• 대한전자공학회논문지SD
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• 제48권10호
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• pp.62-66
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• 2011

본 연구에서는 측정된 S-파라미터를 사용하여 드레인-소스 전압 Vds에 무관한 게이트-소스 overlap 캐패시턴스를 추출하고, 이를 바탕으로 deep-submicron MOSFET의 Vds 종속 게이트-벌크 캐패시턴스 곡선을 추출하는 RF 방법이 새롭게 개발 되었다. 추출된 캐패시턴스 값들을 사용한 등가회로 모델과 측정된 데이터가 잘 일치하는 것을 관찰함으로써 추출방법의 정확도가 검증되었다. 추출된 데이터로부터 overlap과 depletion 길이의 Vds 종속 곡선이 얻어졌으며, 이를 통해 drain 영역의 채널 도핑 분포를 실험적으로 측정하였다.

• Advances in nano research
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• 제3권1호
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• pp.49-54
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• 2015

The structure represents symmetrical metal electrode (gate 1) - front $SiO_2$ layer - n-Si nanowire FET - buried $SiO_2$ layer - metal electrode (gate 2). At the symmetrical gate voltages high conductive regions near the gate 1 - front $SiO_2$ and gate 2 - buried $SiO_2$ interfaces correspondingly, and low conductive region in the central region of the NW are formed. Possibilities of applications of nanosize FETs at the deep inversion and depletion as a distributed capacitance are demonstrated. Capacity density is an order to ${\sim}{\mu}F/cm^2$. The charge density, it distribution and capacity value in the nanowire can be controlled by a small changes in the gate voltages. at the non-symmetrical gate voltages high conductive regions will move to corresponding interfaces and low conductive region will modulate non-symmetrically. In this case source-drain current of the FET will redistributed and change current way. This gives opportunity to investigate surface and bulk transport processes in the nanosize inversion channel.

• 전자공학회논문지
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• 제50권9호
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• pp.55-59
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• 2013

Sub-$0.1{\mu}m$로 스케일이 감소함에 따라 기생 저항 효과가 크게 발생되는 dc Ids 측정 데이터 없이 측정 S-파라미터로부터 얻어진 RF Ids를 사용하여 벌크 MOSFET의 포화영역에서 게이트 전압 종속 유효 캐리어 속도를 추출하는 새로운 방법이 개발되었다. 이 방법은 바이어스 종속 기생 게이트-소스 캐패시턴스와 유효 채널 길이의 복잡한 추출 없이 포화영역의 유효 캐리어 속도를 추출할 수 있게 한다. 이러한 RF 기술을 사용하여 벌크 포화 속도를 초과하는 전자 속도 overshoot 현상이 $0.065{\mu}m$ 게이트 길이의 벌크 N-MOSFET에서 관찰되었다.

• 대한전자공학회논문지SD
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• 제45권9호
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• pp.21-25
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• 2008

본 연구에서는 MOSFET의 RF 성능을 극대화하기 위해 단위 게이트 finger 폭($W_u$)에 대한 $f_T$ 및 $f_{max}$의 종속데이터를 측정하고 이 결과를 소신호 모델 파라미터들을 추출함으로써 새롭게 분석하였다. 이러한 물리적 분석결과로 $f_T$의 최대값이 존재하는 원인은 좁은 $W_u$에서 $W_u$에 무관한 parasitic gate-bulk capacitance와 넓은 $W_u$에서 트랜스컨덕턴스의 증가율이 감소하는 wide width effect에 의한 것임을 알 수 있다. 또한, $f_{max}$의 최대값은 게이트저항이 좁은 $W_u$에서 크게 줄어들고 넓은 $W_u$에서 점점 일정하게 되는 non-quasi-static effect에 의해 발생된다는 사실이 밝혀졌다.

• 전자공학회논문지A
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• 제31A권4호
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• pp.77-83
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• 1994

In this paper we numerically approximated the field-effect mobility of a-Si:H TFT. Field-effect mobility, based on the charge-trapping model and new effective capacitance model in our study, used Chebyshev approximation was approximated as the function of gate potential(gate-to-channel voltage). Even though various external factors are changed, this formula can be applied by choosing the characteristic coefficients without any change of the approximation formula corresponding to each operation region. Using new approximated field-effect mobility formula, the dependences of field-effect mobility on materials and thickness of gate insulator, thickness of a-Si bulk, and operation temperature in inverted staggered-electrode a-Si:H TFT were estimated. By this was the usefulness of new approximated mobility formula proved.

• 한국표면공학회지
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• 제33권4호
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• pp.217-221
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• 2000

The gate oxide thickness is becoming thinner and thinner in order to speed up the semiconductor CMOS devices. We have investigated very thin$ SiO_2$ gate oxide layers and found anomaly between the thickness determined with capacitance measurement and these obtained with cross-sectional high resolution transmission electron microscopy. The thicknesses difference of the two becomes important for the thickness of the oxide below 5nm. We propose that the variation of dielectric constant in thin oxide films cause the anomaly. We modeled the behavior as (equation omitted) and determined $\varepsilon_{bulk}$=3.9 and $\varepsilon_{int}$=-4.0. We predict that optimum $SiO_2$ gate oxide thickness may be $20\AA$ due to negative contribution of the interface dielectric constant. These new results have very important implication for designing the CMOS devices.s.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2009년도 하계학술대회 논문집
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• pp.131-131
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• 2009

Silicon Carbide (SiC) is a material with a wide bandgap (3.26eV), a high critical electric field (~2.3MV/cm), a and a high bulk electron mobility ($\sim900cm^2/Vs$). These electronic properties allow high breakdown voltage, high-speed switching capability, and high temperature operation compared to Si devices. Although various SiC DMOSFET structures have been reported so far for optimizing performances, the effect of channel dimension on the switching performance of SiC DMOSFETs has not been extensively examined. This paper studies different channel dimensons ($L_{CH}$ : $0.5{\mu}m$, $1\;{\mu}m$, $1.5\;{\mu}m$) and their effect on the the device transient characteristics. The key design parameters for SiC DMOSFETs have been optimized and a physics-based two-dimensional (2-D) mixed device and circuit simulator by Silvaco Inc. has been used to understand the relationship. with the switching characteristics. To investigate transient characteristic of the device, mixed-mode simulation has been performed, where the solution of the basic transport equations for the 2-D device structures is directly embedded into the solution procedure for the circuit equations. We observe an increase in the turn-on and turn-off time with increasing the channel length. The switching time in 4H-SiC DMOSFETs have been found to be seriously affected by the various intrinsic parasitic components, such as gate-source capacitance and channel resistance. The intrinsic parasitic components relate to the delay time required for the carrier transit from source to drain. Therefore, improvement of switching speed in 4H-SiC DMOSFETs is essential to reduce the gate-source capacitance and channel resistance.

• ETRI Journal
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• 제19권4호
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• pp.402-413
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• 1997

A CMOS device which has an extended heavily-doped amorphous silicon source/drain layer on the field oxide and an amorphous silicon local interconnection (ASLI) layer in the self-aligned source/drain region has been studied. The ASLI layer has some important roles of the local interconnections from the extended source/drain to the bulk source/drain and the path of the dopant diffusion sources to the bulk. The junction depth and the area of the source/drain can be controlled easily by the ASLI layer thickness. The device in this paper not only has very small area of source/drain junctions, but has very shallow junction depths than those of the conventional CMOS device. An operating speed, however, is enhanced significantly compared with the conventional ones, because the junction capacitance of the source/drain is reduced remarkably due to the very small area of source/drain junctions. For a 71-stage unloaded CMOS ring oscillator, 128 ps/gate has been obtained at power supply voltage of 3.3V. Utilizing this proposed structure, a buried channel PMOS device for the deep submicron regime, known to be difficult to implement, can be fabricated easily.

• 대한전자공학회:학술대회논문집
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• 대한전자공학회 2008년도 하계종합학술대회
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• pp.389-390
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• 2008

The dependence of $f_T$ and $f_{max}$ on the unit finger width is measured and analyzed for $0.13{\mu}m$ MOSFETs. The increase of $f_T$ at narrow width is attributed by the parasitic gate-bulk capacitance, and the decrease of $f_T$ at wide width is generated by the reduction of increasing rate of $g_{mo}$. The increase of $f_{max}$ at narrow width is originated from the abrupt reduction of gate resistance due to the non-quasi-static effect. These analysis results will be valuable information for layout optimization to improve $f_T$ and $f_{max}$.

• 대한전자공학회논문지
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• 제26권6호
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• pp.38-47
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• 1989

헴트(HEMT) 소자의 순수 해석적 DC모델이 2차원 전하제어 시뮬레이션 결과[4]에 기초하여 제작되었다. 이 모델에서는 2-DEG 채널의 전자 운송 역학에 확산 효과를 추가하였다. 이 확산효과는 기존 1차원 DC모델에서 사용하는 전자 이동도 및 문턱전압을 증가시키는 효과를 가졌음을 보였다. 또한 2-DEG 농도분포함수를 piecewise 선형화하여 HEMT 소자의 subthreshold 특성의 해석적 모델을 추가하였고, 따라서 2-DEG의 채널 두께 및 게이트 용량을 게이트 전압의 함수로 나타내었다. I-V curve의 전류포화영역에서의 기울기를 모델하는데는 gate 밑의 전자포화채널 지역에서의 전자채널두께와 채널길이 변조현상을 함께 고려하였다. Troffimenkoff형의 전장의존 전자이동도를 사용하여 I-V곡선의 포화현상을 모델하였다. 또한 기존 1차원 모델에서 감안되지 않은 2차원 효과가 실제 전류특성곡선에서 매우 중요한 역할을 하며, 이 효과가 효과적으로 1개의 보정상수f로 보상됨을 보였고, 물리적으로 이 상수가 채널 GCA 지역과 채널포화지역 사이에 형성되는 채널천이지역의 전자농도와 관계됨을 보였다.