• Journal of the Semiconductor & Display Technology
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• v.21 no.4
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• pp.27-32
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• 2022

RISC-V is an open instruction set architecture (ISA) developed in 2010 at UC Berkeley, and active research is being conducted as a processor to compete with ARM. In this paper, we propose an SoC system including an RV32I ISA-based 32-bit 5-stage pipeline processor and AHB bus master. The proposed RISC-V processor supports 37 instructions, excluding FENCE, ECALL, and EBREAK instructions, out of a total of 40 instructions based on RV32I ISA. In addition, the RISC-V processor can be connected to peripheral devices such as BRAM, UART, and TIMER using the AHB-lite bus protocol through the proposed AHB bus master. The proposed SoC system was implemented in Arty A7-35T FPGA with 1,959 LUTs and 1,982 flip-flops. Furthermore, the proposed hardware has a maximum operating frequency of 50 MHz. In the Dhrystone benchmark, the proposed processor performance was confirmed to be 0.48 DMIPS.

• Journal of The Korean Astronomical Society
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• v.56 no.1
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• pp.23-33
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• 2023

We investigate the diffusion process of Thomson-scattered line photons in both real space and frequency space through a Monte Carlo approach. The emission source is assumed to be monochromatic and point-like embedded at the center of a free electron region in the form of a sphere and a slab. In the case of a spherical region, the line profiles emergent at a location of Thomson optical depth τ_Th from the source exhibit the full width of the half maximum σ_λ ≃ τ^1.5_Th. In the slab case, we focus on the polarization behavior where the polarization direction flips from the normal direction of the slab to the parallel as the slab optical depth τ_Th increases from τ_Th ≪ 1 to τ_Th ≫ 1. We propose that the polarization flip to the parallel direction to the slab surface in optically thick slabs is attributed to the robustness of the Stokes parameter Q along the vertical axis with respect to the observer's line of sight whereas randomization dominates the remaining region as τ_Th increases. A brief discussion on the importance of our study is presented.

• Journal of IKEEE
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• v.28 no.1
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• pp.1-5
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• 2024

To improve the performance of DRAM, it is essential to reduce sensing failures caused by mismatch in SA. Unlike flip failures, delay failures can be degraded, especially when high-speed operation is required, making it a critical consideration in the design of next-generation memory. While conventional SA operates with all transistors starting amplification simultaneously, SDSA selectively activates only two transistors that output BLB, thus alleviating offset. In this paper, we validate the superior performance of SDSA in mitigating delay failures through simulations. It was confirmed that SDSA exhibits approximately a 90 % reduction in delay failures compared to conventional SA.

• Journal of the Microelectronics and Packaging Society
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• v.17 no.2
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• pp.55-61
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• 2010

The device with tantalum silicide heater were bonded by Ag paste and Au SBB(Stud Bump Bonding) onto the Au coated substrate. The shear test after Au ABB and the thermal performance under current stressing were measured. The optimum condition of Au SBB was determined by fractured surface after die shear test and $350^{\circ}C$ for substrate, $250^{\circ}C$ for die during flip chip bonding with bonding load of about 300 g/bump. With applying 5W through heater on the device, the maximum temperature with Ag paste bonding was about $50^{\circ}C$. That with Au SBB on Au coated Si substrate showed $64^{\circ}C$. The difference of maximum temperatures is only $14^{\circ}C$, even though the difference of contact area between Ag paste bonding and Au SBB is by about 300 times and the simulation showed that the contact resistance might be one of the reasons.

• Journal of the Microelectronics and Packaging Society
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• v.20 no.3
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• pp.31-35
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• 2013

TSOP(Thin Small Outline Package) is the IC package using lead frame, which is the type of low cost package for white electronics, auto mobile, desktop PC, and so on. Its performance is not excellent compared to BGA or flip-chip CSP, but it has been used mostly because of low price of TSOP package. However, it has been issued in TSOP package that thermal deflection of lead frame occurs frequently during molding process and Au wire between semiconductor die and pad is debonded. It has been required to solve this problem through substituting materials with low CTE and improving structure of lead frame. We focused on developing the lead frame structure having thermal stability, which was carried out by numerical analysis in this study. Thermal deflection of lead frame in TSOP package was simulated with positions of anti-deflection adhesives, which was ranging 198 um~366 um from semiconductor die. It was definitely understood that thermal deflection of TSOP package with anti-deflection adhesives was improved as 30.738 um in the case of inside(198 um), which was compared to that of the conventional TSOP package. This result is caused by that the anti-deflection adhesives is contributed to restrict thermal expansion of lead frame. Therefore, it is expected that the anti-deflection adhesives can be applied to lead frame packages and enhance their thermal deflection without any change of substitutive materials with low CTE.

• The Korean Journal of Applied Statistics
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• v.36 no.2
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• pp.101-114
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• 2023

The data augmentation technique is effectively used to solve the problem of overfitting the model by allowing the training dataset to be viewed from various perspectives. In addition to image augmentation techniques such as rotation, cropping, horizontal flip, and vertical flip, occlusion-based data augmentation methods such as Cutmix and Cutout have been proposed. For models based on speech data, it is possible to use an occlusion-based data-based augmentation technique after converting a 1D speech signal into a 2D spectrogram. In particular, SpecAugment is an occlusion-based augmentation technique for speech spectrograms. In this study, we intend to compare and study data augmentation techniques that can be used in the problem of false-voice detection. Using data from the ASVspoof2017 and ASVspoof2019 competitions held to detect fake audio, a dataset applied with Cutout, Cutmix, and SpecAugment, an occlusion-based data augmentation method, was trained through an LCNN model. All three augmentation techniques, Cutout, Cutmix, and SpecAugment, generally improved the performance of the model. In ASVspoof2017, Cutmix, in ASVspoof2019 LA, Mixup, and in ASVspoof2019 PA, SpecAugment showed the best performance. In addition, increasing the number of masks for SpecAugment helps to improve performance. In conclusion, it is understood that the appropriate augmentation technique differs depending on the situation and data.

• Journal of Digital Contents Society
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• v.17 no.6
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• pp.613-621
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• 2016

This paper has the first aim to analyze Elsa's magic power of why and how she, as a heroine in the animation of Frozen, is in the emotion of fear and anger. This paper will explain why these two emotions are twisted compound to identify Elsa's iced emotion in the ice kingdom. And secondly, this paper attempts to connect Elsa's fear emotion in her real life is the other flip with that of anger throughout the characters' network in Frozen, which symbolically reflect the feminine pattern of real society that Walt Disney prospects for the dream society. Through the cognitive process for Elsa's ice kingdom between emotion status and social network, we can assume the pattern of social network with emotional chart and the archetype of human emotion through the cognitive-emotional storytelling on the emotion of Elsa in Frozen.

• The Korean Journal of Physiology and Pharmacology
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• v.25 no.4
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• pp.273-280
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• 2021

Lung cancer despite advancement in the medical field continues to be a major threat to human lives and accounts for a high proportion of fatalities caused by cancers globally. The current study investigated vanillin oxime, a derivative of vanillin, against lung cancer cells for development of treatment and explored the mechanism. Cell viability changes by vanillin oxime were measured using MTT assay. Vanillin oxime-mediated apoptosis was detected in A549 and NCI-H2170 cells at 48 h of exposure by flow cytometry. The CEBP homologous protein (CHOP) and death receptor 5 (DR5) levels were analysed by RT-PCR and protein levels by Western blotting. Vanillin oxime in concentration-dependent way suppressed A549 and NCI-H2170 cell viabilities. On exposure to 12.5 and 15 μM concentrations of vanillin oxime elevated Bax, caspase-3, and -9 levels in A549 and NCI-H2170 cells were observed. Vanillin oxime exposure suppressed levels of Bcl-2, survivin, Bcl-xL, cFLIP, and IAPs proteins in A549 and NCI-H2170 cells. It stimulated significant elevation in DR4 and DR5 levels in A549 and NCI-H2170 cells. In A549 and NCI-H2170 cells vanillin oxime exposure caused significant (p < 0.05) enhancement in CHOP and DR5 mRNA expression. Vanillin oxime exposure of A549 and NCI-H2170 cells led to significant (p < 0.05) enhancement in levels of phosphorylated extracellular-signal-regulated kinase and c-Jun N-terminal kinase. Thus, vanillin oxime inhibits pulmonary cell proliferation via induction of apoptosis through tumor necrosis factor-related apoptosis-inducing ligand (TRAIL) mediated pathway. Therefore, vanillin oxime may be studied further to develop a treatment for lung cancer.

• Journal of Acupuncture Research
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• v.31 no.2
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• pp.87-98
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• 2014

Objectives : We investigated whether snake venom toxin(SVT) from Vipera lebetina turanica sensitizes HT29 human epithelial colorectal cancer cells to tumor necrosis factor(TNF)-related apoptosis-inducing ligand(TRAIL) induced apoptosis in cancer cells. Methods : Cell viability assay was used to assess the inhibitory effect of TRAIL on cell growth of HT29 human colorectal cancer cells. And 6-diamidino-2-phenylindole(DAPI), terminal deoxynucleotidyl transferase mediated dUTP nick end labeling assay(TUNEL) staining assay were used to evaluate cell-apoptosis. Western blot analysis were conducted to observe apoptosis related proteins and death receptor. To assess whether the synergized inhibitory effect of SVT and TRAIL on reactive oxygen species(ROS) generation was reversed by strong anti-oxidative agent. Results : SVT with TRAIL inhibited HT29 cell growth different from TRAIL alone. Consistent with cell growth inhibition, the expression of TRAIL receptors; Expression of death receptor(DR)4 and DR5 was significantly increased and intrinsic pro-apoptotic cleaved caspase-3, -9 was subsequently increased together with increase of Bax/Bcl-2 ratio and extrinsic pro-apototic caspase-8 was also activated. In addition, the expression of anti-apoptotic survival proteins, a marker of TRAIL resistance(eg, cFLIP, survivin, X-linked inhibitor of apoptosis protein(XIAP) and Bcl-2) was suppressed by the combination treatment of SVT and TRAIL. Pretreatment with the ROS scavenger N-acetylcysteine abolished the SVT and TRAIL-induced upregulation of DR4 and DR5 expression and expression of the intrinsic pro-apoptotic caspase-3 and-9. Conclusion : The collective results suggest that SVT facilitates TRAIL-induced apoptosis in $HT_{29}$ human epithelial colorectal cancer cells through up-regulation of the TRAIL receptors; DR4 and DR5 and consecutive induction of bilateral apoptosis via regulating apoptosis related proteins.

• Journal of the Microelectronics and Packaging Society
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• v.17 no.4
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• pp.41-48
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• 2010

To improve the pot life of one-part in-house anisotropic conductive paste (ACP) formulations, 2-methyl imidazole curing accelerator powders were encapsulated with five agents. Through measuring the melting point of the five agents using DSC, it was confirmed that a encapsulation process with liquid-state agents is possible. Viscosity of ACP formulations containing the encapsulated imidazole powders was measured as a function of storage time from viscosity measurements. As a result, pot life of the formulations containing imidazole powders encapsulated with stearic acid and carnauba wax was improved, and these formulations indicated similar curing behaviors to a basic formulation containing rare imidazole. However, the bondlines made of these formulations exhibited low average shear strength values of about 37% level in comparison with the basic formulation.