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Encapsulation of an 2-methyl Imidazole Curing Accelerator for the Extended Pot Life of Anisotropic Conductive Pastes (ACPs)  

Kim, Ju-Hyung (Department of Materials Science & Engineering, Seoul National University of Science & Technology)
Kim, Jun-Ki (Advanced Welding & Joining Technology Center, Korea Institute of Industrial Technology(KITECH))
Hyun, Chang-Yong (Department of Materials Science & Engineering, Seoul National University of Science & Technology)
Lee, Jong-Hyun (Department of Materials Science & Engineering, Seoul National University of Science & Technology)
Publication Information
Journal of the Microelectronics and Packaging Society / v.17, no.4, 2010 , pp. 41-48 More about this Journal
Abstract
To improve the pot life of one-part in-house anisotropic conductive paste (ACP) formulations, 2-methyl imidazole curing accelerator powders were encapsulated with five agents. Through measuring the melting point of the five agents using DSC, it was confirmed that a encapsulation process with liquid-state agents is possible. Viscosity of ACP formulations containing the encapsulated imidazole powders was measured as a function of storage time from viscosity measurements. As a result, pot life of the formulations containing imidazole powders encapsulated with stearic acid and carnauba wax was improved, and these formulations indicated similar curing behaviors to a basic formulation containing rare imidazole. However, the bondlines made of these formulations exhibited low average shear strength values of about 37% level in comparison with the basic formulation.
Keywords
flip chip bonding; ACA(Anisotropic Conductive Adhesive); high-speed curing; pot life; curing accelerator;
Citations & Related Records
Times Cited By KSCI : 2  (Citation Analysis)
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