• Journal of the Semiconductor & Display Technology
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• v.1 no.1
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• pp.29-33
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• 2002

In the flip-chip process, the problem like electric defect or fatigue crack caused by the difference of CTE, between chip and substrate board had occurred. Underfill of flip chip to overcome this defects is noticed as important work developing in whole reliability of chip by protecting the chip against the external shock. In this paper, we introduce the underfill methods using mold and plunge and improvement of process and reliability, and the advantage which can be taken from embodiment of device.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2003.09a
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• pp.253-257
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• 2003

The low temperature flip chip technique is applied to the package of the temperature-sensitive devices for LCD systems and image sensors since the high temperature process degrades the polymer materials in their devices. We will introduce the various low temperature flip chip bonding techniques; a conventional flip chip technique using eutectic Bi-Sn (mp: $138^{\circ}C$) or eutectic In-Ag (mp: $141^{\circ}C$) solders, a direct bump-to-bump bonding technique using solder bumps, and a low temperature bonding technique using low temperature solder pads.

• Proceedings of the Korean Institute of Intelligent Systems Conference
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• 1993.06a
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• pp.925-928
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• 1993

In this paper the caracteristics of the fuzzy flip-flop which was proposed as a fuzzy sequential circuit is firstly mentioned. Secondly the circuit construction of typical fuzzy flip-flip circuits using VHDL (Very high speed integrated circuit Hardware Description Language) compiler and simulator is presented. Finally the possibility of the application of the fuzzy sequential circuit will be mentioned.

• Journal of the Korean Magnetics Society
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• v.26 no.4
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• pp.142-148
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• 2016

To evaluate the effect of flip angle on flow rate measurements obtained with phase contrast MRI according to the flip angle degree in ascending aorta and velocity encoding (VENC) was (150 m/s). 1.5T MRI in patients 17 (female: 8, male: 9, mean age $57.9{\pm}15.4$) as a target by applying a non-breath holding techniques to flip angle VENC (150 cm/s) in each of the ascending aorta was measured by changing $20^{\circ}$, $30^{\circ}$ and $40^{\circ}$. Blood was obtained a peak velocity, average velocity, net forward volume, net forward volume/body surface area. Ascending aorta from average velocity (AV) measured the average value of the flip angle $20^{\circ}$ (9.87 cm/s), $30^{\circ}$ (9.6 cm/s) and $40^{\circ}$ (10.05 cm/s). Blood flow VENC in was blood flow change in flip angle change was high most blood flow measurement when the flip angle $30^{\circ}$ in VENC, crouching each blood flow is also proportional to the increases in the $20^{\circ}$ to $40^{\circ}$ and was increased, the deviation of the peak velocity and the average velocity is the smallest deviation from the flip angle $30^{\circ}$. Flip angle $20^{\circ}$, $30^{\circ}$ and $40^{\circ}$ in peak velocity, average velocity, net forward volume, net forward volume/body surface area was no statistically significant difference (p > .05). Blood flow velocity and blood flow is measured by applying to adjust the flip angle accurately calculate the blood flow is important information for diagnosis and treatment of cardiovascular diseases, and can help in the examination on the blood flow measurement.

• Journal of International Academy of Physical Therapy Research
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• v.4 no.2
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• pp.562-565
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• 2013

The fact that flip-flops, one of many different types of unstable shoes, are light and relatively easy to put on, accounts for their popularity among people. But because flip-flops rely heavily on the support of a single thong between your first and second toes, they impose a huge amount of pressure onto lower leg. Thus in the following experiment we tried to examine the different effects of flip-flops and running shoes in terms of their effect on muscle activity and fatigue of tibialis anterior and gastrocnemius during walking. In order to measure an electromyogram we used Free EMG system. 10 men and 10 women in running shoes ran on treadmills for 15 minutes at 4.8km/h, 2 days later the same experiment was carried out, but this time, in flip-flops. p value turned out to be greater than .05 and thus there was no considerable difference between the effects of flip-flops and running shoes on muscle activity and fatigue during walking. Therefore we conclude that despite the fact that flip-flops are considered unstable, their effects on muscle activity and fatigue of tibialis anterior and gastrocnemius are negligible.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2008.06a
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• pp.519-520
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• 2008

• Journal of the Microelectronics and Packaging Society
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• v.7 no.1
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• pp.61-73
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• 2000

In traditional electronic packages the die and the substrate are interconnected with fine wire. Wire bonding technology is limited to bond pads around the peripheral of the die. As the demand for I/O increases, there will be limitations with wire bonding technology.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2007.06a
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• pp.469-470
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• 2007

• Journal of the Korean Society of Industry Convergence
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• v.3 no.1
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• pp.69-75
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• 2000

Multichip packages are comprised of dissimilar materials which expand at different rates on heating. The differential expansion must be accommodated by the various structural elements of the package. A types of heat exposures occur operation cycles. This study presents a finite element analysis simulation of flip-chip among multichip. The effects of geometries and material properties on the reliability were estimated during the analysis of temperature and thermal stress of flip-chip. From the results, it could be obtained that the more significant parameters to the reliability of flip-chip arc chip power cycle, heat convection and height of solder bump.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.25 no.4
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• pp.483-486
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• 2014

Although flip-chip interconnects have smaller parasitics than bonding wires, they should be carefully designed at 60 GHz. Insertion loss at a flip-chip transition may differ as much as 2 dB depending on design parameters. In this paper we present a comprehensive sensitivity analysis to optimize the flip-chip transition.