• Journal of Powder Materials
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• v.10 no.6
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• pp.406-414
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• 2003

In order to produce good wear resistance powder metallurgy Al-Si alloys with high strength, addition of glass forming elements of Ni and Ce in $Al_{81}$Si$_{19}$ alloy was examined using SEM, TEM, tensile strength and wear testing. The solubility of Si in aluminum increased with increasing Ni and Ce contents for rapidly solidified powders. These bulk alloys consist of a mixed structure in which fine Si particles with a particle size below 500 nm and very fine A1$_3$Ni, A1$_3$Ce compounds with a particle size below 200 nm are homogeneously dispersed in aluminum matrix with a grain size below 600 nm. The tensile strength at room temperature for $Al_{81}$Si$_{19}$, $Al_{78}$Si$_{19}$Ni$_2$Ce$_{0.5}$, and $Al_{76}$Si$_{19}$Ni$_4$Ce$_1$ bulk alloys extruded at 674 K and ratio of 10 : 1 is 281,521, and 668 ㎫ respectively. Especially, $Al_{73}$Si$_{19}$Ni$_{7}$Ce$_1$ bulk alloy had a high tensile strength of 730 ㎫. These bulk alloys are good wear-resistance bel ter than commercial I/M 390-T6. Specially, attactability for counterpart is very little, about 15 times less than that of the I/M 390-T6. The structural refinement by adding glass forming elements such as Ni and Ce to hyper eutectic $Al_{81}$Si$_{19}$ alloy is concluded to be effective as a structural modification method.d.tion method.

• Journal of Sensor Science and Technology
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• v.16 no.1
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• pp.62-67
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• 2007

This paper presents a novel MEMS condenser microphone with rigid backplate to enhance acoustic characteristics. The MEMS condenser microphone consists of membrane and backplate chips which are bonded together by gold-tin (Au/Sn) eutectic solder bonding. The membrane chip has 2.5 mm${\times}$2.5 mm, $0.5{\mu}m$ thick low stress silicon nitride membrane, 2 mm${\times}$2 mm Au/Ni/Cr membrane electrode, and $3{\mu}m$ thick Au/Sn layer. The backplate chip has 2 mm${\times}$2 mm, $150{\mu}m$ thick single crystal silicon rigid backplate, 1.8 mm${\times}$1.8 mm backplate electrode, and air gap, which is fabricated by bulk micromachining and silicon deep reactive ion etching. Slots and $50-60{\mu}m$ radius circular acoustic holes to reduce air damping are also formed in the backplate chip. The fabricated microphone sensitivity is $39.8{\mu}V/Pa$ (-88 dB re. 1 V/Pa) at 1 kHz and 28 V polarization voltage. The microphone shows flat frequency response within 1 dB between 20 Hz and 5 kHz.

• Transactions of the Korean Society for Noise and Vibration Engineering
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• v.16 no.12 s.117
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• pp.1272-1278
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• 2006

This paper presents a novel MEMS condenser microphone with rigid backplate to enhance acoustic characteristics. The MEMS condenser microphone consists of membrane and backplate chips which are bonded together by gold-tin(Au/Sn) eutectic solder bonding. The membrane chip has $2.5mm{\times}2.5mm$, 0.5${\mu}m$ thick low stress silicon nitride membrane, $2mm{\times}2mm$ Au/Ni/Cr membrane electrode, and 3${\mu}m$ thick Au/Sn layer. The backplate chip has $2mm{\times}2mm$, 150${\mu}m$ thick single crystal silicon rigid backplate, $1.8mm{\times}1.8mm$ backplate electrode, and air gap, which is fabricated by bulk micromachining and silicon deep reactive ion etching. Slots and $50{\sim}60{\mu}m$ radius circular acoustic holes to reduce air damping are also formed in the backplate chip. The fabricated microphone sensitivity is 39.8 ${\mu}V/Pa$(-88 dB re. 1 V/Pa) at 1 kHz and 28 V polarization voltage. The microphone shows flat frequency response within 1 dB between 20 Hz and 5 kHz.

• Bulletin of the Korean Chemical Society
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• v.32 no.3
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• pp.863-866
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• 2011

The electrode reaction of $Eu^{3+}$ in a LiCl-KCl eutectic melt has been re-examined using cyclic voltammetry (CV). In this work, for the first time, the kinetic details of a $Eu^{3+}/Eu^{2+}$ redox system have been completely elucidated, along with the thermodynamic property, through a curve fitting applied to experimental CV data, which were obtained in a wide scan rate range of 0.5 to 10 V/s. The simulated results showed an excellent fit to all experimental CV data simultaneously, even though the curve fittings were performed within a large dynamic range of initial transfer coefficient values, formal potentials, and standard rate constants. As a result, a proper formal potential, transfer coefficient, and standard rate constant for the $Eu^{3+}/Eu^{2+}$ redox system were successfully extracted using the CV curve fitting.

• Journal of Korea Foundry Society
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• v.14 no.3
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• pp.274-284
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• 1994

SiC fibers were coated with Cu, Ag and Ni metallic thin films by magnetron sputtering in order to improve wetting properties between Al matrix and SiC fiber. The wetting behavior of metal coated SiC fiber by pure Al has been studied at $670^{\circ}C{\sim}900^{\circ}C$ range for $10{\sim}90min$. under vacuum atmosphere. Besides, the effect of coated film thickness on the wettability has been investigated. The wetting behavior and interfacial reaction between Al and SiC fibers were analysed with optical microscope and SEM (scanning electron microscope). The wetting behavior of the as-received SiC fiber with Al melt was not uniform, indicated by the contact angles from less than $90^{\circ} to more Al melt was appeared in the initial stage of reation. It was considered that the metallic thin film played an important role in reducing the interfacial free energy and breaking down the aluminum oxide film by eutectic reaction with Al melt. However the wettability of Ni coated SiC fiber was not improved as much as that of Cu or Ag coated SiC fiber. The improvement of wettability by coating thickness is clearly showed in $1{\mu}m$ coated SiC fiber compared with $0.25{\mu}m$ coated SiC.

• Korean Journal of Materials Research
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• v.22 no.2
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• pp.97-102
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• 2012

The microstructure and tensile properties of Al-Mn/Al-Si hybrid aluminum alloys prepared by electromagnetic duocasting were investigated. Only the Al-Mn alloy showed the typical cast microstructure of columnar and equiaxed crystals. The primary dendrites and eutectic structure were clearly observed in the Al-Si alloy. There existed a macro-interface of Al-Mn/Al-Si alloys in the hybrid aluminum alloys. The macro-interface was well bonded, and the growth of primary dendrites in Al-Si alloy occurred from the macro-interface. The Al-Mn/Al-Si hybrid aluminum alloys with a well-bonded macro-interface showed excellent tensile strength and 0.2% proof stress, both of which are comparable to those values for binary Al-Mn alloy, indicating that the strength is preferentially dominated by the deformation of the Al-Mn alloy side. However, the degree of elongation was between that of binary Al-Mn and Al-Si alloys. The Al-Mn/Al-Si hybrid aluminum alloys were fractured on the Al-Mn alloy side. This was considered to have resulted from the limited deformation in the Al-Mn alloy side, which led to relatively low elongation compared to the binary Al-Mn alloy.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.10 no.7
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• pp.1301-1306
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• 2006

Aluminum alloys are gaining increased acceptance in the automotive and electronic industeries and cold & hot forging is the most efficient method of manufacturing such mass produced parts. This study has been investigated the microstructures and mechanical properties of A6061(Al-1.2Mg-0.8Si) alloy fabricated by cold & hot forging process for development of the future compressor block. The microstructure of cold & hot forginged specimen were composed of eutectic structure aluminum solid solution and $Mg_2Si$ precipitates. The tensile strength of as-solid solution treatment A6061 alloy revealed 291.7MPa. It was fabricated that a trial future compressor cylinder block using cold & hot forging.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 1999.10a
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• pp.179-184
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• 1999

When the steel containing Si is oxidated in hi temperature, Re2O3, Red scale is made on the metal side as the spike phase, and this scale invasion into matrix. Therefore, it affects the feature, after rolling. It is reported that the role of Si is FeO/Fe2SiO4 eutectic compound, but Si can not affect pure iron independently. There must be Ni, then the spike phase can exist. Prominence and depression made by Ni that is necessity at the process to work iron. Therefore, in this study after the change of the amount of Ni in pure iron and steel and oxidation, the structure of the oxide and the surface, and the distribution of the elements were considered. In conclusion, at 100$0^{\circ}C$, 110$0^{\circ}C$, 120$0^{\circ}C$ the curves of oxidation weight are all S curves. Especially, in the beginning of oxidation as the amount of Ni increase, the amount of oxidation also increase. Practical steel has less oxidation than pure steel added Ni. There is much FeO in Fe-Ni alloy, compare to practical steel which has much Fe3O4. Especially, we could know considerable Ni was concentrated on the metal side in Fe-Ni alloy, practical steel. and the surface of the scale.

• Journal of the Korean Ceramic Society
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• v.31 no.7
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• pp.777-783
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• 1994

Oxidation behavior of hot-pressed silicon nitride ceramics with various sintering additives has been investigated. The weight gain of each specimens has shown in the range of 0.11 mg/$\textrm{cm}^2$ ~3.4 mg/$\textrm{cm}^2$ at 140$0^{\circ}C$ for 192 h and eleven compositions have shown good oxidation resistance with the weight gain below 0.5 mg/$\textrm{cm}^2$. The oxidation rate has been shown to obey the parabolic rate law and the oxidized surface has consisted of $\alpha$-cristobalite and M2Si2O7 or MSiO3 (M=rare earth or transition metals) phase. The oxidation rate of each specimens has related to the eutectic temperature between additive oxide and SiO2, and ionic radius of additive oxides, respectively. From the above results, it could be concluded that the oxidation behavior of hot pressed silicon nitride is dominated by the high temperature properties of grain boundary glassy phase and the high temperature properties of grain boundary glassy phase are affected by the ionic radius of additive oxides.

• Journal of the Korean earth science society
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• v.25 no.1
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• pp.48-51
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• 2004

The light element candidates such as S, O, Si, and K are discussed for the reasonable compositions in the earth's core since the available data show density difference from pure iron core. These candidates are favored by the some evidences such as depletion in the crust and mantle, and lower eutectic temperature of Fe-FeS melt for sulfur. FeO phase for oxygen, lighter mass than sulfur and solubility in metallic phases for silicon, and partitioning in Fe-FeS melt for potassium. However, other problems such as short experimental data, initial compositions of these elements, and oxidation state during the formation of the earth should be solved simultaneously to confirm these light elements.