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http://dx.doi.org/10.5515/KJKIEES.2014.25.4.483

Optimization of a Flip-Chip Transition for Signal Integrity at 60-GHz Band  

Kam, Dong Gun (Department of Electronics Engineering, Ajou University)
Publication Information
The Journal of Korean Institute of Electromagnetic Engineering and Science / v.25, no.4, 2014 , pp. 483-486 More about this Journal
Abstract
Although flip-chip interconnects have smaller parasitics than bonding wires, they should be carefully designed at 60 GHz. Insertion loss at a flip-chip transition may differ as much as 2 dB depending on design parameters. In this paper we present a comprehensive sensitivity analysis to optimize the flip-chip transition.
Keywords
Flip-Chip Transition; Sensitivity Analysis; Design Optimization; 60 GHz; Signal Integrity;
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  • Reference
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