• 제목/요약/키워드: floating metal

검색결과 76건 처리시간 0.02초

Investigation of Junction-less Tunneling Field Effect Transistor (JL-TFET) with Floating Gate

  • Ali, Asif;Seo, Dongsun;Cho, Il Hwan
    • JSTS:Journal of Semiconductor Technology and Science
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    • 제17권1호
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    • pp.156-161
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    • 2017
  • This work presents a novel structure for junction-less tunneling field effect transistor (JL-TFET) with a floating gate over the source region. Introduction of floating gate instead of fixed metal gate removes the limitation of fabrication process suitability. The proposed device is based on a heavily n-type-doped Si-channel junction-less field effect transistor (JLFET). A floating gate over source region and a control-gate with optimized metal work-function over channel region is used to make device work like a tunnel field effect transistor (TFET). The proposed device has exhibited excellent ID-VGS characteristics, ION/IOFF ratio, a point subthreshold slope (SS), and average SS for optimized device parameters. Electron charge stored in floating gate, isolation oxide layer and body doping concentration are optimized. The proposed JL-TFET can be a promising candidate for switching performances.

Poly-Si 기판을 이용한 저온 공정 metal dot nano-floating gate memory 제작 (Fabrication of low temperature metal dot nano-floating gate memory using ELA Poly-Si thin film transistor)

  • 구현모;신진욱;조원주;이동욱;김선필;김은규
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2007년도 추계학술대회 논문집
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    • pp.120-121
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    • 2007
  • Nano-floating gate memory (NFGM) devices were fabricated by using the low temperature poly-Si thin films crystallized by ELA and the $In_2O_3$ nano-particles embedded in polyimide layers as charge storage. Memory effect due to the charging effects of $In_2O_3$ nano-particles in polyimide layer was observed from the TFT NFGM. The post-annealing in 3% diluted hydrogen $(H_2/N_2)$ ambient improved the retention characteristics of $In_2O_3$ nano-particles embedded poly-Si TFT NFGM by reducing the interfacial states as well as grain boundary trapping states.

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플로팅 금속 가드링 구조를 이용한 Ga2O3 쇼트키 장벽 다이오드의 항복 특성 개선 연구 (Improved breakdown characteristics of Ga2O3 Schottky barrier diode using floating metal guard ring structure)

  • 최준행;차호영
    • 전기전자학회논문지
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    • 제23권1호
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    • pp.193-199
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    • 2019
  • 본 연구에서는 TCAD 시뮬레이션을 사용하여 산화갈륨 ($Ga_2O_3$) 기반 수직형 쇼트키 장벽 다이오드 고전압 스위칭 소자의 항복전압 특성을 개선하기 위한 가드링 구조를 이온 주입이 필요 없는 간단한 플로팅 금속 구조를 활용하여 제안하였다. 가드링 구조를 도입하여 양극 모서리에 집중되던 전계를 감소시켜 항복전압 성능 개선을 확인하였으며, 이때 금속 가드링의 폭과 간격 및 개수에 따른 항복전압 특성 분석을 전류-전압 특성과 내부 전계 및 포텐셜 분포를 함께 분석하여 최적화를 수행하였다. N형 전자 전송층의 도핑농도가 $5{\times}10^{16}cm^{-3}$이고 두께가 $5{\mu}m$인 구조에 대하여 $1.5{\mu}m$ 폭의 금속 가드링을 $0.2{\mu}m$로 5개 배치하였을 경우 항복전압 2000 V를 얻었으며 이는 가드링 없는 구조에서 얻은 940 V 대비 두 배 이상 향상된 결과이며 온저항 특성의 저하는 없는 것으로 확인되었다. 본 연구에서 활용한 플로팅 금속 가드링 구조는 추가적인 공정단계 없이 소자의 특성을 향상시킬 수 있는 매우 활용도가 높은 기술로 기대된다.

단일 Floating Island 구조 Power MOSFET의 전기적 특성 향상과 설계 파라미터에 관한 연구 (A Study on Electrical Characteristic Improvement & Design Parameters of Power MOSFET with Single Floating Island Structure)

  • 조유습;성만영
    • 한국전기전자재료학회논문지
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    • 제28권4호
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    • pp.222-228
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    • 2015
  • Power MOSFETs (metal oxide semiconductor field effect transistor) operate as energy control semiconductor switches. In order to reduce energy loss of the device, it is essential to increase its conductance. However, a trade-off relationship between the breakdown voltage and conductance of the device have been the critical difficulty to improve. In this paper, theoretical analysis of electrical benefits on single floating island power MOSFET is proposed. By the method, the optimization point has set defining the doping limit under single floating island structure. The numerical multiple 2.22 was obtained which indicates the doping limit of the original device, improving its ON state voltage drop by 45%.

EEPROM을 이용한 전하센서 (EEPROM Charge Sensors)

  • 이동규;김해봉;양병도;김영석;이형규
    • 한국전기전자재료학회논문지
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    • 제23권8호
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    • pp.605-610
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    • 2010
  • The devices based on electrically erasable programmable read-only memory (EEPROM) structure are proposed for the detection of external electric charges. A large size charge contact window (CCW) extended from the floating gate is employed to immobilize external charges, and a control gate with stacked metal-insulator-metal (MIM) capacitor is adapted for a standard single polysilicon CMOS process. When positive voltage is applied to the capacitor of CCW of an n-channel EEPROM, the drain current increases due to the negative shift of its threshold voltage. Also when a pre-charged external capacitor is directly connected to the floating gate metal of CCW, the positive charges of the external capacitor make the drain current increase for n-channel, whereas the negative charges cause it to decrease. For an p-channel, however, the opposite behaviors are observed by the external voltage and charges. With the attachment of external charges to the CCW of EEPROM inverter, the characteristic inverter voltage behavior shifts from the reference curve dependent on external charge polarity. Therefore, we have demonstrated that the EEPROM inverter is capable of detecting external immobilized charges on the floating gate. and these devices are applicable to sensing the pH's or biomolecular reactions.

불평등 전계중에 금속구 및 금속침의 부유 물체가 존재하는 경우의 Flashover특성 (A Study on the Characteristics of DC Flashover with Floating Metallic Objects in Unipolar Ion Field)

  • 석복렬;허근도;김규섭;조정수;박정후
    • 대한전기학회:학술대회논문집
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    • 대한전기학회 1995년도 추계학술대회 논문집 학회본부
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    • pp.469-471
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    • 1995
  • This paper describes the effect of floating metallic object on do flashover characteristics in all gap producing unipolar ion flow field. Needle-to-plane electrodes of 120mm in gap length were used as the main gap electrode and the tested metallic objects were spheres with the radius of 2,10 and 15mm or needles from 5 to 40mm long. The characteristics of flashover voltage vs. location of the floating object are different completely with the shape of the floating metal and polarity of the applied voltage.

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Transparent Nano-floating Gate Memory Using Self-Assembled Bismuth Nanocrystals in $Bi_2Mg_{2/3}Nb_{4/3}O_7$ (BMN) Pyrochlore Thin Films

  • 정현준;송현아;양승동;이가원;윤순길
    • 한국재료학회:학술대회논문집
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    • 한국재료학회 2011년도 추계학술발표대회
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    • pp.20.1-20.1
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    • 2011
  • The nano-sized quantum structure has been an attractive candidate for investigations of the fundamental physical properties and potential applications of next-generation electronic devices. Metal nano-particles form deep quantum wells between control and tunnel oxides due to a difference in work functions. The charge storage capacity of nanoparticles has led to their use in the development of nano-floating gate memory (NFGM) devices. When compared with conventional floating gate memory devices, NFGM devices offer a number of advantages that have attracted a great deal of attention: a greater inherent scalability, better endurance, a faster write/erase speed, and more processes that are compatible with conventional silicon processes. To improve the performance of NFGM, metal nanocrystals such as Au, Ag, Ni Pt, and W have been proposed due to superior density, a strong coupling with the conduction channel, a wide range of work function selectivity, and a small energy perturbation. In the present study, bismuth metal nanocrystals were self-assembled within high-k $Bi_2Mg_{2/3}Nb_{4/3}O_7$ (BMN) films grown at room temperature in Ar ambient via radio-frequency magnetron sputtering. The work function of the bismuth metal nanocrystals (4.34 eV) was important for nanocrystal-based nonvolatile memory (NVM) applications. If transparent NFGM devices can be integrated with transparent solar cells, non-volatile memory fields will open a new platform for flexible electron devices.

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Nano-Floating Gate Memory Devices with Metal-Oxide Nanoparticles in Polyimide Dielectrics

  • Kim, Eun-Kyu;Lee, Dong-Uk;Kim, Seon-Pil;Lee, Tae-Hee;Koo, Hyun-Mo;Shin, Jin-Wook;Cho, Won-Ju;Kim, Young-Ho
    • JSTS:Journal of Semiconductor Technology and Science
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    • 제8권1호
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    • pp.21-26
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    • 2008
  • We fabricated nano-particles of ZnO, $In_2O_3$ and $SnO_2$ by using the chemical reaction between metal thin films and polyamic acid. The average size and density of these ZnO, $In_2O_3$ and $SnO_2$ nano-particles was approximately 10, 7, and 15 nm, and $2{\times}10^{11},\;6{\times}10^{11},\;2.4{\times}10^{11}cm^{-2}$, respectively. Then, we fabricated nano-floating gate memory (NFGM) devices with ZnO and $In_2O_3$ nano-particles embedded in the devices' polyimide dielectrics and silicon dioxide layers as control and tunnel oxides, respectively. We measured the current-voltage characteristics, endurance properties and retention times of the memory devices using a semiconductor parameter analyzer. In the $In_2O_3$ NFGM, the threshold voltage shift (${\Delta}V_T$) was approximately 5 V at the initial state of programming and erasing operations. However, the memory window rapidly decreased after 1000 s from 5 to 1.5 V. The ${\Delta}V_T$ of the NFGM containing ZnO was approximately 2 V at the initial state, but the memory window decreased after 1000 s from 2 to 0.4 V. These results mean that metal-oxide nano-particles have feasibility to apply NFGM devices.

Electron Beam Floating Zone Melting에 의한 니오븀의 정련 및 단결정 성장에 관한 연구 (Study on the Purification and Single Crystal Growth of Niobium Metal by Electron Beam Floating Zone Melting)

  • 최용삼;확준섭
    • 한국결정학회지
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    • 제3권2호
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    • pp.72-84
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    • 1992
  • EBFZM( Electron Beam Floating Zone Melting ) 법을 이용하여 니오븀에서의 침입형불순물 정련기구, 단결정 성장기구 및 유동현상을 연구하였다. EBFZM 은 산소와 질소의 제거에 효과적이었고,탄소의 경우 유확산펌프에서의 Backstream으로 인하여 약간 증가하는 경향성을 보였다. 원소재에 집합조직이 존재 하는 경우, EBFZM을 시행한 후의 결정성장 방위가 원소재의 집합조직과 일치하였으며,이로부터 2차 재결정에 의한 단결정 성장기구를 제안하였다. 또한,용 응대의 유동현상을 연구하여 낮은 Prandtl수인 니오븀에서도 Marangoni대류가 존재하여 결정내부의 striation을 유발시키고 산소와 질소에 대한 정련효과를 증대시킴을 밝혔다.

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중자에서 발생한 가스 결함 위치 예측 (Prediction of Positions of Gas Defects Generated from Core)

  • 마쓰시타 마코토;코사카 아키라;카나타니 시게히로
    • 한국주조공학회지
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    • 제42권1호
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    • pp.61-66
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    • 2022
  • Hydraulic units are important components of agricultural and construction machinery, and thus require high-quality castings. However, gas defects occurring inside the sand cores of the castings due to the resin used is a problem. This study therefore aimed to develop a casting simulation method that can clarify the gas defect positions. Gas defects are thought to be caused by gas generated after the molten metal fills up the mold cavity. The gas constant is the most effective factor for simulating this gas generated from sand cores. It is calculated by gas generating temperature and analysis of composition in the inert gas atmosphere modified according to the mold filling conditions of molten metal. It is assumed that gases generated from the inside of castings remain if the following formula is established. [Time of occurrence of gas generation] + [Time of occurrence of gas floating] > [Time of occurrence of casting surface solidification] The possibility of gas defects is evaluated by the time of occurrence of gas generation and gas floating calculated using the gas constant. The residual position of generated gases is decided by the closed loops indicating the final solidification location in the casting simulation. The above procedure enables us to suggest suitable casting designs with zero gas defects, without the need to repeat casting tests.