prevent degradation of the underlying substrate in high temperature and oxidizing environment of the hot section of gas turbines. Therefore, oxidation resistance in high temperature is important property of MCrAlY coatings. Also, coefficients of thermal expansion (CTE) of MCrAlY have middle value of that of Ni-based superalloys and oxides, which have the effect of preventing the delamination of the surface oxides. Cyclic oxidation test is one of the most useful methods for evaluating the high temperature durability of coatings used in gas turbines. In this study, NiCoCrAlY overlay coatings were formed on Inconel 792(IN 792) substrates by vacuum plasma spraying process. Vacuum plasma sprayed NiCoCrAlY coatings and IN 792 susbstrates were exposed to 1000℃ one-hour cyclic oxidation environment. NiCoCrAlY coatings showed lower weight gain in short-term oxidation. In long-term oxidation, IN 792 substrates showed higher weight loss due to delamination of surface oxide but NiCoCrAlY coatings showed lower weight loss. X-ray diffraction (XRD) analysis showed α-Al2O3 and NiCr2O4 was formed during the cyclic oxidation test. Through cross-section observation using scanning electron microscopy (SEM) and electron back scatter diffraction (EBSD) analysis, thermally grown oxide (TGO) layer composed of α-Al2O3 and NiCr2O4 was formed and the thickness of TGO increased during 1000℃ cyclic oxidation test. β phase in upper side of NiCoCrAlY coating was depleted due to oxidation of Al and outer beta depletion zone thickness also increased as the cyclic oxidation time increased.