• Electronic Materials Letters
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• v.14 no.6
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• pp.749-754
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• 2018

Previous studies have reported on the mechanical robustness and chemical stability of flexible amorphous indium gallium zinc oxide (a-IGZO) thin-film transistors (TFTs) on plastic substrates both in flat and curved states. In this study, we investigate how the polyimide (PI) substrate affects hydrogen concentration in the a-IGZO layer, which subsequently influences the device performance and stability under bias-temperature-stress. Hydrogen increases the carrier concentration in the active layer, but it also electrically deactivates intrinsic defects depending on its concentration. The influence of hydrogen varies between the TFTs fabricated on a glass substrate to those on a PI substrate. Hydrogen concentration is 5% lower in devices on a PI substrate after annealing, which increases the hysteresis characteristics from 0.22 to 0.55 V and also the threshold voltage shift under positive bias temperature stress by 2 ${\times}$ compared to the devices on a glass substrate. Hence, the analysis and control of hydrogen flux is crucial to maintaining good device performance and stability of a-IGZO TFTs.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 1999.10a
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• pp.57-58
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• 1999

• Proceedings of the Materials Research Society of Korea Conference
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• 1998.08a
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• pp.138.4-138
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• 1998

• 한국정보디스플레이학회:학술대회논문집
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• 2007.08a
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• pp.133-136
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• 2007

IGZO TFTs were fabricated by conventional photolithography and wet-etching processes on metal substrates for the flexible display. The characteristics of TFTs on metal substrates were comparable to those of TFTs on glass substrates. Moreover, AM-OLED panels based on IGZO TFT arrays on metal substrates were successfully driven, for the first time.

• Bulletin of the Korean Chemical Society
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• v.34 no.2
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• pp.524-530
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• 2013

In this study, we describe the most expected behavior of cells on the modified surface and the correlation between the modified substrates and the response of cells. The physicochemical characteristics of substrates played an essential role in the adhesion and proliferation of cells. Glass and polymer substrates were modified using air plasma oxidation, and the surfaces were coated with self-assembled monolayer molecules of silanes. The PDMS substrates embedded with parallel micropatterns were used for evaluation of the effect of topologically modified substrate on cellular behaviour. BALB/3T3 fibroblast cells were cultured on different surfaces with distinct wettability and topology, and the growth rates and morphological change of cells were analyzed. Finally, we found the optimum conditions for the adhesion and proliferation of cells on the modified surface. This study will provide insight into the cell-surface interaction and contribute to tissue engineering applications.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2010.06a
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• pp.343-343
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• 2010

In this paper, Schottky barrier thin-film-transistors (SB-TFTs) with platinum silicide at source/drain region based on glass substrate were fabricated. Poly-silicon on glass substrates was crystallized by excimer laser annealing (ELA) method. The formation of pt-silicide at source/drain region is the most important process for SB-TFTs fabrication. We study the optimal condition of Pt-silicidation on glass substrate. Also, we propose this device as promising structure in the future.

• Laser Solutions
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• v.11 no.3
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• pp.1-4
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• 2008

A selective laser micro bonding process using liquid glass (methylsilsesquioxane) was developed and the results are analysed. The liquid glass can be solidified with Nd:YAG laser irradiation and it can be applied for joining two glass substrates. A bonding thickness of a few micrometers can be achieved. The appropriate laser power density (or this process is around 40-60 $kW/cm^2$ and its bonding force is 1000-1200 $gf/mm^2$. This process can be applied for bonding micro devices such as micro bio-sensors or display products. Its advantages and limitations are presented and discussed.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2001.11b
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• pp.390-393
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• 2001

This study demonstrated the feasibility of tape casting method to fabricate soda borosilicate glass-coated stainless steel electrostatic chucks(ESC) for low temperature semiconductor processes. The glass coatings on the stainless steel substrates ranged from $100{\mu}m$ to $150{\mu}m$ thick. The adhesion of the glass coatings was found to be excellent such that it was able to withstand moderate impact tests and temperature cycling to over $300^{\circ}C$ without cracking and delamination. The electrostatic clamping pressure generally followed the theoretical voltage-squared curve except at elevated temperatures and higher applied voltages when deviations were observed to occur. The deviation is due to increased leakage current at higher temperature and applied voltage as the electrical resistivity drops.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2001.11a
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• pp.390-393
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• 2001

This study demonstrated the feasibility of tape casting method to fabricate soda borosilicate glass-coated stainless steel electrostatic chucks(ESC) for low temperature semiconductor processes. The glass coatings on the stainless steel substrates ranged from 100 $\mu\textrm{m}$ to 150 $\mu\textrm{m}$ thick. The adhesion of the glass coatings was found to be excellent such that it was able to withstand moderate impact tests and temperature cycling to over 300$^{\circ}C$ without cracking and delamination. The electrostatic clamping pressure generally followed the theoretical voltage-squared curve except at elevated temperatures and higher applied voltages when deviations were observed to occur. The deviation is due to increased leakage current at higher temperature and applied voltage as the electrical resistivity drops.

• 한국정보디스플레이학회:학술대회논문집
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• 2004.08a
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• pp.289-292
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• 2004

We have successfully fabricated $Binem^{(R)}$ displays on thin flexible plastic substrates. The fabrication is based on the standard $Binem^{(R)}$ process for glass which has been adapted to plastic with new materials and technologies. The first application is targeted to an embedded display for smart card products.