The Journal of Korean Institute of Electromagnetic Engineering and Science (한국전자파학회논문지)

The Korean Institute of Electromagnetic Engineering and Science (한국전자파학회)
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Optimization of a Flip-Chip Transition for Signal Integrity at 60-GHz Band

60 GHz 대역 신호 무결성을 위한 플립 칩 구조 최적화

  • Kam, Dong Gun (Department of Electronics Engineering, Ajou University)
  • 감동근 (아주대학교 전자공학과)
  • Received : 2014.02.10
  • Accepted : 2014.03.04
  • Published : 2014.04.30
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Abstract

Although flip-chip interconnects have smaller parasitics than bonding wires, they should be carefully designed at 60 GHz. Insertion loss at a flip-chip transition may differ as much as 2 dB depending on design parameters. In this paper we present a comprehensive sensitivity analysis to optimize the flip-chip transition.

일반적으로 플립 칩은 와이어 본딩에 비해 신호 무결성을 저해하는 기생 성분이 작지만, 60 GHz 대역에서는 설계하기에 따라서 2 dB 이상의 삽입 손실 차이가 난다. 본 논문에서는 플립 칩 구조의 여러 설계 변수들에 따라 삽입 손실이 어떻게 변하는 지를 분석함으로써 설계를 최적화하는 방법을 제시한다.

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References

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