Leaching Behavior of Gold from CPU chip Grinding Products in Iodide/Iodine Solution |
Jung, Insang
(Department of Earth Resources and Environmental Engineering, Hanyang University)
Joe, Aram (Department of Earth Resources and Environmental Engineering, Hanyang University) Choi, Joonchul (Department of Earth Resources and Environmental Engineering, Hanyang University) Song, Youjin (Global Resources & Materials Co., Ltd.) Park, Poongwon (Global Resources & Materials Co., Ltd.) Park, Kyungho (Mineral Resource Research Division, Korea Institute of Geoscience and Mineral Resources) Lee, Sujeong (Mineral Resource Research Division, Korea Institute of Geoscience and Mineral Resources) Park, Jaikoo (Department of Earth Resources and Environmental Engineering, Hanyang University) |
1 | Behnamfard, A., M.M. Salarirad, F. Veglio, 2013: Process development for recovery of copper and precious metals from waste printed circuit boards with emphasize on palladium and gold leaching and precipitation, Waste management, 33(11), pp. 2354-2363. DOI |
2 | Wen, X., et al., 2005: Study on metals recovery from discarded printed circuit boards by physical methods, IEEE, |
3 | Kim, Y.-S., 2010: Recovery of Waste Back Board and Gold from the Process of Printed Circuit Board, Journal of the Korean Institute of Resources Recycling, 19(1), pp. 57-65. |
4 | Crundwell, F., 2013: The dissolution and leaching of minerals: Mechanisms, myths and misunderstandings, Hydrometallurgy, 139(132-148). DOI |
5 | Rodriguez, F., et al., 2009: Adsorption of a gold-iodide complex (AuI2-) onto cellulose acetate-polyaniline membranes: Equilibrium experiments, Journal of applied polymer science, 113(4), pp. 2670-2674. DOI |
6 | Zhang, H., C.A. Jeffery, M.I. Jeffrey, 2012: Ion exchange recovery of gold from iodine-iodide solutions, Hydrometallurgy, 125(69-75). |
7 | Kumar, V., et al., 2013: Novel physical separation process for eco-friendly recycling of rare and valuable metals from end-of-life DVD-PCBA, Separation and Purification Technology, 111(145-154). DOI |
8 | Choi, J., W. Lee, 1995: Dissolution kinetics of palladium in iodide solutions, Journal of the Korean Institute of Metals and Materials(South Korea), 33(10), pp. 1368-1373. |
9 | Park, H., K. Han, 1996: Dissolution behavior of nickel in Iodine/Iodide solutions, Journal of the Korean Institute of Metals and Materials(South Korea), 34(5), pp. 615-621. |
10 | Huang, K., J. Guo, Z. Xu, 2009: Recycling of waste printed circuit boards: A review of current technologies and treatment status in China, Journal of hazardous materials, 164(2), pp. 399-408. DOI |
11 | Jha, M.K., et al., 2012: Leaching studies for tin recovery from waste e-scrap, Waste management, 32(10), pp. 1919-1925. DOI |
12 | Duan, C., et al., 2009: Recovery of metals from waste printed circuit boards by a mechanical method using a water medium, Journal of Hazardous Materials, 166(1), pp. 478-482. DOI |