• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2006년도 6th International Meeting on Information Display
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• pp.45-48
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• 2006

Effectiveness and its possibility of ELA (Excimer Laser Annealing) for advanced Si TFT system on insulator are described. Currently, extensive study is carried out to realize an advanced SoG (System on Glass) based on LTPS (Low Temperature Poly-Si) technique. By reducing further the process temperature and by improving the fabrication process of LTPS, addressing TFT circuits for FPD (Flat Panel Display) can be mounted onto a flexible plastic as well as onto a glass substrate. Functional devices on the insulating panels are developed to be formed by using ELA. Although technical issues are remained for the fabrication process, Si transistors including 3D TFT structure formed by ELA is expected as a functional Si system on insulator in the ubiquitous IT era.

• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2003년도 International Meeting on Information Display
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• pp.391-394
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• 2003

It is inevitable that reconsideration of the use of lead oxides in the electronics industry be undertaken as long as detrimental effects to the environment remain. To solve this problem, many recent studies on Pb-free compositions for PDP (plasma display panel) dielectric layers and also sealing glass compositions have been made. The present study was conducted to investigate whether the alternative systems for leadfree low firing glasses, detailed below, are available for use in PDP materials. The results suggest that low-melting phosphate glasses would be suitable as an alternative material for the Pb-based dielectric layer, sealants and barrier ribs in PDP.

• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2003년도 International Meeting on Information Display
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• pp.1005-1008
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• 2003

We report a new FCOG (flip chip on glass) technique using solder bumps for display packaging applications. The In and Sn solder bumps of 40 ${\mu}m$ pitches were formed on Si and glass substrate. The In and Sn bumps were bonded at 125 at the pressure of 3 mN/bump. The metallurgical bonding was confirmed using cross-sectional SEM. The contact resistance of the solder joint was 65 $m{\Omega}$ which was much lower than that of the joint made using the conventional ACF bonding technique. We demonstrate that the new COG technique using solder bump to bump direct bonding can be applied to advanced LCDs that lead to require higher quality, better resolution, and lower power consumption.

• 한국정밀공학회지
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• 제24권10호
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• pp.99-108
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• 2007

As the structure of a mobile phone becomes thin to catch up with a slim product trend, the reliability of a LCD module is on the rise as a big issue for a product design. A drop test is the most basic and important verification method for a mechanical quality control but it requires much time and cost during a product development process. Thus many manufacturers have considered design guide lines using CAE and simulation for more effective usage of limited resources on the market. In this paper, the Maximum Principle Stress of a LCD glass panel is calculated on the basis of explicit FE Analyses method and input conditions are determined according to the general test standard. The design guideline for reliability improvements are suggested on the basis of the results of FE Analysis.

• 제어로봇시스템학회:학술대회논문집
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• 제어로봇시스템학회 2000년도 제15차 학술회의논문집
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• pp.214-214
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• 2000

This paper deals with the non contact optical sensor to measure the shape of transparent plates such as glass panel of LCD(Liquid Crystal Display). The conventional methods to obtain the shape or thickness of a transparent plates are contact type sensor such as LVOT(Linear Variable Differential Transformer). Due to the contact between the tip of the sensor and the surface of objects, the tip is abraded. In addition, the high temperature glass casting makes the size of sensor body changed. These reasons makes the sensor degraded. In this paper, to overcome these problem, we proposed a low cost noncontact optical sensor this is composed of the Hologram laser unit of a CD-Pickup and a plastic lens. To evaluate the performance of the proposed optical sensor, a series of experiments were performed for various measurement condition. Based upon observation of the experimental result, the developed sensor shows good result for measuring the shape of transparent plates.

• 한국전기전자재료학회논문지
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• 제15권12호
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• pp.1065-1069
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• 2002

The addressing time should be reduced by modifying cell structure and/or driving method in order to replace the dual scan system by single scan and increase the luminance in large ac plasma display panel(PDP). In this paper, the effects of the addressing time was decreased with decreasing thickness of dielectric layer on the front glass and thickness of white dielectric layer on the rear glass. the decreasing rate were 160ns/10$\mu\textrm{m}$ and 270ns/10$\mu\textrm{m}$, respectively Also in case of decreasing the height of barrier rib, addressing time was decreased at the rate of Sons/10$\mu\textrm{m}$.

• 한국건축시공학회:학술대회논문집
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• 한국건축시공학회 2019년도 춘계 학술논문 발표대회
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• pp.70-71
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• 2019

Glass fiber reinforced concrete (GFRC) is very suitable as a material for free-form concrete panels (FCPs) because of its lightweight, strong, moldable, durable and sustainable properties. GFRC is superior in construction and maintenance compared with materials such as steel, aluminium, titanium, glass and plastic, and is advantageous in cost. However, GFRC is being produced by skilled craftsmen, and still lacks the technology to economically produce high quality FCPs. Currently, there is a technology to automatically and accurately produce FCPs. However, the developed technology can not be applied to the field with simple production technology without production line for mass production. To solve this problem, the purpose of this study is a basic study of production system development of free-form concrete panels. This study introduces the developed FCPs production technology and builds FCP production system for mass production. The results of this study will be used as basic data for the commercial production of FCPs in the future.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2003년도 춘계학술대회 논문집 센서 박막재료 반도체 세라믹
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• pp.295-298
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• 2003

The principal problems in development of dielectric paste materials for PDP(plasma display panel)are PbO free paste and low melting temperature. We prepared PbO free paste from glasses in the system BaO-ZnO-$B_2O_3-V_2O_5$. DTA, XRD and SEM were used to study and characterize BaO-ZnO-$B_2O_3-V_2O_5$ glasses. PbO free paste developed at this paper has thermal expansion of $74{\times}10^{-7}/^{\circ}C$, DTA transformation point of $460^{\circ}C$, and firing condition of $560^{\circ}C$, 10min.

• 전기학회논문지
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• 제64권11호
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• pp.1587-1591
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• 2015

For a higher definition discharge cell, the method of high speed addressing is necessary. In order to modify the surface charges, the liquefied $TiO_2$ or MgO powder is added on MgO layer in front glass and on the phosphor in rear glass in micro barrier discharge. Both the electro-optical properties and the discharge time lag characteristics are measured from 4 inch. test panel, such as the discharge voltage, current, luminance, luminous efficacy and discharge time lag. As the results, the statistic time lag is improved by about 40 %.

• 전자공학회논문지
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• 제51권1호
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• pp.179-184
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• 2014

교류형 플라즈마 디스플레이에서의 Vt 폐곡선 측정에 기초하여 개방형 유전체 구조에서 방전 전압과 내부 벽전압 등의 방전 특성이 종래의 구조와 비교되어 조사되었다. 일반적인 교류형 플라즈마 디스플레이의 구조에서 상판은 유리, 전극, 유전체 등으로 이루어져 있는데, 개방형 유전체 구조는 상판 전극사이에 있는 유전체를 제거하여 상판에 있는 유지 전극간의 방전이 더욱 쉽게 발생하도록 하는 구조이다. 개방형 유전체 구조는 종래의 구조와 다르기 때문에 종래의 구동파형으로 구동시에 여러 가지 문제가 발생한다. 특히 상판의 두 전극인 주사와 유지전극 간 방전 개시전압이 달라지기 때문에 종래의 기입 파형을 포함한 초기화 파형도 수정되어야 한다. 본 연구에서는 종래와 개방형 유전체 구조에서 3 전극의 방전개시전압을 비교하기 위하여 Vt 폐곡선을 측정하였고 분석에 기초하여 개방형 유전체 구조에 적합하도록 구동파형이 수정되었다.