• 한국막학회:학술대회논문집
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• 한국막학회 2004년도 첨단 분리막 연구동향
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• pp.13-35
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• 2004

Metal Complexes in Macromolecules Applications of Polymer Electrolyte Membranes Facilitated Transport in Solid State Roles of Electrolytes in Solar Cells - Electrolytes :ㆍI- and $I_3$-conductor ㆍelectron barrier or hole conductor ㆍelectrochemical redox reaction media ㆍinterfacial contactor for dye, $TiO_2$ and electrode ㆍmechanical separator (omitted)

• 한국전기전자재료학회논문지
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• 제33권2호
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• pp.118-122
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• 2020

Inorganic-organic hybrid perovskite solar cells have demonstrated a significant achievement by reaching a certified power conversion efficiency of 25.2% in 2019 as compared to that of 3.8% in 2009. However, organic hole conductors such as PTAA and spiro-OMeTAD are known to be expensive and unstable when they are exposed to operational conditions. In this study, the inorganic hole conductor CuSCN was used to overcome such concerns. The influence of dipropyl sulfide (DPS) and diethyl sulfide (DES) as CuSCN deposition solvents on the underlying perovskite active layer was investigated. DES solvent was observed to be advantageous in terms of CuSCN solubility and mild for the perovskite layer, thereby resulting in a power conversion efficiency of 16.9%.

• 대한전기학회논문지:전기기기및에너지변환시스템부문B
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• 제51권5호
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• pp.228-233
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• 2002

A computational method for analysis of the 3 dimensional electro-magnetic induction problems has been developed. The developed method is capable of modeling the induced current and analyzing its characteristics using only scalar Potential at each node. A benchmark model of asymmetrical conductor with a hole is analyzed to verify the application of the developed method. The calculated value of magnetic flux density are compared with the measured value, and the results indicate that the developed method is valid. Also, Comparing with 3-D finite element method (FEM) results, we conformed effectiveness of the developed method for the accuracy and computation times.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2001년도 추계학술대회논문집B
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• pp.54-58
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• 2001

The measurement method of the spectral emissivity by using hemispherical mirror which has an inclined observation hole is studied. This method is useful in measuring the spectral emissivity of the solid material both conductor and non-conductor. In this study, the effective reflectivity of the hemispherical mirror is also measured for calculating the spectral emissivity of materials. The effective reflectivity measured is 0.9.

• 대한기계학회논문집B
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• 제27권6호
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• pp.789-795
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• 2003

It is studied that the measuring method of the spectral emissivity by using hemispherical mirror with an inclined observation hole. The in-service calibration method of mirror reflectivity is also dealed with. It is possible to apply this method on measuring emissivity of conductor or non-conductor.

• 대한전기학회:학술대회논문집
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• 대한전기학회 2007년도 제38회 하계학술대회
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• pp.284-285
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• 2007

In this paper, we present the effect on a novel transmission line filter response by the etch hole position on the suspended ground and the residue on the resonator under ground plane. We defined the etch hole offset as the distance from the sidewall of the suspended ground to the nearest side of the etch holes. We simulated new filter responses to reflect the real value of the changed etch hole offset caused by characteristics of negative photoresist. Return loss is distorted by the residue on the center conductor remained after sacrificial layer removing. By comparison of simulation and measurements, we concluded the residue on the resonator distorted the RF response worse than etch hole offset variation did.

• 소성∙가공
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• 제14권3호
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• pp.277-281
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• 2005

LTCC(Low temperature co-fired ceramic) is being recognized as a significant packaging material of electrical devices for the advantages such as relatively low temperature being needed for process, low conductor resistance and high printing resolution. In the process of LTCC electrical devices, the punched via-hole quality is one of the most important factors on the performance of the device. However, its mechanism is very complicated and optimization of the process seems difficult. In this paper, to clarify the process, via-hole punching experiments were carried out and the punched holes were examined in terms of their burr formation. The effects of thickness of PET sheet, ceramic sheet and punch-to- die clearance on via-hole quality were also discussed. Optimum process conditions are proposed and a factor $\kappa$ is introduced to express effect of the process variables.

• Current Applied Physics
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• 제18권12호
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• pp.1583-1591
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• 2018

We analysed perovskite $CH_3NH_3PbI_{3-x}Cl_x$ inverted planer structure solar cell with nickel oxide (NiO) and spiroMeOTAD as hole conductors. This structure is free from electron transport layer. The thickness is optimized for NiO and spiro-MeOTAD hole conducting materials and the devices do not exhibit any significant variation for both hole transport materials. The back metal contact work function is varied for NiO hole conductor and observed that Ni and Co metals may be suitable back contacts for efficient carrier dynamics. The solar photovoltaic response showed a linear decrease in efficiency with increasing temperature. The electron affinity and band gap of transparent conducting oxide and NiO layers are varied to understand their impact on conduction and valence band offsets. A range of suitable band gap and electron affinity values are found essential for efficient device performance.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2005년도 춘계학술대회 논문집
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• pp.738-742
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• 2005

Rapid Prototype has been used to design and Production of part in a variety of fields ; Car, Electronic products, Aviation, Heavy industry etc. Moreover development of hardware gave rise to use the method of Rapid Prototype more and more at high precision and complicated shapes. Expecially, to be using process of products that shapes of Micro-hole ; Cellular phones, Antennas, Jewels, Semi conductor cases. In case of Micro-shape, precision of the shape turns on various condition ; Laser size, Laminate height, scanning speed, overcure, viscosity of resin, etc. Sometimes breaks out the case that interner hole of shape is blocked by viscosity of resin. The phenomenon has solved easily to reduce viscosity of resin. But, in case of the method brings about the problem that strength goes down in actuality products hardening. This study on verify to change of shape of Micro-hole and makes the semiconductor case which has shape of Micro-hole by using resin of higher viscosity, scanning speed and overcure

• 한국소성가공학회:학술대회논문집
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• 한국소성가공학회 2004년도 제3회 금형가공 심포지엄
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• pp.260-265
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• 2004

LTCC(Low temperature co-fired ceramic) is being recognized as a significant packaging material of electrical devices for the advantages such as relatively low temperature being needed for process, low conductor resistance and high printing resolution. In the process of LTCC electrical devices, the punched via-hole quality is one of the most important factors on the performance of the device. However, its mechanism is very complicated and optimization of the process seems difficult. In this paper, to clarify the process, via-hole punching experiments were carried out and the punched holes were examined in terms of their burr formation. The effects of thickness of PET sheet and ceramic sheet and punch-to-die clearance on via-hole quality were also discussed. Optimum process conditions are proposed and a factor k is introduced to express effect of the process variables.