Browse > Article
http://dx.doi.org/10.3740/MRSK.2012.22.2.97

Microstructure and Tensile Properties of Al-Mn/Al-Si Hybrid Aluminum Alloy Prepared by Electromagnetic Duo-Casting  

Park, Sung-Jin (Dept. of Materials Engineering, Korea Aerospace University)
Li, Tingju (School of Materials Science and Engineering, Dalian University of Technology)
Kim, Chong-Ho (New Materials Research Department, RIST)
Park, Jun-Pyo (New Materials Research Department, RIST)
Chang, Si-Young (Dept. of Materials Engineering, Korea Aerospace University)
Publication Information
Korean Journal of Materials Research / v.22, no.2, 2012 , pp. 97-102 More about this Journal
Abstract
The microstructure and tensile properties of Al-Mn/Al-Si hybrid aluminum alloys prepared by electromagnetic duocasting were investigated. Only the Al-Mn alloy showed the typical cast microstructure of columnar and equiaxed crystals. The primary dendrites and eutectic structure were clearly observed in the Al-Si alloy. There existed a macro-interface of Al-Mn/Al-Si alloys in the hybrid aluminum alloys. The macro-interface was well bonded, and the growth of primary dendrites in Al-Si alloy occurred from the macro-interface. The Al-Mn/Al-Si hybrid aluminum alloys with a well-bonded macro-interface showed excellent tensile strength and 0.2% proof stress, both of which are comparable to those values for binary Al-Mn alloy, indicating that the strength is preferentially dominated by the deformation of the Al-Mn alloy side. However, the degree of elongation was between that of binary Al-Mn and Al-Si alloys. The Al-Mn/Al-Si hybrid aluminum alloys were fractured on the Al-Mn alloy side. This was considered to have resulted from the limited deformation in the Al-Mn alloy side, which led to relatively low elongation compared to the binary Al-Mn alloy.
Keywords
electromagnetic duo-casting; Al-Mn/Al-Si hybrid aluminum alloy; macro-interface; tensile properties;
Citations & Related Records
Times Cited By KSCI : 2  (Citation Analysis)
연도 인용수 순위
1 P. Kazanowshi, M. E. Epler and W. Z. Misiolek, Mater. Sci. Eng., 369, 170 (2004).   DOI   ScienceOn
2 F. Dingfa, N. Honglong and C, Zenhua, Ordnance Mater. Sci. Eng., 24, 65 (2001) (in Chinese).
3 S. Jianbo, L. Jun, Y. Zhiming, C. Zhiquiang and L. Tingju, in Proceedings of the 6th International Conference on Electromagnetic Processing of Materials (Dresden, Germany, October 2009), p595.
4 S. Y. Chang, S. J. Cho, S. K. Hong and D. H. Shin, J. Alloy. Comp., 316, 275 (2001).   DOI   ScienceOn
5 S. Y. Chang, Y. K. Kim, S. K. Hong and D. H. Shin, Mater. Trans., 42, 1035 (2001).   DOI   ScienceOn
6 S. Y. Chang, H. G.. Cho and Y. D. Kim, J. Kor. Powd. Metal. Inst., 14, 354 (2007).   DOI   ScienceOn
7 S. H. Lee and G. J. Lee, Kor. J. Mater. Res., 21(12), 655 (2011) (in Korean).   DOI   ScienceOn
8 O. Yilmaz and H. Celik, J. Mater. Process. Tech., 141, 67 (2003).   DOI   ScienceOn
9 R. Kacar, and M. Acarer, J. Mater. Process. Tech., 152, 91 (2004).   DOI   ScienceOn