• 제목/요약/키워드: gate bias

검색결과 443건 처리시간 0.024초

Oxide TFT Structure Affecting the Device Performance

  • KoPark, Sang-Hee;Cho, Doo-Hee;Hwang, Chi-Sun;Ryu, Min-Ki;Yang, Shin-Hyuk;Byun, Chun-Won;Yoon, Sung-Min;Cheong, Woo-Seok;Cho, Kyoung-Ik
    • 한국정보디스플레이학회:학술대회논문집
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    • 한국정보디스플레이학회 2009년도 9th International Meeting on Information Display
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    • pp.385-388
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    • 2009
  • We have investigated the effect of the device structure on the performance of polycrystalline ZnO TFT and amorphous AZTO TFT with top gate and bottom gate structure. While the mobility of both TFTs showed relatively similar value in a top and bottom gate structure, bias stability was quite different depending on the device structure. Top gate TFT showed much less Vth shift under positive bias stress compared to that of bottom gate TFT. We attributed this different behavior to the defects formation on the gate insulator induced by energetic bombardment during the active layer deposition in a bottom gate TFT. We suggest the top gate oxide TFT would show more stable behavior under the Vgs bias.

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다결정 실리콘 박막 트랜지스터의 수소화에 따른 전기적 스트레스의 영향 (Effects of Electrical Stress on Polysilicon TFTs with Hydrogen passivation)

  • 황성수;황한욱;김동진;김용상
    • 대한전기학회:학술대회논문집
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    • 대한전기학회 1998년도 하계학술대회 논문집 D
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    • pp.1315-1317
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    • 1998
  • We have investigated the effects of electrical stress on poly-Si TFTs with different hydrogen passivation conditions. The amounts of threshold voltage shift of hydrogen passivated poly-Si TFTs are much larger than those of as-fabricated devices both under the gate bias stressing and under the gate and drain bias stressing. Also, we have quantitatively analized the degradation phenomena using by analytical method. we have suggested that the electron trapping in the gate dielectric is the dominant degradation mechanism in only gate bias stressed poly-Si TFT while the creation of defects in the poly-Si is prevalent in gate and drain bias stressed device.

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드레인 바이어스 스위칭을 이용한 와이브로/무선랜 이중 모우드 전력증폭기 (Dual Mode Power Amplifier for WiBro and Wireless LAN Using Drain Bias Switching)

  • 이영민;구경헌
    • 대한전자공학회논문지TC
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    • 제44권3호
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    • pp.1-6
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    • 2007
  • 와이브로 및 무선랜 이중 대역 이중 모우드 송신기에서 전력부가효율을 증가시킬 수 있는 바이어스 스위칭 기술을 제시한다. 서로 다른 주파수 대역과 출력을 갖는 송신기에서 높은 효율을 얻을 수 있는 기법으로 바이어스 스위칭을 제안하고 드레인과 게이트 바이어스의 변화에 따른 영향을 각각 시뮬레이션 하였다. 바이어스 스위칭을 적용하지 않은 경우의 전력부가효율에 비해 시뮬레이션 된 최적의 고정 게이트 바이어스를 공급하고 드레인 바이어스 스위칭을 한 경우 매우 개선된 전력 효율 특성을 얻을 수 있었다 이러한 드레인 및 게이트 바이어스 스위칭 기술은 다양한 기능을 필요로 하는 다중 모우드 통신 시스템에 유용할 것이다.

Experimental Investigation of Physical Mechanism for Asymmetrical Degradation in Amorphous InGaZnO Thin-film Transistors under Simultaneous Gate and Drain Bias Stresses

  • Jeong, Chan-Yong;Kim, Hee-Joong;Lee, Jeong-Hwan;Kwon, Hyuck-In
    • JSTS:Journal of Semiconductor Technology and Science
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    • 제17권2호
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    • pp.239-244
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    • 2017
  • We experimentally investigate the physical mechanism for asymmetrical degradation in amorphous indium-gallium-zinc oxide (a-IGZO) thin-film transistors (TFTs) under simultaneous gate and drain bias stresses. The transfer curves exhibit an asymmetrical negative shift after the application of gate-to-source ($V_{GS}$) and drain-to-source ($V_{DS}$) bias stresses of ($V_{GS}=24V$, $V_{DS}=15.9V$) and ($V_{GS}=22V$, $V_{DS}=20V$), but the asymmetrical degradation is more significant after the bias stress ($V_{GS}$, $V_{DS}$) of (22 V, 20 V) nevertheless the vertical electric field at the source is higher under the bias stress ($V_{GS}$, $V_{DS}$) of (24 V, 15.9 V) than (22 V, 20 V). By using the modified external load resistance method, we extract the source contact resistance ($R_S$) and the voltage drop at $R_S$ ($V_{S,\;drop}$) in the fabricated a-IGZO TFT under both bias stresses. A significantly higher RS and $V_{S,\;drop}$ are extracted under the bias stress ($V_{GS}$, $V_{DS}$) of (22 V, 20V) than (24 V, 15.9 V), which implies that the high horizontal electric field across the source contact due to the large voltage drop at the reverse biased Schottky junction is the dominant physical mechanism causing the asymmetrical degradation of a-IGZO TFTs under simultaneous gate and drain bias stresses.

Light Effects on the Bias Stability of Transparent ZnO Thin Film Transistors

  • Shin, Jae-Heon;Lee, Ji-Su;Hwang, Chi-Sun;KoPark, Sang-Hee;Cheong, Woo-Seok;Ryu, Min-Ki;Byun, Chun-Won;Lee, Jeong-Ik;Chu, Hye-Yong
    • ETRI Journal
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    • 제31권1호
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    • pp.62-64
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    • 2009
  • We report on the bias stability characteristics of transparent ZnO thin film transistors (TFTs) under visible light illumination. The transfer curve shows virtually no change under positive gate bias stress with light illumination, while it shows dramatic negative shifts under negative gate bias stress. The major mechanism of the bias stability under visible illumination of our ZnO TFTs is thought to be the charge trapping of photo-generated holes at the gate insulator and/or insulator/channel interface.

무선전력전송용 게이트 및 드레인 조절 회로를 이용한 고이득 고효율 전력증폭기 (High gain and High Efficiency Power Amplifier Using Controlling Gate and Drain Bias Circuit for WPT)

  • 이성제;서철헌
    • 전자공학회논문지
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    • 제51권1호
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    • pp.52-56
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    • 2014
  • 본 논문은 고효율 전력증폭기는 무선전력전송을 위한 게이트와 드레인 바이어스 조절 회로를 사용하여 설계하였다. 이 조절 회로는 PAE (Power Added Efficiency)를 개선하기 위해 사용되었다. 게이트와 드레인 바이어스 조절 회로는 directional coupler, power detector, and operational amplifier로 구성되어있다. 구동증폭기를 사용하여 고이득 2단 증폭기는 전력증폭기의 낮은 입력단에 사용되었다. 게이트와 드레인 바이어스 조절회로를 사용하여 제안된 전력증폭기는 낮은 전력에서 높은 효율성을 가질 수 있다. PAE는 80.5%까지 향상되었고 출력전력은 40.17dBm이다.

A Low Distortion and Low Dissipation Power Amplifier with Gate Bias Control Circuit for Digital/Analog Dual-Mode Cellular Phones

  • Maeng, Sung-Jae;Lee, Chang-Seok;Youn, Kwang-Jun;Kim, Hae-Cheon;Mun, Jae-Kyung;Lee, Jae-Jin;Pyun, Kwang-Eui
    • ETRI Journal
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    • 제19권2호
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    • pp.35-47
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    • 1997
  • A power amplifier operating at 3.3 V has been developed for CDMA/AMPS dual-mode cellular phones. It consists of linear GaAs power MESFET's, a new gate bias control circuit, and an output matching circuit which prevents the drain terminal of the second MESF from generating the harmonics. The relationship between the intermodulation distortion and the spectral regrowth of the power amplifier has been investigated with gate bias by using the two-tone test method and the adjacent channel leakage power ratio (ACPR) method of CDMA signals. The dissipation power of the power amplifier with a gate bias control circuit is minimized to below 1000 mW in the range of the low power levels while satisfying the ACPR of less than -26 dBc for CDMA mode. The ACPR of the power amplifier is measured to be -33 dBc at a high output power of 26 dBm.

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고온에서 제조된 실리콘 주입 p채널 다결정 실리콘 박막 트랜지스터의 전기 특성 변화 연구 (A Study on Electric Characteristics of Silicon Implanted p Channel Polycrystalline Silicon Thin Film Transistors Fabricated on High Temperature)

  • 이진민
    • 한국전기전자재료학회논문지
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    • 제24권5호
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    • pp.364-369
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    • 2011
  • Analyzing electrical degradation of polycrystalline silicon transistor to applicable at several environment is very important issue. In this research, after fabricating p channel poly crystalline silicon TFT (thin film transistor) electrical characteristics were compare and analized that changed by gate bias with first measurement. As a result on and off current was reduced by variation of gate bias and especially re duce ratio of off current was reduced by $7.1{\times}10^1$. On/off current ratio, threshold voltage and electron mobility increased. Also, when channel length gets shorter on/off current ratio was increased more and thresh old voltage increased less. It was cause due to electron trap and de-trap to gate silicon oxide by variation of gate bias.

온도 변화 및 Gate bias stress time에 따른 MICC, ELA TFT성능 변화 비교 분석 (Analysis of MICC, ELA TFT performance transition according to substrate temperature and gate bias stress time variation)

  • 이승호;이원백;이준신
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2010년도 하계학술대회 논문집
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    • pp.368-368
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    • 2010
  • Using TFTs crystallized by MICC and ELA, electron mobility and threshold voltage were measured according to various substrate temperature from $-40^{\circ}C$ to $100^{\circ}C$. Basic curve, $V_G-I_D$, is also measured under various stress time from 1s to 10000s. Consequently, due to the passivation effect and number of grains, mobility of MICC is varied in the range of -8% ~ 7.6%, while that of ELA is varied from -11.04% ~ 13.25%. Also, since $V_G-I_D$ curve is dominantly affected by grain size, active layer interface, the graph remained steady under the various gate bias stress time from 1s to 10000s. This proves the point that MICC can be alternative technic to ELA.

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Gate 및 Drain 바이어스 제어를 이용한 3-way Doherty 전력증폭기와 성능개선 (Performance Enhancement of 3-way Doherty Power Amplifier using Gate and Drain bias control)

  • 이광호;이석희;방성일
    • 대한전자공학회논문지TC
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    • 제48권1호
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    • pp.77-83
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    • 2011
  • 본 논문에서는 차세대 무선통신 중계기 및 기지국용 50W급 Doherty 전력증폭기를 설계 및 제작하였다. Doherty 전력증폭기의 보조증폭기를 구현하기 위하여 Gate 바이어스 조절회로를 사용하였다. Gate 바이어스 조절회로는 보조증폭기를 구현할 수 있으나 Doherty 전력증폭기의 출력특성을 개선하기에는 제한된 특성을 가졌다. 이를 해결하고자 Drain 바이어스 조절회로를 첨가였다. 그리고 Doherty 전력증폭기의 효율을 개선하고자 일반적인 2-way 구조가 아닌 3-way 구조를 적용하여 3-way GDCD(Gate and Drain Control Doherty) 전력증폭기를 구현하였다. 비유전율(${\varepsilon}r$) 4.6, 유전체 높이(H) 30 Mill, 동판두께(T) 2.68 Mill(2 oz)인 FR4 유전체를 사용하여 마이크로스트립 선로와 칩 캐패시터로 정합회로를 구성하였다. 실험결과 3GPP 동작 주파수 대역인 2.11GHz ~ 2.17GHz에서 이득이 57.03 dB이고, PEP 출력이 50.30 dBm, W-CDMA 평균전력 47.01 dBm, 5MHz offset 주파수대역에서 -40.45 dBc의 ACLR로써 증폭기의 사양을 만족하였다. 특히 3-way GDCD 전력증폭기인 일반전력증폭기에 비해 동일 ACLR에 대하여 우수한 효율 개선성능을 보였다.