• Proceedings of the KSR Conference
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• 2008.06a
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• pp.535-544
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• 2008

Unlike MS(Magnetic Stripe), SMART CARD is equipped with COS(Chip Operating System) consisting of the Microprocessor and Memory where information can be stored and processed, and there are two types of cards according to the contact mode; the contact type that passes through a gold plated area and the contactless one that goes through the radio-frequency using an antenna embedded in the plastic card. the contactless IC card used for the transportation card was first introduced into local area buses in Seoul, and expanded throughout the country so that it has removed the inconvenience such as possession of cash, fare payment and collection. Focusing on the Seoul metropolitan area in 2004, prepaid and pay later cards were adopted and have been used interchangeably between a bus and subway. The card terminal compatible between a bus and subway is Proximity Integrated Circuit Card(PICC) as international standards(1443 Type A,B), communicates in the 13.56MHz dynamic frequency modulation-demodulation system, and adopts the Multi Secure Application Module(SAM). In the second half of 2009, the system avaliable nationwide will be built when the payment SAM standard is implemented.

• JSTS:Journal of Semiconductor Technology and Science
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• v.13 no.1
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• pp.15-21
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• 2013

In this paper, a MEMS tunable capacitor was successfully designed and fabricated using an aluminum nitride film and a gold suspended membrane with two air gap structure for commercial RF applications. Unlike conventional two-parallel-plate tunable capacitors, the proposed tunable capacitor consists of one air suspended top electrode and two fixed bottom electrodes. One fixed and the top movable electrodes form a variable capacitor, while the other one provides necessary electrostatic actuation. The fabricated tunable capacitor exhibited a capacitance tuning range of 375% at 2 GHz, exceeding the theoretical limit of conventional two-parallel-plate tunable capacitors. In case of the contact state, the maximal quality factor was approximately 25 at 1.5 GHz. The developed fabrication process is also compatible with the existing standard IC (integrated circuit) technology, which makes it suitable for on chip intelligent transceivers and radios.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.06a
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• pp.353-353
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• 2008

트랜지스터 속도는 현저하게 향상되어지는 반면에 RFICs(RF integrated circuits)는 대용량화, 고속화, 고집적화, 소형화, 고 효율화 온칩(on-chip) 수동소자의 부재에 의해 발전을 이루지 못하였다. 즉, 최근 전자기기의 집적화, 초소형화 됨에 따라 실장 밀도를 높이기 위해 부품의 소형화가 강하게 요구되는 동시에 Radio Frequency(RF)에서 이용가능한 수동소자인 capacitor를 개발하고자 본 논문에서는 손가락 모양(interdigital configuration)을 갖는 RF capacitor를 Ansoft사의 HFSS를 이용하여 이상적인 S-parameter, 정전용랑(capacitance), 손실계수(loss tangent)를 도출하고자 한다. 680um의 $Al_2O_3$ 기판에 BST doped MgO을 30um, Chromium과 gold를 각각 5um로 증착시켰다. 핑거 개수 (n, number), 핑거 길이(1, length), 핑거 간격(g, gap), 핑거 너비(w, width)를 변화 시켜가면서 이상적인 결과 값에 가까운 모양 (interdigital configuration)을 얻을 수 있었다. 핑거 수 3 개 일 때 입력 값에 대하여 손실 없는 출력 값(투과값)을 갖는 $S_{21}$이 1.5GHz에서 6dB이하로 떨어졌으며 핑거 간격이 줄고 핑거 너비가 커지고 핑거길이가 커질수록 높은 캐패시턴스 값을 갖는 것을 확인 할 수 있었다.

• Proceedings of the KIEE Conference
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• 2005.07c
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• pp.2407-2409
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• 2005

본 논문에서는 다양한 생물분자 감지를 위한 센서로 마이크로캔틸레버를 제안하였고 이것을 이용해 여러 생물 분자들을 광학적, 전기적으로 분석하였다. 마이로캔틸레버는 표면 미세 가공 기술로 제작되었고, 이러한 제작 방식은 공정이 간단하고 비용이 적게 들며 센서 array가 가능하다는 장점을 갖는다. 생물분자를 포함하는 용액을 주입하기 위하여 PDMS와 fused silica glass를 이용해 fluid cell system을 제작하였다. 마이크로캔틸레버 상단의 gold가 코팅된 부분에서 생물분자의 자기조립 (self assembly)현상이 일어나고 이는 마이크로캔틸레버 상, 하단의 표면 스트레스 차이를 야기 시킨다. 이로 인해 마이크로캔틸레버 자체의 휘어짐 현상이 일어나게 되고 이러한 휘어진 정도를 측정함으로써 마이크로캔틸레버의 생물분자 감지능을 확인할 수 있었다. Cystamine dihydrochloride와 glutaraldehyde 분자를 분석하였고 각기 다른 농도의 cystamine dihydrochloride 용액에서도 실험함으로써 농도별 감지능 또한 확인하였다. 이러한 생물분자 감지를 위한 마이크로캔틸레버의 센서로써의 성능은 u-TAS 와 lab-on-a-chip에서 유용히 이용될 수 있으리라 확신한다.

• Journal of the Microelectronics and Packaging Society
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• v.22 no.2
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• pp.47-53
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• 2015

The effects of electroless nickel immersion gold (ENIG) and organic solderability preservative (OSP) surface finishes on the in-situ intermetallics reaction and the electromigration (EM) reliability of Sn-3.0Ag-0.5Cu (SAC305) solder bump were systematically investigated. After as-bonded, $(Cu,Ni)_6Sn_5$ intermetallic compound (IMC) was formed at the interface of the ENIG surface finish at solder top side, while at the OSP surface finish at solder bottom side,$ Cu_6Sn_5$ and $Cu_3Sn$ IMCs were formed. Mean time to failure on SAC305 solder bump at $130^{\circ}C$ with a current density of $5.0{\times}10^3A/cm^2$ was 78.7 hrs. EM open failure was observed at bottom OSP surface finish by fast consumption of Cu atoms when electrons flow from bottom Cu substrate to solder. In-situ scanning electron microscope analysis showed that IMC growth rate of ENIG surface finish was much lower than that of the OSP surface finish. Therefore, EM reliability of ENIG surface finish was higher than that of OSP surface finish due to its superior barrier stability to IMC reaction.

• Asia-Pacific Journal of Business Venturing and Entrepreneurship
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• v.7 no.3
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• pp.17-25
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• 2012

Wire bonding process in making semiconductor needs the most precise control and Critical To Quality(CTQ). Thus, it is regarded to be the most essential step in packaging process. In this process, pure gold wire is used to connect the chip and PCB(substrate or lead frame). However, the price of gold has been skyrocketing continuously for a long period of time and is expected to further increase in the near future. This phenomenon situates us in an unfavorable condition amidst the competitive environment. To avoid this situation, many semiconductor material making companies developed new types of wires: Au.Ag wire is one material followed by many others. This study is aimed to optimize the parameter in wire bonding with the use of 6sigma and QFD(Quality Function Deployment). 6sigma process is a good means to not only solve the problem, but to increase productivity. In order to find the key factor, we focused on VOB(Voice of Business) and VOC(Voice of Customer). The main factors from VOB, VOC are called CTQ. However, there were times when these main factors were far from offering us the correct answer, thus making the situation more difficult to handle. This study shows that QFD aids in deciding which of the accurate factors to undertake. Normally QFD is used in designing and developing products. 6sigma process is held more effective when it used with QFD.

• Progress in Medical Physics
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• v.10 no.1
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• pp.41-46
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• 1999

There is necessity for making a smaller and more sensitive detector in small field sizes. This report assesses the suitability of metal-loaded thermoluminescent dosimeters for this purpose. Measurements were performed in the 6 MV photon and 6 MeV electron beams of a medical linear accelerator with LiF thermoluminescence dosimeters (TLD-100) embedded in solid water phantom. TLD-100 chips(surface area 3.2 $\times$ 3.2 $\textrm{mm}^2$) loaded with a metal plate(Tin or gold respectively) were used to enhance dose readings to TLD-100. Surface dose was measured for field size 10 $\times$ 10 $\textrm{cm}^2$ and 100 em SSD. Measurements have been made of the enhanced signal intensity and good linearity for absorbed dose with each metal. Using a 1 mm each metal on TLD-l00 in the beam increased the surface dose to 14% and 56% respectively for 6MV photon. In the case of 6 MeV electron, gold plate enhanced the TL response to 13%, but there is no difference for tin plate. The specific dose response of TLD-100 with thin metal plate increases with electron concentration of metal film, this is most likely due to increased electron scattered from the additional material with electron density higher than TLD-100. This emphasizes the role of TL dosimeters with metal as amplified dosimeters for therapeutic high energy x-ray beams. Due to the enhanced dose reading of TLD-100 with metal plate, it could be possible to develop smaller TL dosimeter with high sensitivity.

• Journal of electromagnetic engineering and science
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• v.6 no.2
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• pp.135-145
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• 2006

This paper presents the theory, design, fabrication and characterization of the novel low actuation voltage capacitive shunt RF-MEMS switch using a corrugated membrane with HRS MEMS packaging. Analytical analyses and experimental results have been carried out to derive algebraic expressions for the mechanical actuation mechanics of corrugated membrane for a low residual stress. It is shown that the residual stress of both types of corrugated and flat membranes can be modeled with the help of a mechanics theory. The residual stress in corrugated membranes is calculated using a geometrical model and is confirmed by finite element method(FEM) analysis and experimental results. The corrugated electrostatic actuated bridge is suspended over a concave structure of CPW, with sputtered nickel(Ni) as the structural material for the bridge and gold for CPW line, fabricated on high-resistivity silicon(HRS) substrate. The corrugated switch on concave structure requires lower actuation voltage than the flat switch on planar structure in various thickness bridges. The residual stress is very low by corrugating both ends of the bridge on concave structure. The residual stress of the bridge material and structure is critical to lower the actuation voltage. The Self-alignment HRS MEMS package of the RF-MEMS switch with a $15{\Omega}{\cdot}cm$ lightly-doped Si chip carrier also shows no parasitic leakage resonances and is verified as an effective packaging solution for the low cost and high performance coplanar MMICs.

• Journal of fish pathology
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• v.20 no.3
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• pp.307-313
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• 2007

In this study, a QCM biosensor was made to detect Edwardsiella tarda (E. tarda) using a specific antibody. A 9 MHz AT-cut piezoelectric wafer layered with two gold electrodes of 5mm diameter had a reproducibility of 0.1 Hz in frequency response and was used as the transducer of the QCM biosensor. Self assembled layer (SAM) was conformed on a quartz crystal by treating with 3-mer-captopropionic acid (MPA) and activated with N-ethyl-N'-(3-dimethyl-aminopropyl) carbodiimide (EDC) and N-hydroxysuccinimide (NHS). The resulting NHS group was further converted to hydrazide by the reaction with hydrazine. Aldehyde group was introduced into the carbohydrate moiety of anti-E. tarda antibody by the reaction with periodic acid and was used to immobilise the antibody through the reaction with hydrazide group on the electrode surface. A baseline was established in the presence of phosphate-buffered saline (PBS) and a resonant frequency (F1) was measured. Sample was added to the sensor surface and second resonant frequency (F2) was measured after unbound substances were washed out with PBS several times. Finally, the frequency shift (ΔF) representing the mass change was calculated by subtracting F2 from F1. After adding the oxidized anti-E. tarda antibody to the electrode surface containing hydrazide group, frequency shift of 288.811.4 Hz (mean S.E) was observed, thus proving that considerable amount of antibody was immobilized. In the immunoassay test, the frequency shift of 1877.75 Hz, 580.67 Hz, 221.39 Hz, 7.671.83 Hz (mean S.E) were observed at doses of 1000, 500, 100, 50 g of bacterial cells, respectively. It was also demonstrated that the prepared sensor chip was stable enough to withstand repeated surface regeneration with 0.2 M Tris-glycine and 1 % DMSO, pH 2.3 more than ten times.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.15 no.10
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• pp.889-895
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• 2002

Wafer level packaging is gain mote momentum as a low cost, high performance solution for RF-MEMS devices. In this work, the flip-chip method was used for the wafer level packaging of RF-MEMS devices on the quartz substrate with low losses. For analyzing the EM (electromagnetic) characteristic of proposed packaging structure, we got the 3D structure simulation using FEM (finite element method). The electric field distribution of CPW and hole feed-through at 3 GHz were concentrated on the hole and the CPW. The reflection loss of the package was totally below 23 dB and the insertion loss that presents the signal transmission characteristic is above 0.06 dB. The 4-inch Pyrex glass was used as a package substrate and it was punched with air-blast with 250${\mu}{\textrm}{m}$ diameter holes. We made the vortical feed-throughs to reduce the electric path length and parasitic parameters. The vias were filled with plating gold. The package substrate was bonded with the silicon substrate with the B-stage epoxy. The loss of the overall package structure was tested with a network analyzer and was within 0.05 dB. This structure can be used for wafer level packaging of not only the RF-MEMS devices but also the MEMS devices.