• Title/Summary/Keyword: flip

Search Result 889, Processing Time 0.031 seconds

Verification of Numerical Analysis Technique of Dynamic Response of Seabed Induced by the Interaction between Seabed and Wave (파랑-지반 상호작용에 의한 해저지반의 동적응답 수치해석법 검증)

  • Kang, Gi-Chun;Kim, Sung-Woung;Kim, Tae-Hyung;Kim, Do-Sam;Kim, Jae-Hong
    • Journal of the Korean Geotechnical Society
    • /
    • v.31 no.1
    • /
    • pp.5-14
    • /
    • 2015
  • Seabed may undergo large excess pore water pressure in the case of long duration of high wave loading. This excess pore water pressure may reduce effective stress and, consequently, the seabed may liquefy. Thus, it is necessary to develop a numerical technique which can precisely evaluate the dynamic response of seabed due to wave action. In this study, a new numerical technique named mixed model (2D NIT & FLIP models) was proposed. The dynamic wave pressure and water flow velocity acting on the boundary between seabed and the wave field was estimated using 2D-NIT model. This result was used as input data in FLIP program for investigation of dynamic response of seabed. To secure the reliability of the mixed model, the numerical analysis results of the mixed model were compared with Yamamoto's solution and Chang's experiment results. The comparison results indicated that there were some differences between them, but the general trend of the effective stress increment and the excess pore water pressure along the depth of seabed was similar to each other. Thus, this study clearly supports the plausibility of the numerical analysis of the mixed model.

Inhibition of SIRT1 Sensitizes TRAIL-Resistant MCF-7 Cells by Upregulation of DR5 and Inhibition of c-FLIP (SIRT1 억제에 의한 DR5 발현증강과 c-FLIP 발현저해 작용으로 사람유방암세포 MCF-7의 TRAIL 감수성 증강)

  • Lee, Su-Hoon;Kim, Hak-Bng;Kim, Mi-Ju;Lee, Jae-Won;Bae, Jae-Ho;Kim, Dong-Wan;Kang, Chi-Dug;Kim, Sun-Hee
    • Journal of Life Science
    • /
    • v.22 no.10
    • /
    • pp.1277-1285
    • /
    • 2012
  • The tumor necrosis, factor-related, apoptosis-inducing ligand (TRAIL) is regarded as a potentially useful anticancer agent with excellent selectivity for cancer cells. However, a considerable number of cancer cells are resistant to apoptosis induction by TRAIL. Developing strategies to overcome this resistance are important for the successful use of TRAIL for cancer therapy. Here, we revealed that siRNA-mediated downregulation of SIRT1 or SIRT1 inhibitor Amurensin G upregulated DR5 and c-Myc and downregulated c-$FLIP_{L/S}$ and Mcl-1, which was associated with sensitization of TRAIL-resistant MCF-7 cells to TRAIL. This result was followed by the activation of caspases, PARP cleavage, and downregulation of Bcl-2 in both TRAIL-treated MCF-7 cells transfected with SIRT1 siRNA and cells co-treated with Amurensin G and TRAIL. Our results suggest that the induction of DR5 and downregulation of c-FLIP via suppression of SIRT1 expression may be a useful strategy to increase the susceptibility of TRAIL-resistant cancer cells to TRAIL-induced cell death.

Design by Topology Optimization and Performance Test of Ultrasonic Bonding Module for Flip-Chip Packaging (초음파 플립칩 접합 모듈의 위상최적화 설계 및 성능 실험)

  • Kim, Ji Soo;Kim, Jong Min;Lee, Soo Il
    • Journal of Welding and Joining
    • /
    • v.30 no.6
    • /
    • pp.113-119
    • /
    • 2012
  • Ultrasonic bonding is the novel packaging method for flip-chip with high yield and low-temperature bonding. The bonding module is a core part of the bonding machine, which can transfer the ultrasonic energy into the bonding spot. In this paper, we propose topology optimization technique which can make new design of boding modules due to the constraints on resonance frequency and mode shapes. The designed bonding module using topology optimization was fabricated in order to evaluate the bonding performance and reliable operation during the continuous bonding process. The actual production models based on the proposed design satisfied the target frequency range and ultrasonic power. The bonding test was performed using flip-chip with lead-free Sn-based bumps, the results confirmed that the bonding strength was sufficient with the designed bonding modules. Also the performance degradation of the bonding module was not observed after the 300-hour continuous process with bonding conditions.

A Study on Flipped Learning Experience of Nursing Students (간호학과 학생들의 플립러닝 학습 경험에 관한 연구)

  • Kim, Yun-Jeong;Cho, Eui-Young;Jeon, Eun-mi
    • The Journal of the Convergence on Culture Technology
    • /
    • v.3 no.4
    • /
    • pp.159-163
    • /
    • 2017
  • The purpose of this study is to apply flip learning to nursing students and to understand their teaching experience. That is, we analyze the meaning of experience by applying the phenomenological analysis method of Colaizzi, which is aimed to grasp the essence of each individual experience by studying the learning experiences of nursing students participating in the flip learning lesson. The analysis of Colaizzi's phenomenological analysis of the meaning of flip - learning lessons in nursing students resulted in seven themes and three central meanings. Based on this study, it is suggested that qualitative and quantitative research should be expanded to expand the flip learning method in the major subject of nursing science.

Quaternary D Flip-Flop with Advanced Performance (개선된 성능을 갖는 4치 D-플립플롭)

  • Na, Gi-Soo;Choi, Young-Hee
    • 전자공학회논문지 IE
    • /
    • v.44 no.2
    • /
    • pp.14-20
    • /
    • 2007
  • This paper presents quaternary D flip-flop with advanced performance. Quaternary D flip-flop is composed of the components such as thermometer code output circuit, EX-OR gate, bias inverter, transmission gate and binary D flip-flop circuit. The designed circuit is simulated by HSPICE in $0.35{\mu}m$ one-poly six-metal CMOS process parameters with a single +3.3V supply voltage. In the simulations, sampling frequencies is measured around 100MHz. The PDP parameters and FOM we estimated to be 59.3fJ, 33.7 respectively.

Flip Chip Interconnection Method Applied to Small Camera Module

  • Segawa, Masao;Ono, Michiko;Karasawa, Jun;Hirohata, Kenji;Aoki, Makoto;Ohashi, Akihiro;Sasaki, Tomoaki;Kishimoto, Yasukazu
    • Proceedings of the International Microelectronics And Packaging Society Conference
    • /
    • 2000.10a
    • /
    • pp.39-45
    • /
    • 2000
  • A small camera module fabricated by including bare chip bonding methods is utilized to realize advanced mobile devices. One of the driving forces is the TOG (Tape On Glass) bonding method which reduces the packaging size of the image sensor clip. The TOG module is a new thinner and smaller image sensor module, using flip chip interconnection method with the ACP (Anisotropic Conductive Paste). The TOG production process was established by determining the optimum bonding conditions for both optical glass bonding and image sensor clip bonding lo the flexible PCB. The bonding conditions, including sufficient bonding margins, were studied. Another bonding method is the flip chip bonding method for DSP (Digital Signal Processor) chip. A new AC\ulcorner was developed to enable the short resin curing time of 10 sec. The bonding mechanism of the resin curing method was evaluated using FEM analysis. By using these flip chip bonding techniques, small camera module was realized.

  • PDF

Circuit Design and Simulation Study of an RSFQ Switch Element for Optical Network Switch Applications (광 네트워크 스위치 응용을 위한 RSFQ Switch의 회로 설계 및 시뮬레이션)

  • 홍희송;정구락;박종혁;임해용;장영록;강준희;한택상
    • Progress in Superconductivity
    • /
    • v.5 no.1
    • /
    • pp.13-16
    • /
    • 2003
  • In this work, we have studied about an RSFQ (Rapid Single Flux Quantum) switch element. The circuit was designed, simulated, and laid out for mask fabrication. The switch cell was composed of a D flip-flop, a splitter, a confluence buffer, and a switch core. The switch core determined if the input data could pass to the output. “On” and o“off” controls in the switch core could be possible by utilizing an RS flip-flop. When a control pulse was input to the “on” port, the RS flip-flop was in the set state and passed the input pulses to the output port. When a pulse was input to the “off” port, the RS flip-flop was in the reset state and prevented the input pulses from transferring to the output port. We simulated and optimized the switch element circuit by using Xic, WRspice, and Julia. The minimum circuit margins in simulations were more than $\pm$20%. We also performed the mask layout of the circuit by using Xic and Lmeter.

  • PDF

Analysis of Fuel Options in TRIGA Reactor

  • Lee, Un-Chul;Lee, Chang-Kun;Lee, Ji-Bok;Kim, Jin-Soo;Lee, Sang-Kun;Jun, Byung-Jin;Chung, Bub-Dong
    • Nuclear Engineering and Technology
    • /
    • v.11 no.1
    • /
    • pp.29-45
    • /
    • 1979
  • In this paper. nuclear characteristics of TRIGA Mark-III has been analyzed in detail for six different fuel options. Presently, 70 w/o enriched FLIP fuels are adopted for TRIGA core to improve fuel lifetime. However, such highly enriched fuels are not easily obtained due to nonproliferation treaty. This research examines the possible substitution for FLIP fuels with high density fuels without reducing the nuclear performance. This work will provide long-time plan for TRIGA operation.

  • PDF