• Resources Recycling
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• v.25 no.1
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• pp.3-9
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• 2016

The leaching behavior of gold from waste CPU chip using Iodide/Iodine solution was studied. The direct leaching of gold with Iodide/Iodine solution for CPU chip under the size of 150 mesh showed leaching ratio of 20%. It was assumed that the copper film was produced on the gold particle during grinding process and the copper film prevents lodine/Iodide solution from contacting with leachable gold. Meanwhile, the extraction of gold was improved to 90% by pretreatment process with $HNO_3$ solution. In order to explain the result, EDS and ICP analysis for the leaching residue were conducted. It was found that the copper coated on the surface of the gold particle was removed about 80% by $HNO_3$, resulting in the increment of gold leaching rate.

• Journal of Sensor Science and Technology
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• v.24 no.6
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• pp.423-428
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• 2015

A bimetallic chip made of gold and silver was investigated in intensity interrogation mode to confirm enhancement of the SPR sensor resolution. Both reflectance curves of the bimetallic chip and the conventional gold chip was acquired and compared. The line width of the reflectance curve of the bimetallic chip was narrower than that of the conventional Au chip, resulting in steeper tangential slope. The reflectance was monitored at the angle related to the steepest tangential slope. The change in reflectance of the bimetallic chip was larger than that of the Au chip. The critical angle was analyzed by differentiating the reflectance with respect to incident angle twice. Acquiring the critical angle regarding to the sample informs the refractive index of the sample. Using various concentration of Bovine Serum Albumin, we confirmed that refractive index was linearly related to variation of reflectance of the bimetallic chip.

• Journal of the Microelectronics and Packaging Society
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• v.20 no.4
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• pp.47-52
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• 2013

Gold wire has long been used as a proven method of connecting a silicon die to a substrate in wide variety of package types, delivering high yield and productivity. However, with the high price of gold, the semiconductor packaging industry has been implementing an alternate wire material. These materials may include silver (Ag) or copper (Cu) alloys as an alternative to save material cost and maintain electrical performance. This paper will analyze and compare the electrical characteristics of several wire types. For the study, typical 0.6 mil, 0.8 mil and 1.0 mil diameter wires were selected from various alloy types (2N gold, Palladium (Pd) coated/doped copper, 88% and 96% silver) as well as respective pure metallic wires for comparison. Each wire model was validated by comparing it to electromagnetic simulation results and measurement data. Measurements from the implemented test boards were done using a vector network analyzer (VNA) and probe station setup. The test board layout consisted of three parts: 1. Analysis of the diameter, length and material characteristic of each wire; 2. Comparison between a microstrip line and the wire to microstrip line transition; and 3. Analysis of the wire's cross-talk. These areas will be discussed in detail along with all the extracted results from each type the wire.

• The Transactions of the Korean Institute of Electrical Engineers C
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• v.53 no.5
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• pp.286-292
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• 2004

In this study, an integrated microelectrode array was fabricated on glass slide using microfabrication technology. Probe DNAs consisting of mercaptohexyl moiety at their 5-end were spotted on the gold electrode using micropipette or DNA arrayer utilizing the affinity between gold and sulfur. Cyclic voltammetry in 5mM ferricyanide/ferrocyanide solution at 100 ㎷/s confirmed the immobilization of probe DNA on the gold electrodes. When several DNAs were detected electrochemically, there was a difference between target DNA and control DNA in the anodic peak current values. It was derived from specific binding of Hoechst 33258 to the double stranded DNA due to hybridization of target DNA. It suggested that this DNA chip could recognize the sequence specific genes. It suggested that multichannel electrochemical DNA microarray is useful to develop a portable device for clinical gene diagnostic System.

• Journal of Sensor Science and Technology
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• v.25 no.2
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• pp.143-147
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• 2016

Characteristics of the conventional gold (Au) surface plasmon resonance (SPR) chip, bi-metallic(Au/silver (Ag)) SPR chip, and tri-metallic(Au/Ag/Au) SPR chip were investigated and compared in the intensity measurement mode for the enhancement of SPR image sensor reactivity. Reflectance curves of the Au, bi- and tri-metallic SPR chips were acquired in phosphate-buffered saline (PBS) solution and were compared. The line width of the reflectance curve of the bi-metallic chip was the narrowest among the three different types of the chips. Also, the tangential slope of the bi-metallic chip was steeper than those of the other chips. Various concentrations of bovine serum albumin (BSA) were utilized in the SPR experiment. As a result, among the above three chips reflectance variation value of the bi-metallic chip was the largest.

• Tuberculosis and Respiratory Diseases
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• v.60 no.4
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• pp.412-418
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• 2006

Background; The diagnosis of chlamydial infection is based on serology. The current gold standard of diagnosis is MIF(microimmunofluorescence), but this modality is subjective and time-consuming. Protein microarray with using a SPR(surface plasmon resonance) sensor has recently been suggested as a method for detecting infection. For developing a protein chip to diagnose chlamydial infection, EBs(elementary bodies) were immobilized on a gold chip and the interaction between an antibody for Chlamydophila pneumoniae and the EBs(elementary bodies) immobilized on the surface of the gold chip was measured by using an SPR sensor. Methods; For the surface antigen, the EBs of Chlamydophila pneumoniae LKK1 were purified. Charged arrays were prepared by using PDDA(polydiallyldimethylammonium chloride) which has a positive charge. After immobilization of the chlamydial EBs on the PDDA surface, the investigation of the surface was done with using atomic force microscopy. After the antibody for C. pneumoniae was applied on chip, we monitored the SPR wavelength-shift to detect any antigen-antibody interaction with using a self-assembled SPR sensor. Results; The chlamydial EBs on the positively charged PDDA were visible on the surface with using atomic force microscopy. The SPR wavelength increased after interaction of antibody for C. pneumoniae with the EBs immobilized on charged gold surface. The wavelength-shift was correlated with the concentration of antigens. Conclusion; The surface immobilization of EBs on the gold surface with the charged arrays was identified and the antigen-antibody interaction on the gold chip was detected via the SPR sensor. Further investigations are needed to apply this technique to the clinical field.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2002.05a
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• pp.247-251
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• 2002

In this paper the maximum current carrying capability of ACAs flip chip joint is investigated based on two failure mechanisms: (1) degradation of the interface between gold stud bumps and aluminum pads; and (2) ACA swelling between chips and substrates under high current stress. For the determination of the maximum allowable current, bias stressing was applied to ACAs flip chip joint. The current level at which current carrying capability is saturated is defined as the maximum allowable current. The degradation mechanism under high current stress was studied by in-situ monitoring of gold stud bump-aluminum pad ACA contact resistance and also ACA junction temperature at various current level. The cumulative failure distributions were used to predict the lifetime of ACAs flip chip joint under high current stressing. These experimental results can be used to better understand and to improve the current carrying capability of ACA flip chip joint.

• Bulletin of the Korean Chemical Society
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• v.34 no.9
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• pp.2725-2730
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• 2013

Single C-reactive protein (CRP) molecules, which are non-specific acute phase markers and products of the innate immune system, were quantitatively detected on a gold-nanopatterned biochip using evanescent field-enhanced fluorescence imaging. The $4{\times}5$ gold-nanopatterned biochip (spot diameter of 500 nm) was fabricated by electron beam nanolithography. Unlabeled CRP molecules in human serum were identified with single-molecule sandwich immunoassay by detecting secondary fluorescence generated by total internal reflection fluorescence (TIRF) microscopy. With decreased standard CRP concentrations, relative fluorescence intensities reduced in the range of 33.3 zM-800 pM. To enhance fluorescence intensities in TIRF images, the distance between biochip surface and CRP molecules was optimally adjusted by considering the quenching effect of gold and the evanescent field intensity. As a result, TIRF only detected one single-CRP molecule on the biochip the first time.

• Biotechnology and Bioprocess Engineering:BBE
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• v.9 no.2
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• pp.143-146
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• 2004

A surface plasmon resonance (SPR) imaging system was constructed and used to detect the hexahistidine-ubiquitin-tagged human parathyroid hormone fragment (His$\sub$6/-Ub-hPTHF(1-34)) expressed in Escherichia coli. The hexahistidine-specific antibody was immobilized on a thin gold film coated with ProLinker$\^$TM/ B, a novel calixcrown derivative with a bifunctional coupling property that permits efficient immobilizaton of capture proteins on solid matrices. The soluble and insoluble fractions of an E. coli cell lysate were spotted onto the antibody-coated gold chip, which was then washed with buffer (pH 7.4) solution and dried. SPR imaging measurements were carried out to detect the expressed His$\sub$6/-Ub-hPTHF(1-34). There was no discernible protein image in the uninduced cell lysate, indicating that non-specific binding of contaminant proteins did not occur on the gold chip surface. It is expected that the approach used here to detect affinity-tagged recombinant proteins using an SPR imaging technique could be used as a powerful tool for the analyses of a number of proteins in a high-throughput mode.

• Journal of the Korean institute of surface engineering
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• v.50 no.3
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• pp.170-176
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• 2017

EPIG (Electroless Pd/immersion Au) process was studied to replace ENIG (electroless Ni/immersion Au) and ENEPIG (electroless Ni/electroless Pd/immersion Au) processes for bump surface treatment used in high reliable flip chip packages. The palladium and gold layers formed by EPIG process were uniform with thickness of 125 nm and 34.5 nm, respectively. EPAG (Electroless Pd/autocatalytic Au) also produced even layers of palladium and gold with the thickness of 115 nm and 100 nm. TEM results exhibited that the gold layer in EPIG surface had crystalline structure while the palladium layer was amorphous one. After annealing at 250 nm, XPS analysis indicated that the palladium layer with thickness more than 22~33 nm could act as a diffusion barrier of copper interconnects. As a result of comparing the chip shear strength obtained from ENIG and EPIG surfaces, it was confirmed that the bonding strength was similar each other as 12.337 kg and 12.330 kg, respectively.